An Electrothermal Micromirror Array Integrated with Thermal Convection-Based Mirror Position Sensors

Anrun Ren, Yingtao Ding*, Hengzhang Yang, Teng Pan, Ziyue Zhang, Huikai Xie*

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

A novel electrothermal micromirror array integrated with thermal convection-based mirror position sensors is proposed, in which a heater is integrated on the mirror plate to generate a temperature distribution that will be changed by the movement of the mirror plate. The temperature change is then picked up by the thermistors integrated on the substrate. Both the displacement and the tip-tilt angle can be detected. A 3×3 micromirror array has been successfully fabricated. Experiments show an average sensitivity value of 8.6 mV/μm in the displacement range of 50 μm to 150 μm, and an average sensitivity of 95.5 mV/° in the angular scan range of 2° to 10°.

源语言英语
主期刊名IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024
出版商Institute of Electrical and Electronics Engineers Inc.
170-173
页数4
ISBN(电子版)9798350357929
DOI
出版状态已出版 - 2024
活动37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024 - Austin, 美国
期限: 21 1月 202425 1月 2024

出版系列

姓名Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

会议

会议37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024
国家/地区美国
Austin
时期21/01/2425/01/24

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