根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
1995 …2024

每年的科研成果

网络

Wu Lei

  • WiOptix, Inc.
  • Digital Optics Corporation
  • University of Florida
  • University of Florida
  • IEEE

外部人员

Zhang Xiaoyang

  • University of Florida
  • University of Florida

外部人员

Fedder Gary K.

  • Carnegie Mellon University
  • IEEE

外部人员

Zhou Liang

  • University of Florida
  • University of Florida

外部人员

Pal Sagnik

  • University of Florida
  • University of Florida

外部人员

Duan Can

  • University of Florida
  • University of Florida

外部人员

Jain Ankur

  • University of Florida
  • Siimpel Corporation
  • IEEE
  • University of Florida

外部人员

Jia Kemiao

  • Freescale Semiconductor
  • University of Florida
  • University of Florida

外部人员

Sun Jingjing

  • University of Florida
  • University of Florida
  • Electrical and Computer Science
  • WiO Technologies Ltd. Co.

外部人员

Wang Donglin

  • Zhengzhou University of Light Industry
  • University of Shanghai for Science and Technology
  • WiO Technology Ltd., Co.
  • WiO Technologies Ltd. Co.
  • WiO Technology
  • Xi'an Technological University
  • Wuxi WiO Technologies Co., Ltd.
  • Beijing Institute of Technology
  • Wuxi WiO Technologies Co. Ltd

外部人员

Jiang Huabei

  • University of South Florida
  • University of Florida
  • University of Florida
  • University of Electronic Science and Technology of China

外部人员

Pan Yingtian

  • Carnegie Mellon University
  • University of Pittsburgh
  • Stony Brook University
  • Department of Biomedical Engineering

外部人员

Samuelson Sean R.

  • University of Florida
  • University of Florida

外部人员

Wang Dingkang

  • University of Florida
  • University of Florida

外部人员

Chen Qiao

  • WiO Technology Ltd., Co.
  • WiO Technologies Ltd. Co.
  • WiO Technology
  • Wuxi WiO Technologies Co., Ltd.
  • Wuxi WiO Technologies Co. Ltd
  • Wio Technologies Co. Ltd
  • Ltd.
  • Ltd.

外部人员

Wang Haoran

  • University of Florida
  • Tianjin University
  • Applied Materials Incorporated

外部人员

Wang Wei

  • Shanghai Jiao Tong University
  • WiO Technology Ltd., Co.
  • University of Florida
  • WiO Technologies Ltd. Co.
  • University of Florida
  • WiO Technology
  • Wuxi WiO Technologies Co., Ltd.

外部人员

Koppal Sanjeev

  • University of Florida
  • University of Florida

外部人员

Tanguy Quentin A.A.

  • University of Florida
  • FEMTO-ST
  • University of Florida
  • University Bourgogne Franche-Comté

外部人员

Qu Hongwei

  • University of Florida
  • School of Engineering and Computer Science
  • Oakland University
  • IEEE
  • University of Florida

外部人员

Liu Lin

  • University of Florida
  • University of Florida

外部人员

Xi Lei

  • Southern University of Science and Technology
  • University of Florida
  • University of Electronic Science and Technology of China
  • Anhui University
  • University of Science and Technology Beijing

外部人员

Yang Hao

  • University of South Florida
  • University of Florida

外部人员

Fang Deyou

  • University of Florida
  • Freescale Semiconductor
  • University of Florida

外部人员

Liao Wenjun

  • University of Florida
  • University of Florida

外部人员

Pozzi Antonio

  • University of Florida
  • University of Zurich

外部人员

Luo Site

  • Tsinghua University
  • Shenzhen Institute of Advanced Technology
  • Hunan University
  • WiseViewer Technology Co. Ltd

外部人员

Tseng V. F.G.

  • University of Florida
  • University of Florida

外部人员

Huo Li

  • Tsinghua University
  • Peking University
  • Baoding University
  • Baoding Teacher's College
  • Baoding Teacher's Coll.
  • Hebei Normal University

外部人员

Liu Wenjing

  • Southeast University, Nanjing
  • University of Florida
  • University of Florida

外部人员

Zhao Hui

  • Foshan Optomedic Technologies Co., Ltd.
  • University of Florida
  • Ltd.
  • Beijing Institute of Technology
  • Ltd.

外部人员

Li Jiping

  • University of Florida
  • Beijing SOJO Electric Company Limited
  • University of Florida

外部人员

Guo Shuguang

  • University of Florida

外部人员

Chen Zhenfang

  • MEMS Engineering and Material Inc.

外部人员

Yan Gui Zhen

  • Peking University

外部人员

Chen Qian

  • Southern University of Science and Technology
  • University of Electronic Science and Technology of China
  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

Feng Philip X.L.

