Calculated based on number of publications stored in Pure and citations from Scopus
20012023

Research activity per year

Network

Yanjun Li

  • Norwegian University of Science and Technology

External person

Tangsheng Chen

  • Nanjing Electronic Devices Institute
  • National Key Lab. of Monolithic Integrated Circuits and Modules
  • National Key Laboratory of Monolithic Integrated Circuits and Modules
  • Science and Technology on Monolithic Integrated Circuits and Modules Laboratory

External person

Yuan Zheng

  • Nanjing Electronic Devices Institute
  • Nanjing Guobo Electronics Co., Ltd

External person

Weibin Zheng

  • Nanjing Electronic Devices Institute
  • Science and Technology on Monolithic Integrated Circuits and Modules Laboratory

External person

Fuxiao Li

  • Nanjing Electronic Devices Institute

External person

Xiaopeng Li

  • Nanjing Electronic Devices Institute

External person

Kai Shao

  • Nanjing Electronic Devices Institute

External person

Xinyu Chen

  • Nanjing Guobo Electronics Co., Ltd
  • Nanjing Electronic Devices Institute

External person

Jian Wu

  • Nanjing Guobo Electronics Co., Ltd
  • Nanjing Electronic Devices Institute

External person

Shenbao Jin

  • Nanjing University of Science and Technology

External person

Eva A. Mørtsell

  • Norwegian University of Science and Technology

External person

Youtao Zhang

  • Nanjing Guobo Electronics Co., Ltd
  • Science and Technology on Monolithic Integrated Circuits and Modules Laboratory
  • Nanjing Electronic Devices Institute

External person

Lei Yang

  • Nanjing Guobo Electronics Co., Ltd
  • Nanjing Electronic Devices Institute

External person

Gang Sha

  • Nanjing University of Science and Technology

External person

Shichang Zhong

  • National Key Laboratory of Monolithic Integrated Circuits and Modules
  • Science and Technology on Monolithic Integrated Circuits and Modules Laboratory
  • Nanjing Electronic Devices Institute

External person

Weibo Wang

  • Nanjing Electronic Devices Institute
  • Southeast University, Nanjing
  • Science and Technology on Monolithic Integrated Circuits and Modules Laboratory

External person

Xuan Ai

  • Nanjing Guobo Electronics Co., Ltd
  • Nanjing Electronic Devices Institute

External person

Chen Chen

  • Nanjing Electronic Devices Institute
  • National Key Laboratory of Monolithic Integrated Circuits and Modules
  • Science and Technology on Monolithic Integrated Circuits and Modules Laboratory

External person

Hongqi Tao

  • Nanjing Electronic Devices Institute

External person

Mingshan Zhang

  • Beijing Institute of Technology
  • North China University of Science and Technology

External person

W. Mark Rainforth

  • University of Sheffield

External person

Dongdong Zhao

  • Norwegian University of Science and Technology
  • Tianjin University

External person

Xiaojian Chen

  • Nanjing Electronic Devices Institute
  • National Key Lab. of Monolithic Integrated Circuits and Modules

External person

Chunxiao Xie

  • Dongguan University of Technology

External person

Bo Xu

  • Nanjing Electronic Devices Institute

External person

Hai Chao Gong

  • Beijing Institute of Technology

External person

Ao Liu

  • Nanjing Electronic Devices Institute

External person

Youquan Jiang

  • Nanjing Electronic Devices Institute

External person

Zheng Rong Xu

  • Nanjing Electronic Devices Institute

External person

Min Zhang

  • Nanjing Electronic Devices Institute

External person

Ziliang Wang

  • Nanjing Electronic Devices Institute

External person

Chuntao Chang

  • Dongguan University of Technology

External person

Jianguo Wang

  • Dongguan University of Technology

External person

Zhongchao Xu

  • Nanjing Electronic Devices Institute

External person

Hongchang Shen

  • Guobo Electronics Co.,Ltd.
  • Ltd

External person

Tao Gao

  • National Key Laboratory of Monolithic Integrated Circuits and Modules
  • Nanjing Electronic Devices Institute

External person

Yu Gao

  • Beijing Institute of Technology

External person

Bo Xu

  • Nanjing Electronic Devices Institute

External person

Chunan Li

  • Norwegian University of Science and Technology

External person

Shilong Jiao

  • National Key Lab. of Monolithic Integrated Circuits and Modules
  • University of Electronic Science and Technology of China

