Calculated based on number of publications stored in Pure and citations from Scopus
1995 …2024

Research activity per year

Network

Lei Wu

  • WiOptix, Inc.
  • Digital Optics Corporation
  • University of Florida
  • University of Florida
  • IEEE

External person

Xiaoyang Zhang

  • University of Florida
  • University of Florida

External person

Gary K. Fedder

  • Carnegie Mellon University
  • IEEE

External person

Liang Zhou

  • University of Florida
  • University of Florida

External person

Sagnik Pal

  • University of Florida
  • University of Florida

External person

Can Duan

  • University of Florida
  • University of Florida

External person

Ankur Jain

  • University of Florida
  • Siimpel Corporation
  • IEEE
  • University of Florida

External person

Kemiao Jia

  • Freescale Semiconductor
  • University of Florida
  • University of Florida

External person

Jingjing Sun

  • University of Florida
  • University of Florida
  • Electrical and Computer Science
  • WiO Technologies Ltd. Co.

External person

Donglin Wang

  • Zhengzhou University of Light Industry
  • University of Shanghai for Science and Technology
  • WiO Technology Ltd., Co.
  • WiO Technologies Ltd. Co.
  • WiO Technology
  • Xi'an Technological University
  • Wuxi WiO Technologies Co., Ltd.
  • Beijing Institute of Technology
  • Wuxi WiO Technologies Co. Ltd

External person

Huabei Jiang

  • University of South Florida
  • University of Florida
  • University of Florida
  • University of Electronic Science and Technology of China

External person

Yingtian Pan

  • Carnegie Mellon University
  • University of Pittsburgh
  • Stony Brook University
  • Department of Biomedical Engineering

External person

Sean R. Samuelson

  • University of Florida
  • University of Florida

External person

Dingkang Wang

  • University of Florida
  • University of Florida

External person

Qiao Chen

  • WiO Technology Ltd., Co.
  • WiO Technologies Ltd. Co.
  • WiO Technology
  • Wuxi WiO Technologies Co., Ltd.
  • Wuxi WiO Technologies Co. Ltd
  • Wio Technologies Co. Ltd
  • Ltd.
  • Ltd.

External person

Haoran Wang

  • University of Florida
  • Tianjin University
  • Applied Materials Incorporated

External person

Wei Wang

  • Shanghai Jiao Tong University
  • WiO Technology Ltd., Co.
  • University of Florida
  • WiO Technologies Ltd. Co.
  • University of Florida
  • WiO Technology
  • Wuxi WiO Technologies Co., Ltd.

External person

Sanjeev Koppal

  • University of Florida
  • University of Florida

External person

Quentin A.A. Tanguy

  • University of Florida
  • FEMTO-ST
  • University of Florida
  • University Bourgogne Franche-Comté

External person

Hongwei Qu

  • University of Florida
  • School of Engineering and Computer Science
  • Oakland University
  • IEEE
  • University of Florida

External person

Lin Liu

  • University of Florida
  • University of Florida

External person

Lei Xi

  • Southern University of Science and Technology
  • University of Florida
  • University of Electronic Science and Technology of China
  • Anhui University
  • University of Science and Technology Beijing

External person

Hao Yang

  • University of South Florida
  • University of Florida

External person

Deyou Fang

  • University of Florida
  • Freescale Semiconductor
  • University of Florida

External person

Wenjun Liao

  • University of Florida
  • University of Florida

External person

Antonio Pozzi

  • University of Florida
  • University of Zurich

External person

Site Luo

  • Tsinghua University
  • Shenzhen Institute of Advanced Technology
  • Hunan University
  • WiseViewer Technology Co. Ltd

External person

V. F.G. Tseng

  • University of Florida
  • University of Florida

External person

Li Huo

  • Tsinghua University
  • Peking University
  • Baoding University
  • Baoding Teacher's College
  • Baoding Teacher's Coll.
  • Hebei Normal University

External person

Wenjing Liu

  • Southeast University, Nanjing
  • University of Florida
  • University of Florida

External person

Hui Zhao

  • Foshan Optomedic Technologies Co., Ltd.
  • University of Florida
  • Ltd.
  • Beijing Institute of Technology
  • Ltd.

External person

Jiping Li

  • University of Florida
  • Beijing SOJO Electric Company Limited
  • University of Florida

External person

Shuguang Guo

  • University of Florida

External person

Zhenfang Chen

  • MEMS Engineering and Material Inc.