  • University of Florida
  • Case School of Engineering

外部人员

Tang Yongming

  • Southeast University, Nanjing

外部人员

Lutz P.

  • CNRS
  • University Bourgogne Franche-Comté
  • FEMTO-ST

外部人员

Sun Hongzhi

  • University of Florida
  • University of Florida

外部人员

Yang Hengzhang

  • Beijing Institute of Technology

外部人员

Todd S. T.

  • University of Florida
  • University of California

外部人员

Zhu Yiping

  • University of Florida

外部人员

Liu Yabing

  • WiO Technology Ltd., Co.
  • Wuxi WiO Technologies Co., Ltd.
  • Wuxi WiO Technologies Co. Ltd
  • WiO Technologies Ltd. Co.

外部人员

Bargiel Sylwester

  • University Bourgogne Franche-Comté
  • FEMTO-ST
  • FEMTO-ST Institute France

外部人员

Liu Hao

  • Southern Medical University

外部人员

Wang Peng

  • Wuxi WiO Technologies Co. Ltd
  • Xi'an Technological University
  • Co.

外部人员

Pan Teng

  • Beijing Institute of Technology

外部人员

Gorecki Christophe

  • University Bourgogne Franche-Comté
  • FEMTO-ST

外部人员

Ngo Khai D.T.

  • Virginia Tech College of Engineering
  • Virginia Polytechnic Institute and State University

外部人员

Struk Przemyslaw

  • University Bourgogne Franche-Comté
  • Silesian University of Technology
  • FEMTO-ST
  • Silesian University of Technology Poland

外部人员

Cao Yingchao

  • Beijing Institute of Technology
  • Wuxi WiO Technologies Co. Ltd
  • Ministry of Education in China

外部人员

Wang Baoping

  • Southeast University, Nanjing

外部人员

Dai Xianjin

  • University of Florida
  • University of Florida

外部人员

Jia Hongzhi

  • University of Shanghai for Science and Technology

外部人员

Guo Zhong Yang

  • Peking University
  • University of Florida

外部人员

Liu Hongqiong

  • WiO Technology Ltd., Co.
  • WiO Technology
  • Wuxi WiO Technologies Co. Ltd
  • WiO Technologies Ltd. Co.

外部人员

Xie Tuqiang

  • Stony Brook University
  • University of Pittsburgh

外部人员

Liu X. S.

  • Peking University
  • University of Florida

外部人员

An Xin

  • Foshan Optomedic Technologies Co., Ltd.
  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics
  • Ltd.

外部人员

Xiao Lei

  • Beijing Institute of Technology

外部人员

Chen Jiapin

  • Shanghai Jiao Tong University

外部人员

Zhao Qian Cheng

  • Peking University

外部人员

Lin Long Tao

  • Peking University

外部人员

Li Xingde

  • Johns Hopkins University
  • Department of Biomedical Engineering

外部人员

Yang Zhen Chuan

  • Peking University

外部人员

Yang Lily

  • Emory University

外部人员

Passilly Nicolas

  • University Bourgogne Franche-Comté
  • FEMTO-ST

外部人员

Zheng Qincheng

  • Beijing Institute of Technology

外部人员

Ding Jinling

  • Wio Technologies Co. Ltd
  • Wuxi WiO Technologies Co., Ltd.
  • Ltd.
  • Ltd.
  • WiO Technology Ltd., Co.

外部人员

Wang Mingliang

  • University of Florida
  • Qualcomm Incorporated
  • University of Florida

外部人员

Gu Min

  • Swinburne University of Technology
  • Royal Melbourne Institute of Technology University

外部人员

Cheng Xiang

  • Xiamen University
  • Key Laboratory of Photoelectric Sensing Technology of Xiamen
  • Key Laboratory of Sensor Technology of Fujian Universities and Colleges

外部人员

Sarntinoranont Malisa

  • University of Florida
  • Department of Mechanical and Aerospace Engineering

外部人员

Watkins Connor

  • University of Florida
  • University of Florida

外部人员

Zhai Liyuan

  • Dalian University of Technology

外部人员

Lee Sung Jin

  • University of Florida
  • Department of Mechanical and Aerospace Engineering

外部人员

Choe Se Woon

  • University of Florida
  • University of Florida

外部人员

Zheng Dong

  • University of Florida

外部人员

Fu Ling

  • Swinburne University of Technology

外部人员

Liu Zhongyi

  • Beijing Institute of Technology
  • Hong Kong University of Science and Technology

外部人员

Guan Le

  • Dalian University of Technology
  • University of Florida

外部人员

Li Mengyuan

  • Beijing Institute of Technology
  • University of Florida

外部人员

Gaiffe Olivier

  • University Bourgogne Franche-Comté
  • FEMTO-ST
  • Université de Franche-Comté

外部人员

Guo Heng

  • Southern University of Science and Technology
  • University of Electronic Science and Technology of China

外部人员

Zhou Ying

  • University of Florida
  • University of Florida

外部人员

Tang Yue

  • Beijing Institute of Technology
  • The University of Texas at Dallas
  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

Chu Jinkui

  • Dalian University of Technology

外部人员

Ren Anrun

  • Beijing Institute of Technology

外部人员

Liu Huan

  • Xi'an Technological University

外部人员

Sorg Brian S.

