School of Material Science and Engineering

Research output

Research output per year 1992 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

• 7627 Article
• 414 Review article
• 332 Conference contribution
• 140 Conference article
• 145 More
  • 42 Chapter
  • 42 Comment/debate
  • 21 Letter
  • 18 Paper
  • 16 Editorial
  • 4 Book
  • 2 Short survey

Research output per year

Research output per year

Search results

• 2024

  A Low-Temperature Ag-Ag Direct Bonding Technology Towards Ten-Thousand-Level Microbumps Arrays Utilizing Plasma-Induced Grown Nanoparticles of Silver Oxide

  Wang, T., Xie, X., Gu, S., Liu, S., Zhao, S., Gao, W., Lin, P., Xu, S., Qu, Z., Wang, Y., Zhao, X. & Huo, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024. Institute of Electrical and Electronics Engineers Inc., (2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

• A Novel Layer Structural Design for Silver-indium Transient Liquid Phase Bonding Technology by Introducing a Diffusion Barrier

  Zhang, D., Zhang, Y., Zhao, S., Song, J., Chen, X., Xu, T., Tian, X., Zhao, X. & Huo, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024. Institute of Electrical and Electronics Engineers Inc., (2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

• Investigation of micro and nanostructure on porous high-entropy alloy surface influences its hydrophobicity

  Wang, M., Zhang, X., Zou, H., Lv, X. & Shu, Q., 2024, Ninth International Conference on Energy Materials and Electrical Engineering, ICEMEE 2023. Aris, I. B. & Zhou, J. (eds.). SPIE, 129790K. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12979).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Nanocrystalline Material 100%
  • High Entropy Alloys 100%
  • Hydrophobicity 100%
  • Contact Angle 66%
  • Phase Structure 66%

• Preparation of 3DOM CoFe₂O₄ nanomaterials and their highly efficient catalysis in the thermal decomposition of AP

  Yang, D., Zhu, F., Wang, Z. & Li, G., 2024, Ninth International Conference on Energy Materials and Electrical Engineering, ICEMEE 2023. Aris, I. B. & Zhou, J. (eds.). SPIE, 129790J. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12979).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Pyrolysis 100%
  • Perchlorate 100%
  • Nanomaterial 100%
  • Macro Porosity 100%
  • Nanocrystalline Material 100%

• Study on the effect of different polysiloxane surfactants on the properties of polyurethane microcellular eelastomers

  Zhao, Z., Jiang, H., Li, X., Su, X., Wu, X., Zhang, X. & Zou, M., 2024, Ninth International Conference on Energy Materials and Electrical Engineering, ICEMEE 2023. Aris, I. B. & Zhou, J. (eds.). SPIE, 129790M. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12979).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Surface Active Agent 100%
  • Polyurethane 100%
  • Polysiloxane 100%
  • Elastomer 50%
  • Density 25%

• TiAM-GAN: Titanium Alloy Microstructure Image Generation Network

  Zhang, Z., Jin, F., Gong, H. & Fan, Q., 2024, Pattern Recognition and Computer Vision - 6th Chinese Conference, PRCV 2023, Proceedings. Liu, Q., Wang, H., Ji, R., Ma, Z., Zheng, W., Zha, H., Chen, X. & Wang, L. (eds.). Springer Science and Business Media Deutschland GmbH, p. 84-96 13 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 14427 LNCS).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Microstructure 100%
  • Image Synthesis 100%
  • Titanium Alloys 100%
  • Density 33%
  • Loss Function 14%
• 2023

  A case study of intermetallic evolutions in a solder joint under electromigration using a novel experiment-simulation combined approach

  Yuan, H., Li, C., Ma, Z., Zhang, H. & Fan, M., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Intermetallics 100%
  • Solder Joint 100%
  • Single Crystal 20%
  • Anode 20%
  • Finite Element Modeling 20%

• A Design Strategy of Lithium Orthosilicate Coating on Micro-Silicon for High Performance Lithium Storage

