In May 2020, he joined the department of Electronic Packaging Technology of Beijing Institute of Technology, and now serves as a pre-appointed associate professor, doctoral supervisor, and head of university-level experimental platform for heterogeneous integration of micro and nano materials.
Taught Courses:
1. Microsystem and its packaging technology;
2. Semiconductor physics;
3. Mathematical equations and special functions
Undertaking Project:
1. Special technology research on reliability improvement of integrated circuit reverse welding package devices;
2. Special technical research of silver based isotropic and anisotropic conductive adhesive;
3. Academic Start-up Program for Young teachers Dr. Huo has long been committed to the research of silicon carbide new power electronic devices, VECSEL high-power laser chip manufacturing and packaging technology, and has high academic attainments in the field of low-temperature non-destructive heterogeneous integration technology. The ultra-thin silver indium transient liquid phase technology is the key technology of the latest generation of silicon carbide new power electronic devices and VECSEL high power laser chip manufacturing package. The mechanism of solid solution softening and twin plastic deformation of silver-based alloys was studied and discovered. By combining density functional theory (DFT) and Lewis weak acid-base theory (HSAB), the excellent vulcanization resistance of silver-indium alloys was found and explained. In the past 5 years, he has published 10 academic papers in high-level SCI journals, among which the papers published as the first or corresponding author include Scripta Materialia, Optics Letter, Materials Science and Engineering: A and other top journals, authorized PCT international invention patent 1, as a reviewer of Optics Express, Applied Optics, IEEE Transaction of CMPT and other famous international journals.

1. High power optoelectronic device packaging;
2. Integration process of heterogeneous materials;
3. Low temperature transient liquid micro-nano interconnect;
4. High resolution transmission electron microscopy material characterization;

2008.09 -- 2012.07 School of Materials Science and Engineering, Beijing Institute of Technology, Bachelor degree 2012.09-2014.03 University of California, Irvine (UC Irvine), Master student
2014.03-2017.06 University of California, Irvine (UC Irvine), PhD candidate

2017.06-2020.05 Postdoctoral Researcher, University of California, Irvine (UC Irvine)
May 2020.05-present School of Materials Science and Engineering, Beijing Institute of Technology, Pre-appointed Associate Professor/Special Researcher

1. Roozbeh Sheikhi; Yongjun Huo*; Frank G. Shi; Chin C. Lee; Low Temperature VECSEL-to-Diamond Heterogeneous Integration with Ag-In Spinodal Nanostructured Layer, Scripta Materialia, 2020, 194(113628): 1-4.
2. Yongjun Huo*; Chun Yu Cho; Kai Feng Huang; Yung Fu Chen; Chin C. Lee; Exploring the DBR superlattice effect on the thermal performance of a VECSEL with the finite element method, Optics Letter, 2019, 44(2): 327-330.
3. Yongjun Huo*; Jiaqi Wu; Chin C. Lee; Solid solution softening and enhanced ductility in concentrated FCC silver solid solution alloys, Materials Science & Engineering A, 2018, 729: 208-218.
4. Yongjun Huo*; Jiaqi Wu; Chin C. Lee; Study of Anti-Tarnishing Mechanism in Ag-In Binary System by Using Semi-Quantum-Mechanical Approach, Journal of The Electrochemical Society, 2017, 164(7): C418-C427.
5. Yongjun Huo*; Chin C. Lee; The growth and stress vs. strain characterization of the silver solid solution phase with indium, Journal of Alloys and Compounds， 2015, 661: 372-379.