External person

Gui Zhen Yan

  • Peking University

External person

Qian Chen

  • Southern University of Science and Technology
  • University of Electronic Science and Technology of China
  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Philip X.L. Feng

  • University of Florida
  • Case School of Engineering

External person

Yongming Tang

  • Southeast University, Nanjing

External person

P. Lutz

  • CNRS
  • University Bourgogne Franche-Comté
  • FEMTO-ST

External person

Hongzhi Sun

  • University of Florida
  • University of Florida

External person

Hengzhang Yang

  • Beijing Institute of Technology

External person

S. T. Todd

  • University of Florida
  • University of California

External person

Yiping Zhu

  • University of Florida

External person

Yabing Liu

  • WiO Technology Ltd., Co.
  • Wuxi WiO Technologies Co., Ltd.
  • Wuxi WiO Technologies Co. Ltd
  • WiO Technologies Ltd. Co.

External person

Sylwester Bargiel

  • University Bourgogne Franche-Comté
  • FEMTO-ST
  • FEMTO-ST Institute France

External person

Hao Liu

  • Southern Medical University

External person

Peng Wang

  • Wuxi WiO Technologies Co. Ltd
  • Xi'an Technological University
  • Co.

External person

Teng Pan

  • Beijing Institute of Technology

External person

Christophe Gorecki

  • University Bourgogne Franche-Comté
  • FEMTO-ST

External person

Khai D.T. Ngo

  • Virginia Tech College of Engineering
  • Virginia Polytechnic Institute and State University

External person

Przemyslaw Struk

  • University Bourgogne Franche-Comté
  • Silesian University of Technology
  • FEMTO-ST
  • Silesian University of Technology Poland

External person

Yingchao Cao

  • Beijing Institute of Technology
  • Wuxi WiO Technologies Co. Ltd
  • Ministry of Education in China

External person

Baoping Wang

  • Southeast University, Nanjing

External person

Xianjin Dai

  • University of Florida
  • University of Florida

External person

Hongzhi Jia

  • University of Shanghai for Science and Technology

External person

Zhong Yang Guo

  • Peking University
  • University of Florida

External person

Hongqiong Liu

  • WiO Technology Ltd., Co.
  • WiO Technology
  • Wuxi WiO Technologies Co. Ltd
  • WiO Technologies Ltd. Co.

External person

Tuqiang Xie

  • Stony Brook University
  • University of Pittsburgh

External person

X. S. Liu

  • Peking University
  • University of Florida

External person

Xin An

  • Foshan Optomedic Technologies Co., Ltd.
  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics
  • Ltd.

External person

Lei Xiao

  • Beijing Institute of Technology

External person

Jiapin Chen

  • Shanghai Jiao Tong University

External person

Qian Cheng Zhao

  • Peking University

External person

Long Tao Lin

  • Peking University

External person

Xingde Li

  • Johns Hopkins University
  • Department of Biomedical Engineering

External person

Zhen Chuan Yang

  • Peking University

External person

Lily Yang

  • Emory University

External person

Nicolas Passilly

  • University Bourgogne Franche-Comté
  • FEMTO-ST

External person

Qincheng Zheng

  • Beijing Institute of Technology

External person

Jinling Ding

  • Wio Technologies Co. Ltd
  • Wuxi WiO Technologies Co., Ltd.
  • Ltd.
  • Ltd.
  • WiO Technology Ltd., Co.

External person

Mingliang Wang

  • University of Florida
  • Qualcomm Incorporated
  • University of Florida

External person

Min Gu

  • Swinburne University of Technology
  • Royal Melbourne Institute of Technology University

External person

Xiang Cheng

  • Xiamen University
  • Key Laboratory of Photoelectric Sensing Technology of Xiamen
  • Key Laboratory of Sensor Technology of Fujian Universities and Colleges

External person

Malisa Sarntinoranont

  • University of Florida
  • Department of Mechanical and Aerospace Engineering

External person

Connor Watkins

  • University of Florida
  • University of Florida

External person

Liyuan Zhai

  • Dalian University of Technology

External person

Sung Jin Lee

  • University of Florida
  • Department of Mechanical and Aerospace Engineering

External person

Se Woon Choe

  • University of Florida
  • University of Florida

External person

Dong Zheng

  • University of Florida

External person

Ling Fu

  • Swinburne University of Technology

External person

Zhongyi Liu

  • Beijing Institute of Technology
  • Hong Kong University of Science and Technology