  • National Institutes of Health
  • University of Florida
  • University of Florida

外部人员

Wang Z. G.

  • Department of Biomedical Engineering
  • Stony Brook University

外部人员

Li Xinling

  • WiO Technology Ltd., Co.
  • Wuxi WiO Technologies Co., Ltd.

外部人员

Frey Wilhelm

  • Robert Bosch Corporation

外部人员

Zhao Hui

  • Ltd.
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • Inc
  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

McManamon P. F.

  • Air Force Research Laboratory
  • University of Dayton
  • Exciting Technology LLC

外部人员

Yuan Jiann S.

  • University of Central Florida
  • University of Central Florida

外部人员

Pais A.

  • University of Florida
  • University of Florida

外部人员

Qi Tingxiang

  • BIT Chongqing Institute of Microelectronics and Microsystems
  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

Liu Sheng

  • Dalian University of Technology

外部人员

Pan Zhiyu

  • Robert Bosch Corporation

外部人员

Yan Yangyang

  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

Sun Boqian

  • Beijing Institute of Technology
  • University of Florida

外部人员

Maley S. B.

  • Air Force Research Laboratory

外部人员

King M. A.

  • University of Florida
  • Pharmacology and Therapeutics

外部人员

Jiang Huabei

  • University of South Florida

外部人员

Shan Tianqi

  • University of Florida
  • University of Florida

外部人员

Crane Carl

  • University of Florida
  • University of Florida

外部人员

Correa Julio

  • Universidad Pontificia Bolivariana
  • University of Florida

外部人员

Li Shiqi

  • Dalian University of Technology

外部人员

Sadat Anwar

  • University of Central Florida
  • University of Central Florida

外部人员

Haidar Darine Abi

  • Université de Paris
  • Université Paris-Saclay
  • Université Paris Cité

外部人员

Zhu Yu

  • Southern Medical University

外部人员

Liu Weiguo

  • Xi'an Technological University

外部人员

Yu Yuanyuan

  • Tianjin University
  • University of Florida

外部人员

Yuan Zhijia

  • Stony Brook University
  • Department of Biomedical Engineering

外部人员

Ural Ant

  • University of Florida
  • University of Melbourne

外部人员

Xu Dacheng

  • Soochow University

外部人员

Waltzer Wayne

  • Stony Brook University

外部人员

Tasneem Zaid

  • University of Florida
  • University of Florida

外部人员

Wu Z. L.

  • Department of Biomedical Engineering
  • Stony Brook University

外部人员

Mehidine Hussein

  • Université Paris-Saclay
  • Université Paris Cité
  • Université de Paris

外部人员

Tang Jianyu

  • Tsinghua University

外部人员

Cranfield Charles

  • Swinburne University of Technology

外部人员

Zhang Ziyue

  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • National University of Singapore
  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

Ma Yifei

  • Beijing Institute of Technology

外部人员

Yu Hongyu

  • Hong Kong University of Science and Technology
  • Arizona State University
  • HKUST Shenzhen-Hong Kong Collaborative Innovation Research Institute
  • Arizona State University

外部人员

Liang Peng

  • WiO Technology Ltd., Co.

外部人员

Yu Xiaomin

  • University of Florida
  • Chengdu University of Information Technology

外部人员

Dooley S. R.

  • Air Force Research Laboratory

外部人员

Zhang Daihua

  • Tianjin University

外部人员

Zivkovic Aleksandar S.

  • University of Florida
  • University of Florida

外部人员

Reed Robert A.

  • Vanderbilt University

外部人员

Watson Edward A.

  • Air Force Research Laboratory

外部人员

Cao Ke

  • Beijing Institute of Technology

外部人员

He Maojiao

  • University of Florida
  • University of Florida

外部人员

Erdmann Lars

  • Carnegie Mellon University
  • Carl Zeiss SMT AG

外部人员

Wang W.

  • Wuxi WiO Technologies Co., Ltd.
  • Wuxi WiO Technologies Co. Ltd

外部人员

Zhang En Xia

  • Vanderbilt University

外部人员

Maarouf Fares

  • Qualcomm Incorporated
  • University of Florida

外部人员

Grobmyer Stephen R.

  • University of Florida

外部人员

Cote Jean Marc

  • University Bourgogne Franche-Comté

外部人员

Hsu Yu Wen

  • Industrial Technology Research Institute of Taiwan

外部人员

Feeder Gary K.

