Research output per year
Research output per year
Search results
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2025
Boosting Thermal Generation in Cation-Exchanged Transparent MXene Composite Films with Hierarchical Wrinkled Structure
Li, S., Liu, Z., Pan, X., Wang, H., Li, M., Hu, J., Ding, Y., Sun, Y. & Chen, Z., 29 Jan 2025, In: ACS Applied Materials and Interfaces. 17, 4, p. 6793-6804 12 p.Research output: Contribution to journal › Article › peer-review
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Reconfigurable Inverter Based on Ferroelectric-Gating MoS2 Field-Effect Transistors toward In-Memory Logic Operations
Dong, S., Li, M., Liu, Z., Hu, J., Ding, Y., Sun, Y. & Chen, Z., 2025, (Accepted/In press) In: Journal of Physical Chemistry Letters. p. 1847-1854 8 p.Research output: Contribution to journal › Article › peer-review
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2024
An Electrothermal Micromirror Array Integrated with Thermal Convection-Based Mirror Position Sensors
Ren, A., Ding, Y., Yang, H., Pan, T., Zhang, Z. & Xie, H., 2024, IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024. Institute of Electrical and Electronics Engineers Inc., p. 170-173 4 p. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Citation (Scopus) -
A Photosensitive Polyimide-SiO2Bimorph based Electrothermal Micromirror with High Impact Resistance
Yang, H., Ren, A., Ding, Y., Lu, Y., Pan, T., Wang, X. & Xie, H., 2024, IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024. Institute of Electrical and Electronics Engineers Inc., p. 729-732 4 p. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A polymer trench filling based silicon isolation technique and its application to two-axis scanning comb-drive micromirrors
Cao, Y., Ding, Y., wang, H., Yan, Y., Qi, Q., Jia, Y., Wu, Y. & Xie, H., 1 May 2024, In: Sensors and Actuators A: Physical. 370, 115256.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
MoS2-WS2Heterostructure-Enabled Optoelectronic Synaptic Diode
Li, M., Ding, Y., Hu, J., Zhao, H. & Sun, Y., 2024, 2024 IEEE 17th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2024. Ye, F., Zhu, X. & Tang, T. A. (eds.). Institute of Electrical and Electronics Engineers Inc., (2024 IEEE 17th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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2023
A low-cost spin-on-glass (SOG) liner deposited by vacuum-assisted spin coating technique for via-last ultra-high aspect ratio through-silicon vias
Chen, X., Ding, Y., Zhang, Z., Xiao, L., Wang, H. & Chen, Z., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A Novel Liner Formation Strategy for Double-sided Through-silicon-via (TSV) Process
Hao, Y., Ding, Y., Yang, B., Pan, X., Chen, Z. & Zhang, Z., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A robust lateral shift free (LSF) electrothermal micromirror with flexible multimorph beams
Yang, H., Ren, A., Ding, Y., Xiao, L., Pan, T., Yan, Y., Jiao, W. & Xie, H., Dec 2023, In: Microsystems and Nanoengineering. 9, 1, 108.Research output: Contribution to journal › Article › peer-review
Open Access9 Citations (Scopus) -
Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology
Dong, H., Ding, Y., Wang, H., Pan, X., Zhou, M. & Zhang, Z., Jun 2023, In: Micromachines. 14, 6, 1251.Research output: Contribution to journal › Article › peer-review
Open Access1 Citation (Scopus) -
Dynamic dual-functional optical wave plate based on phase-change meta-molecules
Cai, Z., Ding, Y., Chen, Z., Zheng, Z. & Ding, F., 2023, In: Optics Letters. 48, 14, p. 3685-3688 4 p.Research output: Contribution to journal › Article › peer-review
4 Citations (Scopus) -
Enabling Low-k Liner in Ultra-high Aspect Ratio TSVs by the Timing of Vacuum Treatment in the Vacuum-assisted Spin-coating Technique
Zhang, Z., Chen, Z., Yang, B., Hao, Y., Su, Y. & Ding, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Citation (Scopus) -
Ferroelectric-Gated All 2D Field-Effect Transistors with Sub-60 mV/dec Subthreshold Swing
Liu, Z., Sun, Y., Ding, Y., Li, M., Liu, X., Liu, Z. & Chen, Z., 3 Aug 2023, In: Journal of Physical Chemistry Letters. 14, 30, p. 6784-6791 8 p.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