  Yan, W., Ma, L., Ma, S., Dong, Y., Chen, T., Chen, S., Liu, C., Feng, R., Su, Y. & Li, N., 2023, International Conference on Optoelectronic Information and Functional Materials, OIFM 2023. Fu, Y. & Prakash, K. B. (eds.). SPIE, 127813F. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12781).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Silicon 100%
  • Lithium 100%
  • Solid Electrolyte 20%
  • Density 10%
  • Oxide Compound 10%

• A novel (VNb)80(TaTi)20 refractory high entropy alloy with excellent mechanical properties at the as-cast state

  Wang, C., Han, Q., Wang, B., Sun, S., Xue, Y. & Jin, K., 2023, Ninth International Conference on Mechanical Engineering, Materials, and Automation Technology, MMEAT 2023. Dong, H. & Yu, H. (eds.). SPIE, 128010O. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12801).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Alloy 20 100%
  • Refractory Alloys 100%

• A Thin Film Metallization Process Development for Silicon Nitride Ceramic Substrates in Power Electronics Packaging

  Chen, X., Zhang, D., Song, J., Xu, T., Tian, X., Zhao, X. & Huo, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Thin Films 100%
  • Silicon Nitride 100%
  • Ceramic Substrate 100%
  • Mechanical Strength 30%
  • Silver 30%

• A TiV-rich lightweight medium entropy alloy with excellent specific strength and good strain hardening ability

  Ru, L., Zhua, Y., Sun, S., Wang, B., Xue, Y. & Liang, Y., 2023, Ninth International Conference on Mechanical Engineering, Materials, and Automation Technology, MMEAT 2023. Dong, H. & Yu, H. (eds.). SPIE, 128011Q. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12801).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Mechanical Strength 100%
  • Work Hardening 100%
  • Medium-Entropy Alloy 100%
  • Grain Boundary 66%
  • Cast Condition 50%

• Effect of calcination temperature on the structure and electrochemical performance of single crystal Li-rich materials

  Hao, J., Zhao, J., Chen, L., Su, Y. & Wu, F., 2023, Second International Conference on Energy, Power, and Electrical Technology, ICEPET 2023. Saat, M. S. M. & Reaz, M. B. I. (eds.). SPIE, 127880K. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12788).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Single Crystal 100%
  • Calcination 100%
  • Mechanical Strength 25%
  • Lithium 25%
  • Cathode Material 25%

• Effect of heat treatment on the microstructure and tensile property of hot forged BCC lightweight high entropy alloy

  Hu, X., Dou, B., Cui, J., Sun, S., Wang, B., Wang, L. & Xue, Y., 2023, Ninth International Conference on Mechanical Engineering, Materials, and Automation Technology, MMEAT 2023. Dong, H. & Yu, H. (eds.). SPIE, 128011S. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12801).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Microstructure 100%
  • Tensile Property 100%
  • High-Entropy Alloys 100%
  • Body-Centered Cubic 100%
  • Heat Treatment 100%

• Effect of Y doping on tensile plasticity of Zr-30Nb alloy via powder metallurgy

  Xie, R., Liu, X., Liu, S., Fan, B. & Liu, J., 2023, Ninth International Conference on Mechanical Engineering, Materials, and Automation Technology, MMEAT 2023. Dong, H. & Yu, H. (eds.). SPIE, 128012A. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12801).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Powder Metallurgy 100%
  • Yttrium 50%
  • Zirconium Alloys 50%
  • Corrosion Resistance 25%
  • Hydride 25%

• Effects of Ge addition on the growth of interfacial Ni₃Sn₄ IMC in the Sn58Bi/Ni solder joint: First-principles and Experimental Investigations

  Zhang, S., Ye, Z., Wei, Y., Sheng, B., Dong, Z., Zheng, B. & Zhao, X., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Intermetallics 100%
  • Solder Joint 100%
  • Density 50%
  • Brittleness 12%