  • Carnegie Mellon University

外部人员

Rabenorosoa K.

  • CNRS
  • University Bourgogne Franche-Comté

外部人员

Qin Shuijie

  • Guizhou University

外部人员

Nishida Toshikazu

  • University of Florida

外部人员

Wang Haopu

  • Beijing Institute of Technology

外部人员

Lee Jeong Bong

  • The University of Texas at Dallas

外部人员

Sui Wen

  • University of Florida

外部人员

Gutwein Luke G.

  • University of Florida

外部人员

Kaisar Tahmid

  • University of Florida
  • Applied Materials Incorporated

外部人员

Wu Yuqing

  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics

外部人员

Jia Yilong

  • Beijing Institute of Technology
  • Ministry of Education in China

外部人员

Zhu Lijun

  • Xiamen University

外部人员

Qu Jiasheng

  • Beijing Institute of Technology

外部人员

Xu N.

  • Wuxi WiO Technologies Co., Ltd.
  • Wuxi WiO Technologies Co. Ltd

外部人员

Schrimpf Ronald D.

  • Vanderbilt University

外部人员

Jiao Rui

  • Hong Kong University of Science and Technology

外部人员

Alles Michael L.

  • Vanderbilt University

外部人员

Cui Yan

  • Dalian University of Technology

外部人员

Frank Michael P.

  • University of Florida
  • University of Florida

外部人员

Li Guoxin

  • Southern Medical University

外部人员

Hao Yunqi

  • Zhengzhou University of Light Industry
  • University of Florida

外部人员

Jin Tian

  • Southern University of Science and Technology
  • University of Electronic Science and Technology of China

外部人员

Rogers J. E.

  • University of Florida

外部人员

Ilegbusi Olusegun

  • University of Central Florida

外部人员

Qi Weizhi

  • Southern University of Science and Technology
  • University of Electronic Science and Technology of China

外部人员

Sun Q.

  • Wuxi WiO Technologies Co., Ltd.
  • Wuxi WiO Technologies Co. Ltd

外部人员

Li M.

  • CAS - Suzhou Institute of Biomedical Engineering and Technology
  • University of Florida

外部人员

Lee Christopher S.D.

  • Stony Brook University

外部人员

Liu Tailong

  • Guizhou University

外部人员

Cui J.

  • Peking University

外部人员

Wu Yihao

  • University of Florida

外部人员

Pinot Laurent

  • Université Paris-Saclay

外部人员

Wang Erkang

  • University of Florida

外部人员

Liu W.

  • Xi'an Technological University

外部人员

Cheng Jin

  • Wuxi WiO Technologies Co., Ltd.
  • Wio Technologies Co. Ltd

外部人员

García-Ramírez Fernando E.

  • University Bourgogne Franche-Comté
  • FEMTO-ST

外部人员

Chen Ruimin

  • University of Southern California
  • University of Southern California

外部人员

Clévy C.

  • CNRS
  • University Bourgogne Franche-Comté
  • FEMTO-ST

外部人员

Fu Linlai

  • WiO Technology Ltd., Co.

外部人员

Zhang Rui

  • University of Florida

外部人员

Zhang Ruihao

  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

Wang B.

  • Southeast University, Nanjing

外部人员

Zhang Jicheng

  • WiO Technology Ltd., Co.
  • Wuxi WiO Technologies Co. Ltd

外部人员

Zhou Zhengwei

  • WiO Technology Ltd., Co.

外部人员

Liu Jingxuan

  • Stony Brook University

外部人员

Liang Mengyue

  • University of Southern California
  • Tianjin University
  • University of Florida

外部人员

Zhou Guangyin

  • University of Florida

外部人员

Liu Yi

  • University of Central Florida
  • University of Central Florida

外部人员

Sun Xinglin

  • Xiamen University

外部人员

Thomas Lenworth

  • University of Florida

外部人员

Bouvet F.

  • Université Paris-Saclay

外部人员

Liu Yan

  • Xiamen University

外部人员

Han Fengtian

  • Tsinghua University
  • University of Florida

外部人员

Liao Wenjun

  • Vanderbilt University

外部人员

Ding H. T.

  • Peking University

外部人员

Johnson Jason Lee

  • University of Florida

外部人员

Wang Xiaoyi

  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

Rolland Jannick P.

  • University of Central Florida
  • University of Rochester

外部人员

Lee Jaesung

  • University of Florida

外部人员

Zhou Qifa

  • University of Southern California
  • University of Southern California

外部人员

Xiao Zhiming

  • Linear Technology Corp

外部人员

Costa Marco

  • University of Florida

外部人员

Fleetwood Daniel M.

  • Vanderbilt University

外部人员

Cheng J.

