Abstract
To improve high-frequency characteristics of Through Silicon Via (TSV) interposer in T/R modules, a coaxially shielded TSV with mixed dielectric layer was proposed in this paper, involving novel structure and simple fabrication process. The parameters such as the number of ground TSV, the diameter of TSV, and the thickness of the mixed dielectric layer were simulated and optimized. Compared with traditional coaxial TSV, the coaxially shielded TSV with mixed dielectric layer shows excellent RF transmission performance including return loss, insertion loss and crosstalk in 1~45 GHz frequency range.
| Translated title of the contribution | Study on High Frequency Characterizations of Coaxially Shielded TSV with Mixed Dielectric Layer |
|---|---|
| Original language | Chinese (Traditional) |
| Pages (from-to) | 1103-1108 |
| Number of pages | 6 |
| Journal | Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology |
| Volume | 41 |
| Issue number | 10 |
| DOIs | |
| Publication status | Published - Oct 2021 |