• FRAGMENT-DISPERSION CHARACTERISTICS OF UNCOUPLED FRAGMENT ASSEMBLY UNDER INTERNAL EXPLOSIVE LOADING

  Guo, Z. W., Huang, G. Y., Shi, Y. P., Li, X., Chen, P. W. & Feng, S. S., 2023, Exterior Ballistics, Explosion Mechanics, Emerging Technologies, Launch Dynamics, Vulnerability and Survivability. Coghe, F. (ed.). DEStech Publications, p. 767-778 12 p. (Proceedings - 33rd International Symposium on Ballistics, BALLISTICS 2023; vol. 1).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Design Engineering 100%
  • Numerical Model 16%

• Grain morphology transition and its effect on the mechanical properties of laser additive manufactured TiZrVNbAl lightweight high-entropy alloy

  Pan, Y., Liu, S., Dou, B., Sun, S., Wang, B., Liang, Y., Wang, L. & Xue, Y., 2023, Ninth International Conference on Mechanical Engineering, Materials, and Automation Technology, MMEAT 2023. Dong, H. & Yu, H. (eds.). SPIE, 128010P. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12801).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • High-Entropy Alloys 100%
  • High Entropy Alloys 100%
  • Inhibition 50%
  • Laser Additive Manufacturing 50%
  • Three Dimensional Printing 50%

• IMPACT-INDUCED INITIATION AND REACTION OF Ni-Al ENERGETIC STRUCTURAL MATERIALS

  Liu, R., Hu, Q. & Chen, P., 2023, Exterior Ballistics, Explosion Mechanics, Emerging Technologies, Launch Dynamics, Vulnerability and Survivability. Coghe, F. (ed.). DEStech Publications, p. 515-523 9 p. (Proceedings - 33rd International Symposium on Ballistics, BALLISTICS 2023; vol. 1).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Building Material 100%
  • Dynamic Loads 20%
  • Energy Density 20%
  • Scanning Electron Microscopy 20%

• Long-Chain Ionic Liquid Additive Inhibits Dendrite Growth in Lithium Metal Battery

  Guan, M. & Huang, Y., 2023, Proceedings of the 3rd International Symposium on New Energy and Electrical Technology. Cao, W., Hu, C. & Chen, X. (eds.). Springer Science and Business Media Deutschland GmbH, p. 298-303 6 p. (Lecture Notes in Electrical Engineering; vol. 1017 LNEE).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Ionic Liquid 100%
  • Lithium Metal Battery 100%
  • Lithium 100%
  • Battery (Electrochemical Energy Engineering) 16%
  • Film 16%

• Methacrylic acid grafted nanocellulose enhanced light curing 3D printing

  Guo, Q., Cheng, F., Chen, N. & Shao, Z., 2023, Ninth International Conference on Mechanical Engineering, Materials, and Automation Technology, MMEAT 2023. Dong, H. & Yu, H. (eds.). SPIE, 128012T. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12801).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 3D Printing 100%
  • Nanocellulose 100%
  • Methacrylic 100%
  • Carbon Nanofiber 100%
  • Three Dimensional Printing 100%

• Multiplatform Visualization Technology for 3D Scene of High-Viscosity-Materials Mixing Process

  Xinyi, L., De'Er, Y., Wensheng, D., Dinghua, L., Qi, C. & Rongjie, Y., 2023, 2023 IEEE International Conference on Sensors, Electronics and Computer Engineering, ICSECE 2023. Institute of Electrical and Electronics Engineers Inc., p. 1417-1420 4 p. (2023 IEEE International Conference on Sensors, Electronics and Computer Engineering, ICSECE 2023).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 3d Scenes 100%
  • Data Visualization 100%
  • Mixing Process 100%
  • Simulation Model 50%
  • Mobile Device 50%

• NUMERICAL SIMULATION OF THE JET FORMATION CHARACTERISTICS FOR THE MULTI-LAYERED LINER SHAPED CHARGE

  Wang, T., Chen, P., Liu, R., Zhao, C. & Wang, S., 2023, Interior Ballistics, Terminal Ballistics. Coghe, F. (ed.). DEStech Publications, p. 2075-2082 8 p. (Proceedings - 33rd International Symposium on Ballistics, BALLISTICS 2023; vol. 2).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Computer Simulation 100%
  • Shaped Charge 100%
  • Lining 100%
  • Simulation Result 12%
  • Head Speed 12%