  • Wuxi WiO Technologies Co., Ltd.
  • Xi'an Technological University
  • Wuxi WiO Technologies Co. Ltd

外部人员

Wang Hua

  • Beijing Institute of Technology
  • Ministry of Education in China

外部人员

Chai Junyu

  • University of Shanghai for Science and Technology
  • Ltd.
  • WiO Technology Ltd., Co.

外部人员

Sternberg Andrew L.

  • Vanderbilt University

外部人员

Yang Gai

  • Beijing Institute of Technology

外部人员

Zhang Hao

  • Wuxi WiO Technologies Co. Ltd
  • Soochow University
  • WiO Technology Ltd., Co.

外部人员

Wang Ruoqin

  • Hong Kong University of Science and Technology

外部人员

Liang Wenxuan

  • Johns Hopkins University
  • University of Science and Technology of China
  • Corning Incorporated

外部人员

Lee Kye Sung

  • University of Central Florida

外部人员

Ling Hang Yin

  • University of Florida

外部人员

Chan D.

  • Johns Hopkins University

外部人员

Shen Chong

  • North University of China
  • Ministry of Education in China

外部人员

Nelson T. R.

  • Air Force Research Laboratory

外部人员

Tang Yiqi

  • University of Florida

外部人员

Butler Lisa

  • University of Florida

外部人员

Cheng J.

  • WiO Technologies Ltd. Co.

外部人员

Tang Jianbo

  • University of Florida

外部人员

Stainsby Aaron

  • University of Florida

外部人员

Shih Wei Chuan

  • University of Houston

外部人员

Yao Lei

  • University of Electronic Science and Technology of China

外部人员

Lendresse Jean Francois

  • Université Paris-Saclay

外部人员

Escuti Michael J.

  • North Carolina State University

外部人员

Lee Yi Kuen

  • Hong Kong University of Science and Technology

外部人员

Gao Xun

  • Beijing Institute of Technology

外部人员

Zhu Xu

  • Carnegie Mellon University
  • IEEE

外部人员

Yun Zhao

  • WiO Technology Ltd., Co.

外部人员

Li Yongsheng

  • Southern Medical University

外部人员

Qi Zhi Mei

  • CAS - Aerospace Information Research Institute
  • CAS - Institute of Electronics
  • State Key Laboratory of NBC Protection for Civilian
  • Chinese Academy of Sciences
  • University of Chinese Academy of Sciences
  • State Key Laboratory of NBC Protection for Civilian

外部人员

Sung Yulung

  • University of Houston

外部人员

Wang Xin

  • Wuxi People's Hospital

外部人员

Reynet Denis

  • Université Paris-Saclay

外部人员

Shen Xiaotian

  • Tianjin University

外部人员

Bai Chenyu

  • Beijing Institute of Technology

外部人员

Li Yinnan

  • Dalian University of Technology

外部人员

An Daren

  • North University of China

外部人员

Li Fenggang

  • Beijing Institute of Technology
  • Advanced Innovation Center for Intelligent Robots and Systems
  • Beijing Advanced Innovation Center for Intelligent Robots and Systems

外部人员

Torres David

  • Michigan State University

外部人员

Gabriel Kaigham J.

  • Carnegie Mellon University
  • IEEE

外部人员

Yang B.

  • University of Florida

外部人员

Yang Baoyan

  • Beijing Institute of Technology

外部人员

Cao Huiliang

  • North University of China
  • Ministry of Education in China

外部人员

Liu L.

  • Zhengzhou University of Light Industry

外部人员

Wang Pan

  • Vanderbilt University

外部人员

Fu Ling

  • Beijing Smart-Chip Microelectronics Technology Co. Ltd.
  • Ltd.
  • Ltd.

外部人员

Xie Fei

  • Xi'an Technological University

外部人员

Liu Hui

  • Dalian Maritime University

外部人员

Barthès Magali

  • University Bourgogne Franche-Comté

外部人员

Wang Xiao

  • Tsinghua University
  • Beijing University of Posts and Telecommunications

外部人员

Li Suiqiong

  • Soochow University

外部人员

Mamat N.

  • University Bourgogne Franche-Comté

外部人员

Gila B. P.

  • University of Florida

外部人员

Chen K. H.

  • University of Florida

外部人员

An Qi

  • North University of China

外部人员

Flint J. J.

  • University of Florida

外部人员

Qi Qiangxian

  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

Gong Zhongjian

  • Wuxi People's Hospital

外部人员

Horodyski Marybeth

  • University of Florida

外部人员

Li Zhijian

  • Tsinghua University

外部人员

Pan Jiong

  • Beijing Institute of Technology

外部人员

Zory Peter

  • University of Florida

外部人员

Hamilton Douglas

  • Lantis Lasers, Incorporated

外部人员

Gong Huiqi

  • Vanderbilt University

外部人员

Zhimin Tan

  • Tsinghua University

外部人员

Chen Huipeng

  • Hangzhou Dianzi University

外部人员

Lu Hangquan

  • Xiamen University

外部人员

Strassle Stephan

  • University of Florida

外部人员

Zhang J.