External person

Chunjiang Ren

  • National Key Laboratory of Monolithic Integrated Circuits and Modules
  • Nanjing Electronic Devices Institute

External person

Wei Cheng

  • Nanjing Electronic Devices Institute

External person

Haiyan Lu

  • Nanjing Electronic Devices Institute

External person

W. Z. Li

  • Beijing Institute of Technology
  • Hong Kong Polytechnic University

External person

Yutang Ye

  • University of Electronic Science and Technology of China

External person

Joanne Sharp

  • University of Sheffield

External person

Shaokang Guan

  • Zhengzhou University

External person

Jun Liu

  • Hangzhou Dianzi University

External person

Jiaqiang Han

  • University of Science and Technology Beijing

External person

Nan Nan Jia

  • Beijing Institute of Technology

External person

Jiaqing Sun

  • Nanjing Electronic Devices Institute

External person

Chujun Wang

  • Nanjing Electronic Devices Institute

External person

Shi Yao

  • Nanjing Electronic Devices Institute

External person

Duoduo Wang

  • Beijing Institute of Technology

External person

Haitao Ying

  • Nanjing Electronic Devices Institute

External person

Yuan Yun Zhao

  • Norwegian University of Science and Technology
  • Dongguan University of Technology

External person

Xinjie Zhu

  • Beijing Institute of Technology
  • Ningbo Branch of China Academy of Ordnance Science
  • Chengdu Advanced Metal Materials Industrial Technology Research Institute Co. Ltd
  • Chinese Weapons Science Academy Ningbo Branch
  • Chinese Weapons Science Academy Ningbo Branch

External person

Keli Liu

  • Beijing Institute of Technology
  • Ltd.
  • CAS - Institute of Metal Research

External person

Shiwei Pan

  • Beijing Institute of Technology
  • Norwegian University of Science and Technology
  • University of Science and Technology Beijing

External person

Yinghong Zhao

  • Nanjing Electronic Devices Institute

External person

Zhensheng Wang

  • Nanjing Electronic Devices Institute

External person

Lei Dai

  • Nanjing Electronic Devices Institute

External person

Chengliang Zhao

  • Dongguan University of Technology

External person

Xing Yang

  • Nanjing Electronic Devices Institute

External person

Bing Wang

  • Beijing Institute of Technology
  • Ltd

External person

Xiaoqian Li

  • Nanjing Electronic Devices Institute

External person

Longlong Hao

  • Chongqing University

External person

Ao Liu

  • Nanjing Electronic Devices Institute

External person

Shizhen Zhu

  • Beijing Institute of Technology

External person

Zhuyan Li

  • Beijing Institute of Technology

External person

Yang Yang

  • Science and Technology on Monolithic Integrated Circuits and Modules Laboratory
  • Nanjing Electronic Devices Institute

External person

Yiming Liu

  • Nanjing Electronic Devices Institute

External person

Wen Yang

  • China National Nuclear Corporation

External person

Jianming Zhou

  • Nanjing Electronic Devices Institute

External person

Wenfeng Shen

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Junda Qu

  • Nanjing Electronic Devices Institute

External person

Xiangren Bai

  • Tianjin University

External person

Baowei Wang

  • Nanjing Electronic Devices Institute

External person

Dawei Li

  • Guobo Electronics Co.,Ltd.

External person

Xiaofeng Chen

  • Tianjin University

External person

Wei Liu

  • Air Force Military Representative Office in Jiangsu Province

External person

Naiqin Zhao

  • Collaborative Innovative Centre of Chemical Science and Engineering
  • Tianjin University
  • Ministry of Education in China
  • Collaborative Innovation Center of Chemical Science and Engineering (Tianjin)

External person

Zhi Gong Wang

  • Southeast University, Nanjing

External person

Yang Xu

  • Guobo Electronics Co.,Ltd.