• Ru-doping to Enhance Electrochemical Performance of Co-free LiRich Layered Cathode Materials

  Sun, T., Huang, Q., Li, N. & Su, Y., 2023, Second International Conference on Energy, Power, and Electrical Technology, ICEPET 2023. Saat, M. S. M. & Reaz, M. B. I. (eds.). SPIE, 127880L. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12788).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Cathode Material 100%
  • Lithium Ion Battery 40%
  • Energy Density 20%
  • X-Ray Diffraction 20%
  • Cathode 20%

• Study on surge current characteristic of SiC SBD with different solder layer structure

  Hu, Z., Wang, Y., Zhao, X., Huo, Y. & Tang, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Layer Structure 100%
  • Junction Temperature 100%
  • Heat Flux 28%
  • Layer Thickness 14%
  • Strain Energy 14%

• The reliability study on electrochemical migration evaluations for common substrates in power electronics

  Yang, M., Zhang, D., Cao, C., Xu, T., Tian, X., Zhao, X. & Huo, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Nitride 100%
  • Power Electronics 100%
  • Reliability Study 100%
  • Silicon Nitride 100%
  • Electronic Product 66%
• 2022

  A Laser Assisted Bonding Process Design with Silver-indium Transient Liquid Phase Method for the Infrared Detectors Hermetic Packaging

  Song, J., Hu, S., Liu, Y., Ge, A., Zhang, D., Zhao, X. & Huo, Y., 2022, 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Transients 100%
  • Liquid Phase 100%
  • Bonding Process 100%
  • Process Design 100%
  • Indium 100%
  2 Citations (Scopus)

• A non-mydriatic fundus camera designed with two-channel illumination

  Zhang, W., Chang, J., Chen, W., Zhao, X. & Xie, B., 2022, Optics in Health Care and Biomedical Optics XII. Luo, Q., Li, X., Gu, Y. & Zhu, D. (eds.). SPIE, 1232017. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12320).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Stray Light 100%
  • Pupil Diameter 100%
  • Refractive 100%
  • Light Source 100%
  • Health Monitoring 100%

• DAMAGE FAILURE AND SAFETY OF POLYMER BONDED EXPLOSIVE CHARGES UNDER IMPACT LOADING

  Liu, R., Wang, T., Kang, G., Yang, Z., Zhou, Z. & Chen, P., 2022, Emerging Technologies, Explosion Mechanics, Interior Ballistics, Launch Dynamics, Vulnerability and Survivability. Manning, T. G. & Rickert, F. C. (eds.). DEStech Publications, p. 317-339 23 p. (Proceedings - 32nd International Symposium on Ballistics, BALLISTICS 2022; vol. 1).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Ignition 100%
  • Impact Loads 100%
  • Explosive Charge 100%
  • Impact Test 16%
  • Polymer Binder 16%

• Decomposition Kinetics and Cook-off Numerical Simulation of Insensitive Energetic Plasticizer Plasticized Propellants

  Wang, Y. L., Chen, Y. & Liu, Y. F., 2022, Material Science and Engineering - Selected peer-reviwed full text papers from the 9th Annual International Conference on Material Science and Engineering, ICMSE 2021. Hage Chehade, F., Hu, C. & Wang, K. (eds.). Trans Tech Publications Ltd., p. 263-268 6 p. (Key Engineering Materials; vol. 905 KEM).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Computer Simulation 100%
  • Energetics 100%
  • Plasticizer 100%
  • Ignition Temperature 66%
  • Temperature Response 66%

• Design of T22/800H transition joints through thermodynamic and kinetic modeling

  Zhou, C., Lin, Z., Sun, Z. & Yu, X., 2022, International Conference on Mechanical Design and Simulation, MDS 2022. Shi, D. & Wu, G. (eds.). SPIE, 1226133. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12261).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Joints (Structural Components) 100%
  • Chemical Potential 100%
  • Potential Gradient 100%
  • Ferritic Stainless Steel 100%
  • Ferritic Steel 100%