  • Shanghai Guanghua Hospital of Integrated Traditional Chinese and Western Medicine

外部人员

Subhash G.

  • University of Florida

外部人员

Ma Jun Shan

  • University of Shanghai for Science and Technology

外部人员

Deng Jieyao

  • North University of China

外部人员

Zhao Simeng E.

  • Vanderbilt University

外部人员

Duan Xuexin

  • Tianjin University

外部人员

Jin Rencheng

  • Dalian University of Technology

外部人员

Heikenfeld Jason

  • University of Cincinnati

外部人员

Zhang Xinyuan

  • Beijing Institute of Technology

外部人员

Fu Guoqing

  • University of Florida

外部人员

Wu Yekai

  • Ministry of Education in China
  • Beijing Institute of Technology

外部人员

Johnson J. W.

  • Nitronex Corporation

外部人员

Zhou Lingfeng

  • Beijing Institute of Technology

外部人员

Anantharam Venkiteswaran

  • University of Florida

外部人员

Ji Chang Yin

  • Beijing Institute of Technology
  • China Academy of Engineering Physics

外部人员

Serati Steve

  • Boulder Nonlinear Systems, Inc.

外部人员

Huang Haipeng

  • Southern Medical University

外部人员

Tonks Catherine A.

  • University of Florida

外部人员

Billard Alain

  • University Bourgogne Franche-Comté

外部人员

Piner E. L.

  • Nitronex Corporation

外部人员

Qian Peixin

  • Tsinghua University

外部人员

Kim Jason

  • Stony Brook University

外部人员

Ding Y.

  • Beijing Institute of Technology

外部人员

Liu Junwen

  • Soochow University
  • Ltd.

外部人员

Chen Yanping

  • Xiamen University
  • University of Florida

外部人员

Lin Li

  • Wuxi WiO Technologies Co. Ltd

外部人员

Su Yuwen

  • Beijing Institute of Technology

外部人员

Zeidel M.

  • University of Pittsburgh

外部人员

Chen Yongtai

  • Dalian University of Technology

外部人员

Adler H.

  • Stony Brook University

外部人员

Jordan Jonathan D.

  • University of Florida

外部人员

Bai Minyu

  • Xi'an Technological University

外部人员

Yang Yang

  • Tianjin University

外部人员

Xiaomin Yu

  • Chengdu University of Information Technology

外部人员

Yu Jiang

  • Southern Medical University

外部人员

Yan Z.

  • Fudan University

外部人员

Natarajan Krishna

  • University of Florida

外部人员

Ling Carrie Hang Yin

  • University of Florida

外部人员

Sepulveda Nelson

  • Michigan State University

外部人员

Park Hyeon Cheol

  • Johns Hopkins University
  • Department of Biomedical Engineering

外部人员

Coleman Jason E.

  • University of Florida

外部人员

Litian Liu

  • Tsinghua University

外部人员

Wisea Brent T.

  • University of Florida

外部人员

de Rosset Lauren E.

  • Carnegie Mellon University

外部人员

Liu Yan

  • Jimei University

外部人员

Lu Yao

  • Beijing Institute of Technology

外部人员

Schumann Arnold W.

  • University of Florida

外部人员

Zhang Jun

  • University of California at San Diego

外部人员

Zhijian Li

  • Tsinghua University

外部人员

Song Chaolong

  • China University of Geosciences, Wuhan

外部人员

Lin Wei

  • Dalian University of Technology

外部人员

Su Shaohui

  • Hangzhou Dianzi University

外部人员

Wanlin Eric

  • Université Paris-Saclay

外部人员

Wang Dan

  • Tsinghua University

外部人员

Young Darrin J.

  • Case School of Engineering

外部人员

Bai Yunkai

  • University of Florida

外部人员

Cai Ziru

  • Beijing Institute of Technology
  • School of Integrated Circuits and Electronics
  • University of Southern Denmark

外部人员

Li Xuejiao

  • Beijing Institute of Technology

外部人员

Lan S.

  • WiO Technologies Ltd. Co.

外部人员

Guo Qiang

  • Tsinghua University

外部人员

Arutt Charles N.

  • Vanderbilt University

外部人员

Li Guoxing

  • Southern Medical University

外部人员

Lin Elaine

  • University of Florida

外部人员

Rutkowski Jaroslaw

  • University Bourgogne Franche-Comté

外部人员

Ding J.

  • WiO Technologies Ltd. Co.

外部人员

Zhang Dao Hua

  • Nanyang Technological University

外部人员

Berceli Scott A.