Flexible MXene/Ag nanowires composite film for high-performance electromagnetic shielding
Li, S., Sun, Y., Liu, Z., Ding, Y. & Chen, Z., 2023, 7th International Symposium on Electromagnetic Compatibility, ISEMC 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Symposium on Electromagnetic Compatibility).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Citation (Scopus) -
Heterostructured MXene/Si Photodiodes With Sub-1-nm h-BN Blocking Layers for Suppressing Dark Current
Liu, Z., Li, M., Liu, Z., Sun, Y., Ding, Y. & Chen, Z., 1 Mar 2023, In: IEEE Electron Device Letters. 44, 3, p. 476-479 4 p.Research output: Contribution to journal › Article › peer-review
5 Citations (Scopus) -
Integrating surface and interface engineering to improve optoelectronic performance and environmental stability of MXene-based heterojunction towards broadband photodetection
Liu, Z., Li, M., Sun, Y., Wang, H., Chen, H., Tian, Y., Wang, H., Ding, Y. & Chen, Z., Jul 2023, In: Nano Research. 16, 7, p. 10148-10155 8 p.Research output: Contribution to journal › Article › peer-review
8 Citations (Scopus) -
Modeling and Characterization of Annealing-Induced Cu Protrusion of TSVs with Polyimide Liner Considering Diffusion Creep Behavior
Yang, B., Ding, Y., Cheng, Z., Ren, A., Xiao, L., Yan, Y., Zhang, Z. & Chen, Z., 1 Feb 2023, In: IEEE Transactions on Electron Devices. 70, 2, p. 695-701 7 p.Research output: Contribution to journal › Article › peer-review
9 Citations (Scopus) -
Phase-change metasurface for switchable waveplates
Cai, Z., Ding, Y. & Chen, Z., 2023, AOPC 2022: Optoelectronics and Nanophotonics. Cheng, B., Guo, J. & Qian, S. (eds.). SPIE, 1255604. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12556).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Tailoring Neuroplasticity in a Ferroelectric-Gated Multi-Terminal Synaptic Transistor by Bi-Directional Modulation for Improved Pattern Edge Recognition
Li, M., Liu, Z., Sun, Y., Ding, Y., Chen, H., Zhang, W., Liu, Z., Liu, X., Wang, H. & Chen, Z., 9 Nov 2023, In: Advanced Functional Materials. 33, 46, 2307986.Research output: Contribution to journal › Article › peer-review
6 Citations (Scopus) -
混合介质层类同轴硅通孔等效电路模型的建立与验证
Translated title of the contribution: Establishment and Verification of Equivalent Circuit Model for Coaxially-Shielded TSV with Mixed Dielectric LayerWang, H., Cai, Z., Wu, Z., Wang, Z. & Ding, Y., Jun 2023, In: Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology. 43, 6, p. 640-648 9 p.Research output: Contribution to journal › Article › peer-review
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2022
A Ka-band calibratable phased-array front-end chip with high element-consistency
Sun, S., Li, A., Ding, Y., Chen, Z., Wang, W., Jiang, S., Chen, Z. & Chi, B., Dec 2022, In: Science China Information Sciences. 65, 12, 229401.Research output: Contribution to journal › Letter › peer-review
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Anisotropic electrical properties of aligned PtSe2 nanoribbon arrays grown by a pre-patterned selective selenization process
Wang, H., Liu, Z., Sun, Y., Ping, X., Xu, J., Ding, Y., Hu, H., Xie, D. & Ren, T., May 2022, In: Nano Research. 15, 5, p. 4668-4676 9 p.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
Coprime Nested Arrays for DOA Estimation: Exploiting the Nesting Property of Coprime Array
Peng, Z., Ding, Y., Ren, S., Wu, H. & Wang, W., 2022, In: IEEE Signal Processing Letters. 29, p. 444-448 5 p.Research output: Contribution to journal › Article › peer-review
27 Citations (Scopus) -
Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration
Chen, X., Chen, Z., Xiao, L., Hao, Y., Wang, H., Ding, Y. & Zhang, Z., Jul 2022, In: Micromachines. 13, 7, 1147.Research output: Contribution to journal › Article › peer-review
Open Access12 Citations (Scopus) -
Programmable van-der-Waals heterostructure-enabled optoelectronic synaptic floating-gate transistors with ultra-low energy consumption
Sun, Y., Li, M., Ding, Y., Wang, H., Wang, H., Chen, Z. & Xie, D., Oct 2022, In: InfoMat. 4, 10, e12317.Research output: Contribution to journal › Article › peer-review