• Finite element and phase field simulation methods for homogenization and electromigration properties of solid-liquid low-temperature welding joints

  Xiong, Z., Zhao, X., Yu, J., Qiao, P., Wei, Y. & Tan, C., 2022, 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Finite Element Method 100%
  • Welding 100%
  • Homogenization 100%
  • Electromigration 100%
  • Density 66%

• Mechanical properties of large-size AlCoCrFeNi2.1 eutectic high-entropy alloy via hot-rolling followed by annealing

  Liu, Z., Xiong, Z., Chen, K. & Cheng, X., 2022, MEMAT 2022 - 2nd International Conference on Mechanical Engineering, Intelligent Manufacturing and Automation Technology. Pan, K. & Moumni, Z. (eds.). VDE VERLAG GMBH, p. 386-389 4 p. (MEMAT 2022 - 2nd International Conference on Mechanical Engineering, Intelligent Manufacturing and Automation Technology).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Mechanical Strength 100%
  • High Entropy Alloys 100%
  • Annealing 75%
  • Ultimate Tensile Strength 75%
  • Yield Stress 75%
  1 Citation (Scopus)

• Microstructure Analysis of Multilayer Graphene Reinforced Flake Titanium Composites

  Yang, Y., Cheng, Z., Zhang, H., Jiao, X., Liu, B. & Zhao, Y., 2022, 2022 3rd International Conference on Clean and Green Energy Engineering, CGEE 2022. Institute of Electrical and Electronics Engineers Inc., p. 21-25 5 p. (2022 3rd International Conference on Clean and Green Energy Engineering, CGEE 2022).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Graphene 100%
  • Titanium 100%
  • Microstructural Analysis 100%
  • Powder 33%
  • Sintering 33%

• Novel Pyrazol-Functional Covalent Organic Framework for Noble-Metal Nanoparticles Immobilization

  Lu, F., Li, S., Chen, J., He, A. & Wang, Y., 2022, 2021 International Conference on Development and Application of Carbon Nanomaterials in Energetic Materials. Gany, A. & Fu, X. (eds.). Springer Science and Business Media Deutschland GmbH, p. 481-493 13 p. (Springer Proceedings in Physics; vol. 276).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Covalent Organic Framework 100%
  • Metal Nanoparticle 100%
  • Precious Metal 100%
  • Catalysis 12%
  • Catalyst Activity 12%

• Preparation and Properties of Nitrocellulose/Viton Based Nano Energetic by Direct Writing

  Jiao, Y., Li, S., Ding, S., Yang, D., Bai, C., Liu, J., Luo, Y. & Li, G., 2022, 2021 International Conference on Development and Application of Carbon Nanomaterials in Energetic Materials. Gany, A. & Fu, X. (eds.). Springer Science and Business Media Deutschland GmbH, p. 341-352 12 p. (Springer Proceedings in Physics; vol. 276).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Hydrogen Bonding 100%
  • Elastic Moduli 100%
  • Ultimate Tensile Strength 100%
  • Fourier Transform Infrared Spectroscopy 100%
  1 Citation (Scopus)

• Preparation of Short Rod Shape CuO_X/GO Nanocomposites and Their Catalysis on AP

  Li, S., Niu, Z., Jiao, Y., Ding, S., Yang, D., Bai, C., Liu, J., Luo, Y. & Li, G., 2022, 2021 International Conference on Development and Application of Carbon Nanomaterials in Energetic Materials. Gany, A. & Fu, X. (eds.). Springer Science and Business Media Deutschland GmbH, p. 385-392 8 p. (Springer Proceedings in Physics; vol. 276).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Catalysis 100%
  • Oxide Nanocomposites 100%
  • Rod 100%
  • Graphene Oxide 100%
  • Nanocomposite 100%

• Research Progress of Nano-combustion Catalyst Based on Graphene Loading Technology and Its Application

