Undercooling and microstructure analysis for the design of low melting point solder

Li Pu, Yongjun Huo, Xiuchen Zhao, K. N. Tu, Yingxia Liu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The undercooling in solidification of eutectic Sn37Pb, Sn3.5Ag, Sn58Bi and Sn52In solders was inspected. Sn37Pb and Sn58Bi have a similar undercooling, around 16°C, and Sn52In has the lowest undercooling of around 3°C. The larger the undercooling, the higher the barrier to nucleation. A small undercooling is favorable for solder joint array to solidify at the same time in chip stacking on a packaging substrate.

Original languageEnglish
Title of host publication2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728181769
DOIs
Publication statusPublished - 8 Apr 2021
Event5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 - Chengdu, China
Duration: 8 Apr 202111 Apr 2021

Publication series

Name2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021

Conference

Conference5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021
Country/TerritoryChina
CityChengdu
Period8/04/2111/04/21

Keywords

  • Lead-free solder
  • electronic packaging
  • nucleation of phase transformations
  • undercooling

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Pu, L., Huo, Y., Zhao, X., Tu, K. N., & Liu, Y. (2021). Undercooling and microstructure analysis for the design of low melting point solder. In 2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 Article 9420953 (2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM50988.2021.9420953