External person

Le Guan

  • Dalian University of Technology
  • University of Florida

External person

Mengyuan Li

  • Beijing Institute of Technology
  • University of Florida

External person

Olivier Gaiffe

  • University Bourgogne Franche-Comté
  • FEMTO-ST
  • Université de Franche-Comté

External person

Heng Guo

  • Southern University of Science and Technology
  • University of Electronic Science and Technology of China

External person

Ying Zhou

  • University of Florida
  • University of Florida

External person

Yue Tang

  • Beijing Institute of Technology
  • The University of Texas at Dallas
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Jinkui Chu

  • Dalian University of Technology

External person

Anrun Ren

  • Beijing Institute of Technology

External person

Huan Liu

  • Xi'an Technological University

External person

Brian S. Sorg

  • National Institutes of Health
  • University of Florida
  • University of Florida

External person

Z. G. Wang

  • Department of Biomedical Engineering
  • Stony Brook University

External person

Xinling Li

  • WiO Technology Ltd., Co.
  • Wuxi WiO Technologies Co., Ltd.

External person

Wilhelm Frey

  • Robert Bosch Corporation

External person

Hui Zhao

  • Ltd.
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • Inc
  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

P. F. McManamon

  • Air Force Research Laboratory
  • University of Dayton
  • Exciting Technology LLC

External person

Jiann S. Yuan

  • University of Central Florida
  • University of Central Florida

External person

A. Pais

  • University of Florida
  • University of Florida

External person

Tingxiang Qi

  • BIT Chongqing Institute of Microelectronics and Microsystems
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Sheng Liu

  • Dalian University of Technology

External person

Zhiyu Pan

  • Robert Bosch Corporation

External person

Yangyang Yan

  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Boqian Sun

  • Beijing Institute of Technology
  • University of Florida

External person

S. B. Maley

  • Air Force Research Laboratory

External person

M. A. King

  • University of Florida
  • Pharmacology and Therapeutics

External person

Huabei Jiang

  • University of South Florida

External person

Tianqi Shan

  • University of Florida
  • University of Florida

External person

Carl Crane

  • University of Florida
  • University of Florida

External person

Julio Correa

  • Universidad Pontificia Bolivariana
  • University of Florida

External person

Shiqi Li

  • Dalian University of Technology

External person

Anwar Sadat

  • University of Central Florida
  • University of Central Florida

External person

Darine Abi Haidar

  • Université de Paris
  • Université Paris-Saclay
  • Université Paris Cité

External person

Yu Zhu

  • Southern Medical University

External person

Weiguo Liu

  • Xi'an Technological University

External person

Yuanyuan Yu

  • Tianjin University
  • University of Florida

External person

Zhijia Yuan

  • Stony Brook University
  • Department of Biomedical Engineering

External person

Ant Ural

  • University of Florida
  • University of Melbourne

External person

Dacheng Xu

  • Soochow University

External person

Wayne Waltzer

  • Stony Brook University

External person

Zaid Tasneem

  • University of Florida
  • University of Florida

External person

Z. L. Wu

  • Department of Biomedical Engineering
  • Stony Brook University

External person

Hussein Mehidine

  • Université Paris-Saclay
  • Université Paris Cité
  • Université de Paris

External person

Jianyu Tang

  • Tsinghua University

External person

Charles Cranfield

  • Swinburne University of Technology

External person

Ziyue Zhang

  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • National University of Singapore
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Yifei Ma

  • Beijing Institute of Technology

External person

Hongyu Yu

  • Hong Kong University of Science and Technology
  • Arizona State University
  • HKUST Shenzhen-Hong Kong Collaborative Innovation Research Institute
  • Arizona State University

External person

Peng Liang

  • WiO Technology Ltd., Co.