  Li, D., Shao, Y., Qi, Z., Zhang, M., Xia, M. & Zhang, X., 2022, 2021 International Conference on Development and Application of Carbon Nanomaterials in Energetic Materials. Gany, A. & Fu, X. (eds.). Springer Science and Business Media Deutschland GmbH, p. 187-199 13 p. (Springer Proceedings in Physics; vol. 276).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Graphene 100%
  • Thermal Conductivity 20%
  • Structural Stability 20%
  • Two Dimensional 20%
  • Specific Surface Area 20%

• Study on the effect of Nb doping on the phase transition temperature of VO₂

  Li, X., Wang, Y., Fan, B., Li, H., Shi, S. & Zheng, B., 2022, 2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control, METMS 2022. Liu, Y. (ed.). SPIE, 122441R. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12244).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Density of States 100%
  • First Principle 100%
  • Hydrothermal Synthesis 100%
  • Density 100%
  • Phase Transition Temperature 100%
  1 Citation (Scopus)
• 2021

  210°C reflow technology study in 3D Packaging

  Sun, L., Dong, Y., Hou, Z., Zhao, X., Huo, Y., Liu, Y. & Liu, Y., 14 Sept 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Solder Joint 100%
  • Brittleness 66%
  • Thermal Expansion 66%
  • Shear Strength 66%
  • Soldering 33%

• Employing Single-Crystal Cobalt Substrates to Control betaSn Grain Orientations in Solder Interconnections

  Li, C., Chang, X., Wang, B., Ma, Z. & Cheng, X., 14 Sept 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Cobalt 100%
  • Single Crystal 100%
  • Grain Orientation 100%
  • Solder Joint 66%
  • Joints (Structural Components) 50%

• Preparation and microwave absorbing properties of Fe₃O₄@C nanoparticles

  Shi, S., Zhou, F., Zhao, X. & Li, H., 2021, 2021 3rd International Academic Exchange Conference on Science and Technology Innovation, IAECST 2021. Institute of Electrical and Electronics Engineers Inc., p. 1003-1010 8 p. (2021 3rd International Academic Exchange Conference on Science and Technology Innovation, IAECST 2021).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Nanoparticle 100%
  • Crystal Structure 20%
  • Dielectric Material 20%
  • Polymerization 20%
  • Calcination 20%
  1 Citation (Scopus)

• Synthesis and rheological properties of amphoteric hydrophobically associating polymer P(AM/AA/AMPS/C₁₈DMAAC)

  Gong, B., Wang, J., Jia, S., Wei, J., Jiang, H., Zhang, D. & Shao, Z., 2021, 2021 3rd International Academic Exchange Conference on Science and Technology Innovation, IAECST 2021. Institute of Electrical and Electronics Engineers Inc., p. 1163-1167 5 p. (2021 3rd International Academic Exchange Conference on Science and Technology Innovation, IAECST 2021).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Monomer 100%
  • Emulsion Polymerization 100%
  • Associating Polymer 100%

• Undercooling and microstructure analysis for the design of low melting point solder

  Pu, L., Huo, Y., Zhao, X., Tu, K. N. & Liu, Y., 8 Apr 2021, 2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021. Institute of Electrical and Electronics Engineers Inc., 9420953. (2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Melting Point 100%
  • Microstructure 100%
  • Joints (Structural Components) 100%
  • Eutectics 100%
  • Nucleation 100%
• 2020

  Deposition of sio2/sic coating on carbon fiber to enhance the oxidation resistance

  Bu, A., Zhang, Y., Xiang, Y., Yang, Y., Chen, W., Cheng, H. & Wang, L., 2020, Materials and Technology of Clean Energy. He, L., Jian, X., Pan, F., Shao, Z., Sun, Z. & Wang, Y. (eds.). Trans Tech Publications Ltd., p. 100-105 6 p. (Materials Science Forum; vol. 999 MSF).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Carbon Fiber 100%
  • Oxidation Resistance 100%
  • Fixed Points 60%
  • Density 20%
  • Plasma Spraying 20%

• High-throughput characterization of composition and performance of titanium alloys based on nanoindentation technology and EPMA