Open Access79 Citations (Scopus) -
Recent progress in metasurface-enabled optical waveplates
Deng, Y., Cai, Z., Ding, Y., Bozhevolnyi, S. I. & Ding, F., 1 May 2022, In: Nanophotonics. 11, 10, p. 2219-2244 26 p.Research output: Contribution to journal › Review article › peer-review
Open Access63 Citations (Scopus) -
Supplementary coprime array with enhanced DOFs exploiting hole filling strategy based on the difference and sum coarray
Peng, Z., Ding, Y., Ren, S., Wang, W. & Gu, W., Mar 2022, In: Digital Signal Processing: A Review Journal. 121, 103325.Research output: Contribution to journal › Article › peer-review
13 Citations (Scopus) -
Ultra-Deep Annular Cu Through-Silicon-Vias Fabricated Using Single-Sided Process
Xiao, L., Ding, Y., Su, Y., Zhang, Z., Yan, Y., Chen, Z. & Xie, H., 1 Mar 2022, In: IEEE Electron Device Letters. 43, 3, p. 426-429 4 p.Research output: Contribution to journal › Article › peer-review
8 Citations (Scopus) -
2021
A 25-35 GHz 5-bit digital attenuator with low RMS amplitude error and low phase variation in 65 nm CMOS
Li, A., Ding, Y., Chen, Z. & Chi, B., 2021, In: IEICE Electronics Express. 16, 15, 20190394.Research output: Contribution to journal › Article › peer-review
Open Access2 Citations (Scopus) -
A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor in Through-Silicon-Via
Zhang, Z., Ding, Y., Yang, B., Ren, A. & Chen, Z., 2021, IEEE International 3D System Integration Conference, 3DIC 2021. Institute of Electrical and Electronics Engineers Inc., (IEEE International 3D System Integration Conference, 3DIC 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Citation (Scopus) -
An All-Wet, Low Cost RDL Fabrication Process with Electroless Plated Seed/Barrier Layers
Cai, Z., Ding, Y., Wu, Z., Zhang, Z., Su, Y. & Chen, Z., 6 Jul 2021, 2021 IEEE International Interconnect Technology Conference, IITC 2021. Institute of Electrical and Electronics Engineers Inc., (2021 IEEE International Interconnect Technology Conference, IITC 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Citation (Scopus) -
BCB介质层同轴TSV的热力学仿真分析
Translated title of the contribution: Thermodynamics Simulation and Analysis of Coaxial TSV with BCB Dielectric LayerDing, Y., Wu, Z., Yang, B. & Yang, H., Jan 2021, In: Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology. 41, 1, p. 65-69 5 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
Development of Cu Seed Layers in Ultra-High Aspect Ratio Through-Silicon-Vias (TSVs) with Small Diameters
Zhang, Z., Ding, Y., Xiao, L., Cai, Z., Yang, B., Wu, Z., Su, Y. & Chen, Z., 2021, Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc., p. 1904-1909 6 p. (Proceedings - Electronic Components and Technology Conference; vol. 2021-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
8 Citations (Scopus) -
Dual-Functional Optical Waveplates Based on Gap-Surface Plasmon Metasurfaces
Cai, Z., Deng, Y., Wu, C., Meng, C., Ding, Y., Bozhevolnyi, S. I. & Ding, F., 4 Jun 2021, In: Advanced Optical Materials. 9, 11, 2002253.Research output: Contribution to journal › Article › peer-review
Open Access23 Citations (Scopus) -
Enabling continuous Cu seed layer for deep through-silicon-vias with high aspect ratio by sequential sputtering and electroless plating
Zhang, Z., Ding, Y., Xiao, L., Cai, Z., Yang, B., Chen, Z. & Xie, H., Oct 2021, In: IEEE Electron Device Letters. 42, 10, p. 1520-1523 4 p.Research output: Contribution to journal › Article › peer-review
15 Citations (Scopus) -
Flexible Broadband Photodetectors Enabled by MXene/PbS Quantum Dots Hybrid Structure
Sun, Y., Liu, Z., DIng, Y. & Chen, Z., 1 Dec 2021, In: IEEE Electron Device Letters. 42, 12, p. 1814-1817 4 p.Research output: Contribution to journal › Article › peer-review
16 Citations (Scopus) -
Mixed-Dimensional Van der Waals Heterostructures Enabled Optoelectronic Synaptic Devices for Neuromorphic Applications
Sun, Y., Ding, Y. & Xie, D., 18 Nov 2021, In: Advanced Functional Materials. 31, 47, 2105625.Research output: Contribution to journal › Review article › peer-review
58 Citations (Scopus) -