External person

Xiaomin Yu

  • University of Florida
  • Chengdu University of Information Technology

External person

S. R. Dooley

  • Air Force Research Laboratory

External person

Daihua Zhang

  • Tianjin University

External person

Aleksandar S. Zivkovic

  • University of Florida
  • University of Florida

External person

Robert A. Reed

  • Vanderbilt University

External person

Edward A. Watson

  • Air Force Research Laboratory

External person

Ke Cao

  • Beijing Institute of Technology

External person

Maojiao He

  • University of Florida
  • University of Florida

External person

Lars Erdmann

  • Carnegie Mellon University
  • Carl Zeiss SMT AG

External person

W. Wang

  • Wuxi WiO Technologies Co., Ltd.
  • Wuxi WiO Technologies Co. Ltd

External person

En Xia Zhang

  • Vanderbilt University

External person

Fares Maarouf

  • Qualcomm Incorporated
  • University of Florida

External person

Stephen R. Grobmyer

  • University of Florida

External person

Jean Marc Cote

  • University Bourgogne Franche-Comté

External person

Yu Wen Hsu

  • Industrial Technology Research Institute of Taiwan

External person

Gary K. Feeder

  • Carnegie Mellon University

External person

K. Rabenorosoa

  • CNRS
  • University Bourgogne Franche-Comté

External person

Shuijie Qin

  • Guizhou University

External person

Toshikazu Nishida

  • University of Florida

External person

Haopu Wang

  • Beijing Institute of Technology

External person

Jeong Bong Lee

  • The University of Texas at Dallas

External person

Wen Sui

  • University of Florida

External person

Luke G. Gutwein

  • University of Florida

External person

Tahmid Kaisar

  • University of Florida
  • Applied Materials Incorporated

External person

Yuqing Wu

  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics

External person

Yilong Jia

  • Beijing Institute of Technology
  • Ministry of Education in China

External person

Lijun Zhu

  • Xiamen University

External person

Jiasheng Qu

  • Beijing Institute of Technology

External person

N. Xu

  • Wuxi WiO Technologies Co., Ltd.
  • Wuxi WiO Technologies Co. Ltd

External person

Ronald D. Schrimpf

  • Vanderbilt University

External person

Rui Jiao

  • Hong Kong University of Science and Technology

External person

Michael L. Alles

  • Vanderbilt University

External person

Yan Cui

  • Dalian University of Technology

External person

Michael P. Frank

  • University of Florida
  • University of Florida

External person

Guoxin Li

  • Southern Medical University

External person

Yunqi Hao

  • Zhengzhou University of Light Industry
  • University of Florida

External person

Tian Jin

  • Southern University of Science and Technology
  • University of Electronic Science and Technology of China

External person

J. E. Rogers

  • University of Florida

External person

Olusegun Ilegbusi

  • University of Central Florida

External person

Weizhi Qi

  • Southern University of Science and Technology
  • University of Electronic Science and Technology of China

External person

Q. Sun

  • Wuxi WiO Technologies Co., Ltd.
  • Wuxi WiO Technologies Co. Ltd

External person

M. Li

  • CAS - Suzhou Institute of Biomedical Engineering and Technology
  • University of Florida

External person

Christopher S.D. Lee

  • Stony Brook University

External person

Tailong Liu

  • Guizhou University

External person

J. Cui

  • Peking University

External person

Yihao Wu

  • University of Florida

External person

Laurent Pinot

  • Université Paris-Saclay

External person

Erkang Wang

  • University of Florida

External person

W. Liu

  • Xi'an Technological University

External person

Jin Cheng

  • Wuxi WiO Technologies Co., Ltd.
  • Wio Technologies Co. Ltd

External person

Fernando E. García-Ramírez

  • University Bourgogne Franche-Comté
  • FEMTO-ST

External person

Ruimin Chen

  • University of Southern California
  • University of Southern California

External person

C. Clévy

  • CNRS
  • University Bourgogne Franche-Comté
  • FEMTO-ST

External person

Linlai Fu

  • WiO Technology Ltd., Co.

External person

Rui Zhang

  • University of Florida

External person

Ruihao Zhang

  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

B. Wang

  • Southeast University, Nanjing

External person

Jicheng Zhang

  • WiO Technology Ltd., Co.
  • Wuxi WiO Technologies Co. Ltd

External person

Zhengwei Zhou

  • WiO Technology Ltd., Co.

External person

Jingxuan Liu

  • Stony Brook University

External person

Mengyue Liang

  • University of Southern California
  • Tianjin University
  • University of Florida

