@inproceedings{f9398ec3649443c1b8daa350fc0f477d,
title = "Undercooling and microstructure analysis for the design of low melting point solder",
abstract = "The undercooling in solidification of eutectic Sn37Pb, Sn3.5Ag, Sn58Bi and Sn52In solders was inspected. Sn37Pb and Sn58Bi have a similar undercooling, around 16°C, and Sn52In has the lowest undercooling of around 3°C. The larger the undercooling, the higher the barrier to nucleation. A small undercooling is favorable for solder joint array to solidify at the same time in chip stacking on a packaging substrate.",
keywords = "Lead-free solder, electronic packaging, nucleation of phase transformations, undercooling",
author = "Li Pu and Yongjun Huo and Xiuchen Zhao and Tu, {K. N.} and Yingxia Liu",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 ; Conference date: 08-04-2021 Through 11-04-2021",
year = "2021",
month = apr,
day = "8",
doi = "10.1109/EDTM50988.2021.9420953",
language = "English",
series = "2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021",
address = "United States",
}