  • University of Florida

外部人员

Luo Site

  • WiseViewer Technology Co. Ltd

外部人员

Hu Siyi

  • CAS - Suzhou Institute of Biomedical Engineering and Technology
  • University of Cambridge

外部人员

Jiang Lei

  • Honeywell

外部人员

Kang Huaizhi

  • University of Florida
  • Xiamen University

外部人员

Han Xiaoyan

  • WiO Technology

外部人员

Ren Hugang

  • Stony Brook University

外部人员

Godara Manish

  • University of Florida

外部人员

Li Yifan

  • Beijing Institute of Technology

外部人员

Burks Thomas F.

  • University of Florida

外部人员

Morrish Dru

  • Swinburne University of Technology

外部人员

Esnault C.

  • Université Paris-Saclay

外部人员

Li G. M.

  • The University of Hong Kong

外部人员

Zhang Dawei

  • University of Shanghai for Science and Technology

外部人员

Peng Zhangming

  • Hangzhou Dianzi University

外部人员

Cabodevila Gonzalo

  • University Bourgogne Franche-Comté

外部人员

Linthicum K. J.

  • Nitronex Corporation

外部人员

Ren F.

  • University of Florida

外部人员

Roberts J. C.

  • Nitronex Corporation

外部人员

Aradhya Medini

  • University of Florida

外部人员

Xu Shun

  • Key Laboratory of Sensor Technology of Fujian Universities and Colleges
  • Key Laboratory of Photoelectric Sensing Technology of Xiamen
  • Xiamen University

外部人员

Strassle Rojas Stephan

  • University of Florida

外部人员

Ma Junshan

  • University of Shanghai for Science and Technology

外部人员

Jozwik Michal

  • Warsaw University of Technology

外部人员

Yu Chuanzhao

  • University of Central Florida

外部人员

McCurdy Michael W.

  • Vanderbilt University

外部人员

Ma Hanbin

  • CAS - Suzhou Institute of Biomedical Engineering and Technology
  • University of Cambridge

外部人员

Li Boxiao

  • University of Florida

外部人员

Liu Qiangqiang

  • Beijing Institute of Technology

外部人员

Zhang Cher Xuan

  • Vanderbilt University

外部人员

Pozzic Antonio

  • University of Florida

外部人员

Lou Zhuoge

  • Xiamen University

外部人员

Bos Philip J.

  • Kent State University

外部人员

Sun Xiqing

  • Tsinghua University

外部人员

Dantu Karthik

  • University at Buffalo

外部人员

Haris Mohd

  • School of Engineering and Computer Science

外部人员

Lau W.

  • WiOptix, Inc.
  • University of Florida

外部人员

Pu Jia

  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

Linjia Zhang

  • Chengdu University of Information Technology

外部人员

Schueller John K.

  • University of Florida

外部人员

Jiang Peng

  • Hong Kong University of Science and Technology

外部人员

Li Yahong

  • Dalian University of Technology

外部人员

Chen Fang

  • Carnegie Mellon University

外部人员

Tian Z.

  • Xiamen University

外部人员

Kang Hongxiang

  • Academy of Military Medical Science China

外部人员

Cheung Yik Kin

  • Hong Kong University of Science and Technology

外部人员

Hu Hanqi

  • Beijing Institute of Technology

外部人员

Yang Kun

  • Zhengzhou University of Light Industry

外部人员

Zheng Ming

  • Xiamen University

外部人员

Wang Tongyu

  • Michigan State University

外部人员

Chen Hongwei

  • Tsinghua University

外部人员

Wang Ziyan

  • Southern University of Science and Technology

外部人员

Wai P. K.A.

  • Hong Kong Polytechnic University

外部人员

Wang Zhihua

  • Tsinghua University

外部人员

Lu Cheng Kuan

  • Case School of Engineering

外部人员

Li Hang

  • Beijing Institute of Technology
  • Ministry of Education in China

外部人员

Qi Jiali

  • Hangzhou Dianzi University

外部人员

Teuma Eric Valaski

  • University of Central Florida

外部人员

Lu Guo Quan

  • Virginia Tech College of Engineering

外部人员

Cai Hong

  • Dalian University of Technology

外部人员

An Yan

  • Xi'an Technological University
  • Wuxi WiO Technologies Co. Ltd

外部人员

Cui Ke

  • North University of China

外部人员

Zhang Peiqi

  • Dalian University of Technology

外部人员

Cao Jiqiang

  • Beijing Institute of Technology

外部人员

Butler Elizabeth

  • University of Florida

外部人员

Min Min

  • University of Florida

外部人员

Lee Won Suk

  • University of Florida

外部人员

Zhao Ruifan

  • Beijing Institute of Technology

外部人员

Gao Hongxin

  • Beijing Institute of Technology

外部人员

Viaud Tony

  • Université Paris-Saclay

外部人员

Chen Xiaohong

  • Xiamen University
  • University of Florida

外部人员

Tang Yue

  • Beijing Institute of Technology

外部人员

Xue Yuan

  • Beijing Institute of Technology

外部人员

Yuan X. C.

