Abstract
The undercooling in solidification of eutectic Sn37Pb, Sn3.5Ag, Sn58Bi and Sn52In solders was inspected. Sn37Pb and Sn58Bi have a similar undercooling, around 16°C, and Sn52In has the lowest undercooling of around 3°C. The larger the undercooling, the higher the barrier to nucleation. A small undercooling is favorable for solder joint array to solidify at the same time in chip stacking on a packaging substrate.
Original language | English |
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Title of host publication | 2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781728181769 |
DOIs | |
Publication status | Published - 8 Apr 2021 |
Event | 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 - Chengdu, China Duration: 8 Apr 2021 → 11 Apr 2021 |
Publication series
Name | 2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 |
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Conference
Conference | 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 |
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Country/Territory | China |
City | Chengdu |
Period | 8/04/21 → 11/04/21 |
Keywords
- Lead-free solder
- electronic packaging
- nucleation of phase transformations
- undercooling
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Pu, L., Huo, Y., Zhao, X., Tu, K. N., & Liu, Y. (2021). Undercooling and microstructure analysis for the design of low melting point solder. In 2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 Article 9420953 (2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM50988.2021.9420953