External person

Zi Dong Wang

  • University of Science and Technology Beijing

External person

Changfei Yao

  • Nanjing Electronic Devices Institute

External person

Chunshen Shi

  • Tianjin University

External person

Jingjiu Yuan

  • Beijing Institute of Technology

External person

Y. Zheng

  • Beijing Institute of Technology

External person

Yan Kun Dou

  • Beijing Institute of Technology
  • China National Nuclear Corporation

External person

Zhi Yuan Yu

  • Jilin University

External person

Huaiming Sui

  • Yangzhou Fengming Photoelectric New Materials Co., LTD

External person

Jianhua Zhu

  • Nanjing Electronic Devices Institute

External person

Pin Xiang

  • Nanjing Electronic Devices Institute

External person

Weitao Xue

  • Nanjing Electronic Devices Institute

External person

Min Zha

  • Jilin University

External person

Haokai Su

  • Nanjing University of Science and Technology

External person

Dongming Jia

  • Nanjing Electronic Devices Institute

External person

Xinfu He

  • China National Nuclear Corporation

External person

Haiyong Cao

  • National Key Lab. of Monolithic Integrated Circuits and Modules

External person

Chengpeng Xue

  • Beijing Institute of Technology

External person

Lai Chang Zhang

  • Edith Cowan University

External person

Yulin Wang

  • Nanjing Electronic Devices Institute

External person

Wenjun Lu

  • Southern University of Science and Technology
  • Max Planck Institute for Iron Research

External person

Weibing Liu

  • Beijing Institute of Technology

External person

Zhangwei Hao

  • Guobo Electronics Co.,Ltd.

External person

Kun Cao

  • Nanjing Electronic Devices Institute

External person

Qing Xu

  • Nanjing Electronic Devices Institute

External person

Saisai Jin

  • Guobo Electronics Co.,Ltd.

External person

Bin Zhang

  • Science and Technology on Monolithic Integrated Circuits and Modules Laboratory

External person

Jinyue Li

  • Beijing Institute of Technology

External person

Yanqing Zhu

  • Nanjing Guobo Electronics Co., Ltd
  • Nanjing Electronic Devices Institute

External person

Fengling Zhou

  • Dongguan University of Technology
  • Monash University

External person

Xiaoyu Gu

  • Nanjing Guobo Electronics Co., Ltd

External person

Jinrong Cao

  • Nanjing Electronic Devices Institute

External person

Peidi Chen

  • Nanjing Electronic Devices Institute

External person

Hans J. Roven

  • Norwegian University of Science and Technology

External person

Feihong Tang

  • Guobo Electronics Co.,Ltd.

External person

Wei Feng

  • Nanjing Electronic Devices Institute

External person

Hui Yuan Wang

  • Jilin University

External person

Kai Chen

  • Beijing Institute of Technology
  • China University of Petroleum - Beijing

External person

Yuansheng Yang

  • CAS - Institute of Metal Research

External person

Xuming Yu

  • Science and Technology on Monolithic Integrated Circuits and Modules Laboratory

External person

Yizhou Zhou

  • CAS - Institute of Metal Research

External person

Ragnvald H. Mathiesen

  • Norwegian University of Science and Technology

External person

Chunnian He

  • Collaborative Innovation Center of Chemical Science and Engineering (Tianjin)
  • Tianjin University
  • National University of Singapore

External person

Peng Zhao

  • Nanjing Electronic Devices Institute

External person

Yu Xue

  • Nanjing Electronic Devices Institute

External person

Yanhong Yang

  • CAS - Institute of Metal Research

External person

Shijun Tang

  • Nanjing Electronic Devices Institute

External person

Xiang Zhang

  • Tianjin University

External person

Xiaoguang Liu

  • University of Science and Technology Beijing

External person

Zefeng Wang

  • Beijing Institute of Technology

External person

Ou Feng

  • Nanjing Electronic Devices Institute

External person

Pengcheng Mao

  • Beijing Institute of Technology

External person

Qin Ge

  • Nanjing Electronic Devices Institute

External person

Y. Zheng

  • Beijing Institute of Technology
  • Harbin Engineering University
  • Peking University

External person

J. M. Tao

  • Kunming University of Science and Technology

External person

Wen Yong Zhou

  • Hangzhou Dianzi University

External person

Hao Jiang

  • Nanjing Electronic Devices Institute

External person

Xiangbang Wang

  • Nanjing Electronic Devices Institute

External person

Jiajun Li

  • Tianjin University

External person

Rui qiang Wang

  • Beijing Institute of Technology

External person