External person

Guangyin Zhou

  • University of Florida

External person

Yi Liu

  • University of Central Florida
  • University of Central Florida

External person

Xinglin Sun

  • Xiamen University

External person

Lenworth Thomas

  • University of Florida

External person

F. Bouvet

  • Université Paris-Saclay

External person

Yan Liu

  • Xiamen University

External person

Fengtian Han

  • Tsinghua University
  • University of Florida

External person

Wenjun Liao

  • Vanderbilt University

External person

H. T. Ding

  • Peking University

External person

Jason Lee Johnson

  • University of Florida

External person

Xiaoyi Wang

  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Jannick P. Rolland

  • University of Central Florida
  • University of Rochester

External person

Jaesung Lee

  • University of Florida

External person

Qifa Zhou

  • University of Southern California
  • University of Southern California

External person

Zhiming Xiao

  • Linear Technology Corp

External person

Marco Costa

  • University of Florida

External person

Daniel M. Fleetwood

  • Vanderbilt University

External person

J. Cheng

  • Wuxi WiO Technologies Co., Ltd.
  • Xi'an Technological University
  • Wuxi WiO Technologies Co. Ltd

External person

Hua Wang

  • Beijing Institute of Technology
  • Ministry of Education in China

External person

Junyu Chai

  • University of Shanghai for Science and Technology
  • Ltd.
  • WiO Technology Ltd., Co.

External person

Andrew L. Sternberg

  • Vanderbilt University

External person

Gai Yang

  • Beijing Institute of Technology

External person

Hao Zhang

  • Wuxi WiO Technologies Co. Ltd
  • Soochow University
  • WiO Technology Ltd., Co.

External person

Ruoqin Wang

  • Hong Kong University of Science and Technology

External person

Wenxuan Liang

  • Johns Hopkins University
  • University of Science and Technology of China
  • Corning Incorporated

External person

Kye Sung Lee

  • University of Central Florida

External person

Hang Yin Ling

  • University of Florida

External person

D. Chan

  • Johns Hopkins University

External person

Chong Shen

  • North University of China
  • Ministry of Education in China

External person

T. R. Nelson

  • Air Force Research Laboratory

External person

Yiqi Tang

  • University of Florida

External person

Lisa Butler

  • University of Florida

External person

J. Cheng

  • WiO Technologies Ltd. Co.

External person

Jianbo Tang

  • University of Florida

External person

Aaron Stainsby

  • University of Florida

External person

Wei Chuan Shih

  • University of Houston

External person

Lei Yao

  • University of Electronic Science and Technology of China

External person

Jean Francois Lendresse

  • Université Paris-Saclay

External person

Michael J. Escuti

  • North Carolina State University

External person

Yi Kuen Lee

  • Hong Kong University of Science and Technology

External person

Xun Gao

  • Beijing Institute of Technology

External person

Xu Zhu

  • Carnegie Mellon University
  • IEEE

External person

Zhao Yun

  • WiO Technology Ltd., Co.

External person

Yongsheng Li

  • Southern Medical University

External person

Zhi Mei Qi

  • CAS - Aerospace Information Research Institute
  • CAS - Institute of Electronics
  • State Key Laboratory of NBC Protection for Civilian
  • Chinese Academy of Sciences
  • University of Chinese Academy of Sciences
  • State Key Laboratory of NBC Protection for Civilian

External person

Yulung Sung

  • University of Houston

External person

Xin Wang

  • Wuxi People's Hospital

External person

Denis Reynet

  • Université Paris-Saclay

External person

Xiaotian Shen

  • Tianjin University

External person

Chenyu Bai

  • Beijing Institute of Technology

External person

Yinnan Li

  • Dalian University of Technology

External person

Daren An

  • North University of China

External person

Fenggang Li

  • Beijing Institute of Technology
  • Advanced Innovation Center for Intelligent Robots and Systems
  • Beijing Advanced Innovation Center for Intelligent Robots and Systems

External person

David Torres

  • Michigan State University

External person

Kaigham J. Gabriel

  • Carnegie Mellon University
  • IEEE

External person

B. Yang

  • University of Florida

External person

Baoyan Yang

  • Beijing Institute of Technology

External person

Huiliang Cao

  • North University of China
  • Ministry of Education in China

External person

L. Liu

  • Zhengzhou University of Light Industry

External person

Pan Wang

  • Vanderbilt University

External person

Ling Fu

  • Beijing Smart-Chip Microelectronics Technology Co. Ltd.
  • Ltd.
  • Ltd.

