@inproceedings{0fc2b41858ff47af82dd21f30964386a,
title = "Study on surge current characteristic of SiC SBD with different solder layer structure",
abstract = "In this paper, surge current characteristic of SiC SBD with different solder layer structure and the dynamic trend of junction temperature during surge current were studied by FloTHERM. It was found that different surge current and highest junction temperature difference affect surge characteristic of SiC SBD device with different solder materials and thicknesses. The SiC SBD device packaged by nanosilver has the lowest junction temperature under the same surge current due to the better heat difussion path and lager heat flux than the others. The maximum junction temperature of SiC SBD device decrease firstly and then increase with increasing solder layer thickness from 20μm to 120μm, which may be caused by volume strain energy. Meanwhile, it was seen that the highest junction temperature exhibits 1ms delay compared to the peak surge current of 5ms because the heat generated at 5ms is more than the heat flux. Based on the variation of highest junction temperature difference, the junction temperature change is related to device working state that includes unipolar conduction and bipolar conduction. It provides simulation theoretical guidance for the effect of different solder materials and thicknesses on SiC SBD devices under surge current in the future.",
keywords = "FloTHERM simulation, Junction temperature, SiC SBD, Solder layer structure, Surge current",
author = "Zheng Hu and Yinjie Wang and Xiuchen Zhao and Yongjun Huo and Yidan Tang",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 24th International Conference on Electronic Packaging Technology, ICEPT 2023 ; Conference date: 08-08-2023 Through 11-08-2023",
year = "2023",
doi = "10.1109/ICEPT59018.2023.10492301",
language = "English",
series = "2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023",
address = "United States",
}