  • The University of Hong Kong

外部人员

Tan Xiaobo

  • Michigan State University

外部人员

Yuan Wu

  • Johns Hopkins University
  • Chinese University of Hong Kong

外部人员

Batarseh Issa

  • University of Central Florida

外部人员

Guob Shuguang

  • University of Florida

外部人员

Chen Chang

  • Hangzhou Dianzi University

外部人员

Guo Xiaolin

  • Shanghai University

外部人员

Usmani F.

  • University of Florida

外部人员

Feng Xiaoxing

  • University of Florida

外部人员

Virendrapal A. S.

  • University of Florida

外部人员

Reynolds Jeremy

  • Peter Maccallum Cancer Centre

外部人员

Zhao Menglei

  • Beijing Institute of Technology

外部人员

Adhivarahan Charuvahan

  • University at Buffalo

外部人员

Ni Kai

  • Vanderbilt University

外部人员

Yoon Y. K.

  • University of Florida

外部人员

Xiao Lei

  • University of Florida

外部人员

Zhao Yinghao

  • Beijing Institute of Technology

外部人员

Fox Robert M.

  • University of Florida

外部人员

Li C. Y.

  • Hong Kong Polytechnic University

外部人员

Qian Weipin

  • Emory University

外部人员

Chenjie Chee

  • Tsinghua University

外部人员

Thiemanc Kelley

  • University of Florida

外部人员

Wang Zhaoyuan

  • Beijing Institute of Technology

外部人员

Li Zhi

  • University of Florida

外部人员

Sulouff Robert E.

  • Analog Devices, Inc.

外部人员

Deng Haijun

  • Southern Medical University

外部人员

Thieman Kelley M.

  • University of Florida

外部人员

Wensong Luo

  • Chengdu University of Information Technology

外部人员

Jing Qi

  • Carnegie Mellon University

外部人员

Qin Z.

  • WiO Technologies Ltd. Co.

外部人员

Mirecki Bartosz

  • Warsaw University of Technology

外部人员

Kopa Anthony

  • University of Florida

外部人员

Zhang Xinchao

  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

Chutani Ravinder

  • University Bourgogne Franche-Comté

外部人员

Zhao Jijie

  • Xi'an Technological University

外部人员

Shuping Alexander

  • University of Florida

外部人员

Han Xinyuan

  • Beijing Institute of Technology

外部人员

Horodyskia Mary Beth

  • University of Florida

外部人员

Koehler Chuck

  • University of Central Florida

外部人员

Feng Yongjian

  • Xiamen University

外部人员

Zhang Yi

  • Shangdong University of Science and Technology

外部人员

Guo Zongliang

  • Beijing Institute of Technology

外部人员

Chen Yanpin

  • Xiamen University
  • University of Florida

外部人员

Liu Litian

  • Tsinghua University

外部人员

Pearton S. J.

  • University of Florida

外部人员

Zhai Feng Xiao

  • Zhengzhou University of Light Industry

外部人员

Deng Yang

  • Hong Kong University of Science and Technology

外部人员

Boussioutas Alex

  • Swinburne University of Technology
  • Peter Maccallum Cancer Centre

外部人员

Zamkotsian Frederic

  • Laboratoire d'Astrophysique de Marseille

外部人员

Liu Haobing

  • Beijing Institute of Technology

外部人员

Jiao Wenlong

  • BIT Chongqing Institute of Microelectronics and Microsystems

外部人员

Ye Jinhui

  • Key Laboratory of Sensor Technology of Fujian Universities and Colleges
  • Key Laboratory of Photoelectric Sensing Technology of Xiamen
  • Xiamen University

外部人员

Rajagopal P.

  • Nitronex Corporation

外部人员

Zhang Ran

  • Dalian University of Technology

外部人员

Johnson Eric G.

  • University of Central Florida

外部人员

Zhou Guangya

  • National University of Singapore

外部人员

Luo Jiawen

  • Beijing Institute of Technology

外部人员

Johnson J.

  • University of Florida

外部人员

Deng Ning

  • Beijing Institute of Technology

外部人员

He Bin

  • University of Florida

外部人员

Chen Chao

  • Beijing Institute of Technology

外部人员

Li Xinguo

  • Southern Medical University

外部人员

Li V. O.K.

  • The University of Hong Kong

外部人员

Zhang Gang

  • Carnegie Mellon University

外部人员

Ding Yingtao

  • Beijing Institute of Technology

外部人员