External person

Fei Xie

  • Xi'an Technological University

External person

Hui Liu

  • Dalian Maritime University

External person

Magali Barthès

  • University Bourgogne Franche-Comté

External person

Xiao Wang

  • Tsinghua University
  • Beijing University of Posts and Telecommunications

External person

Suiqiong Li

  • Soochow University

External person

N. Mamat

  • University Bourgogne Franche-Comté

External person

B. P. Gila

  • University of Florida

External person

K. H. Chen

  • University of Florida

External person

Qi An

  • North University of China

External person

J. J. Flint

  • University of Florida

External person

Qiangxian Qi

  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Zhongjian Gong

  • Wuxi People's Hospital

External person

Marybeth Horodyski

  • University of Florida

External person

Zhijian Li

  • Tsinghua University

External person

Jiong Pan

  • Beijing Institute of Technology

External person

Peter Zory

  • University of Florida

External person

Douglas Hamilton

  • Lantis Lasers, Incorporated

External person

Huiqi Gong

  • Vanderbilt University

External person

Tan Zhimin

  • Tsinghua University

External person

Huipeng Chen

  • Hangzhou Dianzi University

External person

Hangquan Lu

  • Xiamen University

External person

Stephan Strassle

  • University of Florida

External person

J. Zhang

  • Shanghai Guanghua Hospital of Integrated Traditional Chinese and Western Medicine

External person

G. Subhash

  • University of Florida

External person

Jun Shan Ma

  • University of Shanghai for Science and Technology

External person

Jieyao Deng

  • North University of China

External person

Simeng E. Zhao

  • Vanderbilt University

External person

Xuexin Duan

  • Tianjin University

External person

Rencheng Jin

  • Dalian University of Technology

External person

Jason Heikenfeld

  • University of Cincinnati

External person

Xinyuan Zhang

  • Beijing Institute of Technology

External person

Guoqing Fu

  • University of Florida

External person

Yekai Wu

  • Ministry of Education in China
  • Beijing Institute of Technology

External person

J. W. Johnson

  • Nitronex Corporation

External person

Lingfeng Zhou

  • Beijing Institute of Technology

External person

Venkiteswaran Anantharam

  • University of Florida

External person

Chang Yin Ji

  • Beijing Institute of Technology
  • China Academy of Engineering Physics

External person

Steve Serati

  • Boulder Nonlinear Systems, Inc.

External person

Haipeng Huang

  • Southern Medical University

External person

Catherine A. Tonks

  • University of Florida

External person

Alain Billard

  • University Bourgogne Franche-Comté

External person

E. L. Piner

  • Nitronex Corporation

External person

Peixin Qian

  • Tsinghua University

External person

Jason Kim

  • Stony Brook University

External person

Y. Ding

  • Beijing Institute of Technology

External person

Junwen Liu

  • Soochow University
  • Ltd.

External person

Yanping Chen

  • Xiamen University
  • University of Florida

External person

Li Lin

  • Wuxi WiO Technologies Co. Ltd

External person

Yuwen Su

  • Beijing Institute of Technology

External person

M. Zeidel

  • University of Pittsburgh

External person

Yongtai Chen

  • Dalian University of Technology

External person

H. Adler

  • Stony Brook University

External person

Jonathan D. Jordan

  • University of Florida

External person

Minyu Bai

  • Xi'an Technological University

External person

Yang Yang

  • Tianjin University

External person

Yu Xiaomin

  • Chengdu University of Information Technology

External person

Jiang Yu

  • Southern Medical University

External person

Z. Yan

  • Fudan University

External person

Krishna Natarajan

  • University of Florida

External person

Carrie Hang Yin Ling

  • University of Florida

External person

Nelson Sepulveda

  • Michigan State University

External person

Hyeon Cheol Park

  • Johns Hopkins University
  • Department of Biomedical Engineering

External person

Jason E. Coleman

  • University of Florida

External person

Liu Litian

  • Tsinghua University

External person

Brent T. Wisea

  • University of Florida

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Lauren E. de Rosset

  • Carnegie Mellon University

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Yan Liu

  • Jimei University

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Yao Lu

  • Beijing Institute of Technology

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Arnold W. Schumann

  • University of Florida

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Jun Zhang

  • University of California at San Diego

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Li Zhijian

  • Tsinghua University

External person

Chaolong Song

  • China University of Geosciences, Wuhan

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Wei Lin

  • Dalian University of Technology

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Shaohui Su

  • Hangzhou Dianzi University

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Eric Wanlin

  • Université Paris-Saclay

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Dan Wang

  • Tsinghua University

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Darrin J. Young

  • Case School of Engineering

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Yunkai Bai

  • University of Florida

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Ziru Cai

  • Beijing Institute of Technology
  • School of Integrated Circuits and Electronics
  • University of Southern Denmark

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Xuejiao Li

  • Beijing Institute of Technology

External person

S. Lan

  • WiO Technologies Ltd. Co.