Optically stimulated synaptic transistor based on MoS2/quantum dots mixed-dimensional heterostructure with gate-tunable plasticity
Sun, Y., Ding, Y., Xie, D., Xu, J., Sun, M., Yang, P. & Zhang, Y., 1 Apr 2021, In: Optics Letters. 46, 7, p. 1748-1751 4 p.Research output: Contribution to journal › Article › peer-review
13 Citations (Scopus) -
Optogenetics-Inspired Neuromorphic Optoelectronic Synaptic Transistors with Optically Modulated Plasticity
Sun, Y., Ding, Y., Xie, D., Xu, J., Sun, M., Yang, P. & Zhang, Y., 18 Jun 2021, In: Advanced Optical Materials. 9, 12, 2002232.Research output: Contribution to journal › Article › peer-review
39 Citations (Scopus) -
Paper-based flexible broadband photodetectors functionalized by PbS quantum dots/Carbon nanotube networks hybrid structure
Sun, Y., Liu, Z. & DIng, Y., 2021, 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021. Institute of Electrical and Electronics Engineers Inc., p. 37-38 2 p. (2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Phase-change metasurface for switchable vector vortex beam generation
Cai, Z., Wu, C., Jiang, J., Ding, Y., Zheng, Z. & Ding, F., 20 Dec 2021, In: Optics Express. 29, 26, p. 42762-42771 10 p.Research output: Contribution to journal › Article › peer-review
Open Access19 Citations (Scopus) -
Reconfigurable optical memory based on MoS2/QDs mixed-dimensional van der Waals heterostructure
Sun, Y., Ding, Y., Xie, D., Sun, M., Xu, J., Yang, P., Zhang, Y. & Ren, T., Apr 2021, In: 2D Materials. 8, 2, 025021.Research output: Contribution to journal › Article › peer-review
15 Citations (Scopus) -
Stiffness-Tunable Microstructures Based on Electrothermal Bimorph Beams
Xiao, L., Ding, Y., Wang, P., Yang, H. & Xie, H., 25 Jan 2021, 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021. Institute of Electrical and Electronics Engineers Inc., p. 79-82 4 p. 9375223. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2021-January).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Study on atomic migration of copper through-silicon-vias with Bosch scallops
Cheng, Z., Ding, Y., Xiao, L., Yang, B. & Chen, Z., Aug 2021, In: Microelectronics Reliability. 123, 114178.Research output: Contribution to journal › Article › peer-review
8 Citations (Scopus) -
混合介质层类同轴垂直硅通孔的高频性能研究
Translated title of the contribution: Study on High Frequency Characterizations of Coaxially Shielded TSV with Mixed Dielectric LayerDing, Y., Wang, Y., Xiao, L., Wang, Q. & Chen, Z., Oct 2021, In: Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology. 41, 10, p. 1103-1108 6 p.Research output: Contribution to journal › Article › peer-review
4 Citations (Scopus) -
2020
A Fully Integrated K-Band Dual Down-Conversion Receiver for Radar Applications in 90 nm CMOS
Li, A., Lin, M., Chi, B., Ding, Y., Song, Z., Chen, Z., Sun, S., Li, Y., Wu, Y., Wang, Z. & Chen, Z., 2020, In: IEEE Access. 8, p. 19576-19589 14 p., 8964296.Research output: Contribution to journal › Article › peer-review
Open Access2 Citations (Scopus) -
A Low-Voltage, Low-Current, Digital-Driven MEMS Mirror for Low-Power LiDAR
Wang, D., Thomas, L., Koppal, S., Ding, Y. & Xie, H., Aug 2020, In: IEEE Sensors Letters. 4, 8, 9131806.Research output: Contribution to journal › Article › peer-review
25 Citations (Scopus) -
Analog-controlled light microshutters based on electrothermal actuation for smart windows
Xiao, L., Ding, Y., Wang, P. & Xie, H., 26 Oct 2020, In: Optics Express. 28, 22, p. 33106-33122 17 p.Research output: Contribution to journal › Article › peer-review
Open Access15 Citations (Scopus) -
A Novel silicon-Air-silicon through-silicon-via structure realized using double-side partially overlapping etching
Zhang, Z., Ding, Y., Chen, Z., Wu, Y. & Gong, X., Oct 2020, In: IEEE Electron Device Letters. 41, 10, p. 1544-1547 4 p., 9171906.Research output: Contribution to journal › Article › peer-review
8 Citations (Scopus) -
Coupled Thermo-Mechanical analysis of 3D ICs Based on an Equivalent Modeling Methodology with Sub-Modeling
Cheng, Z., Ding, Y., Zhang, Z., Zhou, M. & Chen, Z., 2020, In: IEEE Access. 8, p. 14146-14154 9 p., 8960386.Research output: Contribution to journal › Article › peer-review
Open Access15 Citations (Scopus)