  Gao, Y., Yu, H., Zhou, Y., Zhu, X. & Fan, Q., 2020, Advanced Materials, Processing and Testing Technology II - Selected peer-reviewed full text papers from the 2nd International Conference on Advanced Materials, Processing and Testing Technology, AMPTT 2020. Fang, D. & Kuang, T. (eds.). Trans Tech Publications Ltd., p. 20-26 7 p. (Key Engineering Materials; vol. 871 KEM).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Nanoindentation 100%
  • Titanium Alloys 100%
  • Electron Microprobe 100%
  • Alloy Composition 100%
  • Aluminum 33%
  1 Citation (Scopus)

• Microstructure and mechanical properties of W-high entropy alloy composite by hot swaging

  Jian, R., Zhou, S. & Xue, Y., 2020, Advanced Materials, Processing and Testing Technology II - Selected peer-reviewed full text papers from the 2nd International Conference on Advanced Materials, Processing and Testing Technology, AMPTT 2020. Fang, D. & Kuang, T. (eds.). Trans Tech Publications Ltd., p. 3-8 6 p. (Key Engineering Materials; vol. 871 KEM).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Microstructure 100%
  • High-Entropy Alloys 100%
  • Swaging 100%
  • Mechanical Strength 100%
  • High Entropy Alloys 100%

• Synthesis and crystal structures of Dibromo-Triazoles and their Amination

  Wang, Z., Li, Y., Niu, H., Yu, H. & Pang, S., 2020, Materials Science and Industrial Applications II. Fang, Z. G. (ed.). Trans Tech Publications Ltd., p. 93-103 11 p. (Materials Science Forum; vol. 1001 MSF).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Triazole 100%
  • Triazole Derivative 100%
  • Electrospray Ionization 50%
  • Heterocyclic Compound 8%
• 2019

  A novel display technology-perovskite quantum dot display with blue OLEDs

  Duan, M., Li, D., Hu, Z., Peng, W., Wu, Y., Yin, Y., He, B., Jiang, P., Jiang, F., Shi, L., Zhong, H., Chen, S. J., Lee, C. Y. & Zhang, X., 2019, 26th International Display Workshops, IDW 2019. International Display Workshops, p. 668-671 4 p. (Proceedings of the International Display Workshops; vol. 2).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Perovskite Quantum Dot 100%
  • Organic Light-Emitting Diode 50%
  • Backlight 50%
  • Inkjet Printing Technology 50%
  • Perovskite 50%
  1 Citation (Scopus)

• Dense to columnar microstructure evolution of Ba(Mg1/3Ta2/3)O3 TBCs through tailoring of suspension plasma spray conditions

  Hou, H., Veilleux, J., Gitzhofer, F. & Wang, Q., 2019, International Thermal Spray Conference and Exposition, ITSC 2019: New Waves of Thermal Spray Technology for Sustainable Growth. Azarmi, F., Lau, Y., Veilleux, J., Widener, C., Toma, F., Koivuluoto, H., Balani, K., Li, H. & Shinoda, K. (eds.). ASM International, p. 178-184 7 p. (Proceedings of the International Thermal Spray Conference; vol. 2019-May).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Plasma Spraying 100%
  • Titanium Alloys 100%
  • Surface Roughness 100%
  • Thermal Barrier Coatings 100%
  • Atomizer Nozzle 100%

• Effect of phase distribution on reaction behaviors of PTFE/AL reactive materials

  Zhang, S., Liu, J., Li, S., He, C. & Feng, X., 2019, Terminal Ballistics, Explosion Mechanics, Vulnerability and Survivability. Saraswat, V. K., Reddy, G. S. & Woodley, C. (eds.). DEStech Publications Inc., p. 2005-2013 9 p. (Proceedings - 31st International Symposium on Ballistics, BALLISTICS 2019; vol. 2).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Reactive Material 100%
  • Aluminum 100%
  • Density (Specific Gravity) 100%
  • Polytetrafluoroethylene 100%
  • Energy Density 50%