External person

Qiang Guo

  • Tsinghua University

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Charles N. Arutt

  • Vanderbilt University

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Guoxing Li

  • Southern Medical University

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Elaine Lin

  • University of Florida

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Jaroslaw Rutkowski

  • University Bourgogne Franche-Comté

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J. Ding

  • WiO Technologies Ltd. Co.

External person

Dao Hua Zhang

  • Nanyang Technological University

External person

Scott A. Berceli

  • University of Florida

External person

Site Luo

  • WiseViewer Technology Co. Ltd

External person

Siyi Hu

  • CAS - Suzhou Institute of Biomedical Engineering and Technology
  • University of Cambridge

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Lei Jiang

  • Honeywell

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Huaizhi Kang

  • University of Florida
  • Xiamen University

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Xiaoyan Han

  • WiO Technology

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Hugang Ren

  • Stony Brook University

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Manish Godara

  • University of Florida

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Yifan Li

  • Beijing Institute of Technology

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Thomas F. Burks

  • University of Florida

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Dru Morrish

  • Swinburne University of Technology

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C. Esnault

  • Université Paris-Saclay

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G. M. Li

  • The University of Hong Kong

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Dawei Zhang

  • University of Shanghai for Science and Technology

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Zhangming Peng

  • Hangzhou Dianzi University

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Gonzalo Cabodevila

  • University Bourgogne Franche-Comté

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K. J. Linthicum

  • Nitronex Corporation

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F. Ren

  • University of Florida

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J. C. Roberts

  • Nitronex Corporation

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Medini Aradhya

  • University of Florida

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Shun Xu

  • Key Laboratory of Sensor Technology of Fujian Universities and Colleges
  • Key Laboratory of Photoelectric Sensing Technology of Xiamen
  • Xiamen University

External person

Stephan Strassle Rojas

  • University of Florida

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Junshan Ma

  • University of Shanghai for Science and Technology

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Michal Jozwik

  • Warsaw University of Technology

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Chuanzhao Yu

  • University of Central Florida

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Michael W. McCurdy

  • Vanderbilt University

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Hanbin Ma

  • CAS - Suzhou Institute of Biomedical Engineering and Technology
  • University of Cambridge

