An Electrothermal Micromirror Array Integrated with Thermal Convection-Based Mirror Position Sensors

Anrun Ren, Yingtao Ding*, Hengzhang Yang, Teng Pan, Ziyue Zhang, Huikai Xie*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

A novel electrothermal micromirror array integrated with thermal convection-based mirror position sensors is proposed, in which a heater is integrated on the mirror plate to generate a temperature distribution that will be changed by the movement of the mirror plate. The temperature change is then picked up by the thermistors integrated on the substrate. Both the displacement and the tip-tilt angle can be detected. A 3×3 micromirror array has been successfully fabricated. Experiments show an average sensitivity value of 8.6 mV/μm in the displacement range of 50 μm to 150 μm, and an average sensitivity of 95.5 mV/° in the angular scan range of 2° to 10°.

Original languageEnglish
Title of host publicationIEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages170-173
Number of pages4
ISBN (Electronic)9798350357929
DOIs
Publication statusPublished - 2024
Event37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024 - Austin, United States
Duration: 21 Jan 202425 Jan 2024

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024
Country/TerritoryUnited States
CityAustin
Period21/01/2425/01/24

Keywords

  • Thermal convection
  • micromirror array
  • mirror plate position sensor

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