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Boxiao Li

  • University of Florida

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Qiangqiang Liu

  • Beijing Institute of Technology

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Cher Xuan Zhang

  • Vanderbilt University

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Antonio Pozzic

  • University of Florida

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Zhuoge Lou

  • Xiamen University

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Philip J. Bos

  • Kent State University

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Xiqing Sun

  • Tsinghua University

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Karthik Dantu

  • University at Buffalo

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Mohd Haris

  • School of Engineering and Computer Science

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W. Lau

  • WiOptix, Inc.
  • University of Florida

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Jia Pu

  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Zhang Linjia

  • Chengdu University of Information Technology

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John K. Schueller

  • University of Florida

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Peng Jiang

  • Hong Kong University of Science and Technology

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Yahong Li

  • Dalian University of Technology

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Fang Chen

  • Carnegie Mellon University

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Z. Tian

  • Xiamen University

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Hongxiang Kang

  • Academy of Military Medical Science China

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Yik Kin Cheung

  • Hong Kong University of Science and Technology

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Hanqi Hu

  • Beijing Institute of Technology

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Kun Yang

  • Zhengzhou University of Light Industry

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Ming Zheng

  • Xiamen University

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Tongyu Wang

  • Michigan State University

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Hongwei Chen

  • Tsinghua University

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Ziyan Wang

  • Southern University of Science and Technology

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P. K.A. Wai

  • Hong Kong Polytechnic University

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Zhihua Wang

  • Tsinghua University

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Cheng Kuan Lu

  • Case School of Engineering

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Hang Li

  • Beijing Institute of Technology
  • Ministry of Education in China

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Jiali Qi

  • Hangzhou Dianzi University

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Eric Valaski Teuma

  • University of Central Florida

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Guo Quan Lu

  • Virginia Tech College of Engineering

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Hong Cai

  • Dalian University of Technology

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Yan An

  • Xi'an Technological University
  • Wuxi WiO Technologies Co. Ltd

External person

Ke Cui

  • North University of China

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Peiqi Zhang

  • Dalian University of Technology

External person

Jiqiang Cao

  • Beijing Institute of Technology

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Elizabeth Butler

  • University of Florida

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Min Min

  • University of Florida

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Won Suk Lee

  • University of Florida

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Ruifan Zhao

  • Beijing Institute of Technology

External person

Hongxin Gao

  • Beijing Institute of Technology

External person

Tony Viaud

  • Université Paris-Saclay

External person

Xiaohong Chen

  • Xiamen University
  • University of Florida

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Yue Tang

  • Beijing Institute of Technology

External person

Yuan Xue

  • Beijing Institute of Technology

External person

X. C. Yuan

  • The University of Hong Kong

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Xiaobo Tan

  • Michigan State University

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Wu Yuan

  • Johns Hopkins University
  • Chinese University of Hong Kong

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Issa Batarseh

  • University of Central Florida

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Shuguang Guob

  • University of Florida

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Chang Chen

  • Hangzhou Dianzi University

External person

Xiaolin Guo

  • Shanghai University

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F. Usmani

  • University of Florida

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Xiaoxing Feng

  • University of Florida

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A. S. Virendrapal

  • University of Florida

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Jeremy Reynolds

  • Peter Maccallum Cancer Centre

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Menglei Zhao

  • Beijing Institute of Technology

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Charuvahan Adhivarahan

  • University at Buffalo

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Kai Ni

  • Vanderbilt University

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Y. K. Yoon

  • University of Florida

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Lei Xiao

  • University of Florida

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Yinghao Zhao

  • Beijing Institute of Technology

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Robert M. Fox

  • University of Florida

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C. Y. Li

  • Hong Kong Polytechnic University

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Weipin Qian

  • Emory University

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Chee Chenjie

  • Tsinghua University

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Kelley Thiemanc

  • University of Florida

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Zhaoyuan Wang

  • Beijing Institute of Technology

External person

Zhi Li

  • University of Florida

External person

Robert E. Sulouff

  • Analog Devices, Inc.

External person

Haijun Deng

  • Southern Medical University

External person

Kelley M. Thieman

  • University of Florida

External person

Luo Wensong

  • Chengdu University of Information Technology

External person

Qi Jing

  • Carnegie Mellon University

External person

Z. Qin

  • WiO Technologies Ltd. Co.

External person

Bartosz Mirecki

  • Warsaw University of Technology

External person

Anthony Kopa

  • University of Florida

External person

Xinchao Zhang

  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Ravinder Chutani

  • University Bourgogne Franche-Comté

External person

Jijie Zhao

  • Xi'an Technological University

External person

Alexander Shuping

  • University of Florida

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Xinyuan Han

  • Beijing Institute of Technology

External person

Mary Beth Horodyskia

  • University of Florida

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Chuck Koehler

  • University of Central Florida

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Yongjian Feng

  • Xiamen University

External person

Yi Zhang

  • Shangdong University of Science and Technology

External person

Zongliang Guo

  • Beijing Institute of Technology

External person

Yanpin Chen

  • Xiamen University
  • University of Florida

External person

Litian Liu

  • Tsinghua University

External person

S. J. Pearton

  • University of Florida

External person

Feng Xiao Zhai

  • Zhengzhou University of Light Industry

External person

Yang Deng

  • Hong Kong University of Science and Technology

External person

Alex Boussioutas

  • Swinburne University of Technology
  • Peter Maccallum Cancer Centre

External person

Frederic Zamkotsian

  • Laboratoire d'Astrophysique de Marseille

External person

Haobing Liu

  • Beijing Institute of Technology

External person

Wenlong Jiao

  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Jinhui Ye

  • Key Laboratory of Sensor Technology of Fujian Universities and Colleges
  • Key Laboratory of Photoelectric Sensing Technology of Xiamen
  • Xiamen University

External person

P. Rajagopal

  • Nitronex Corporation

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Ran Zhang

  • Dalian University of Technology

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Eric G. Johnson

  • University of Central Florida

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Guangya Zhou

  • National University of Singapore

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Jiawen Luo

  • Beijing Institute of Technology

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J. Johnson

  • University of Florida

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Ning Deng

  • Beijing Institute of Technology

External person

Bin He

  • University of Florida

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Chao Chen

  • Beijing Institute of Technology

External person

Xinguo Li

  • Southern Medical University

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V. O.K. Li

  • The University of Hong Kong

External person

Gang Zhang

  • Carnegie Mellon University

External person

Yingtao Ding

  • Beijing Institute of Technology

External person