Yongjun Huo

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348

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32 文章
15 会议稿件
1 章节
1 社论
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50 个结果

2025
A perspective on mechanism of heat transfer and performance optimization in advanced thermal interface materials
Liang, C., Hong, J., Wan, C., Ma, X., Wang, Z., Zhao, X., Hou, A., Nika, D., Huo, Y. & Zhang, G., 17 2月 2025, 在: Applied Physics Letters. 126, 7, 070501.
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A portable design and demonstration of two-stage thermoelectric cooling system for 200 K cryogenic applications
Hu, S., Song, J., Wu, C., Lei, T., Li, H., Shi, S., Zhao, X., Zhang, G. & Huo, Y., 1 6月 2025, 在: Applied Thermal Engineering. 268, 125838.
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Low-temperature Solid-state Bonding of Micro-bumps Arrays with Flat-to-Convex Structure via Plasma-induced Silver Oxide Nanoparticles
Wang, T., Gu, S., Liu, S., Xie, X., Zhao, S., Lin, P., Qu, Z., Wang, Y., Zhao, X., Zhang, G., Huo, Y. & Lee, C. C., 2025, (已接受/待刊) 在: IEEE Transactions on Components, Packaging and Manufacturing Technology.
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Plasticity trends in Ag-based disordered solid solutions from first principles
Zhao, S., Zheng, B., Gu, S., Wang, T., Xie, X., Wang, Y., Li, H., Shi, S., Zhao, X. & Huo, Y., 8月 2025, 在: Vacuum. 238, 114285.
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The anti-electrochemical migration mechanism of Ag-based transient liquid-phase electrically conductive adhesive: Experimental and phase-field study
Zhao, S., Yang, M., Liu, Y., Cao, C., Liang, C., Zhang, D., Zhao, X., Zhang, G. & Huo, Y., 1 7月 2025, 在: Applied Surface Science. 696, 162998.
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1 引用（Scopus）
2024
A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging
Hu, S., Song, J., Liu, Y., Wu, C., Lei, T., Ge, A., Zhang, D., Zhao, X., Huo, Y. & Lee, C. C., 1 2月 2024, 在: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 2, 页码 328-341 14 页码
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A Low-Temperature Ag-Ag Direct Bonding Technology Towards Ten-Thousand-Level Microbumps Arrays Utilizing Plasma-Induced Grown Nanoparticles of Silver Oxide
Wang, T., Xie, X., Gu, S., Liu, S., Zhao, S., Gao, W., Lin, P., Xu, S., Qu, Z., Wang, Y., Zhao, X. & Huo, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024. Institute of Electrical and Electronics Engineers Inc., (2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024).
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A Novel Layer Structural Design for Silver-indium Transient Liquid Phase Bonding Technology by Introducing a Diffusion Barrier
Zhang, D., Zhang, Y., Zhao, S., Song, J., Chen, X., Xu, T., Tian, X., Zhao, X. & Huo, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024. Institute of Electrical and Electronics Engineers Inc., (2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024).
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Effect of Size-controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive
Liang, C., Yang, M., Wang, Z., Wan, C., Xu, S., Xie, X., Lin, P., Qu, Z., Wang, Y., Zhao, X., Huo, Y. & Zhang, G., 2024, Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. Shin, S., Toh, C. H., Lim, Y. K., Chidambaram, V. & Chui, K. J. (编辑). Institute of Electrical and Electronics Engineers Inc., 页码 991-996 6 页码 (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024).
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Fabrication and characterization of Sn-57 wt.% Bi film by pulse DC current co-electrodeposition and reflow
Ye, Z. T., Zhao, X., Dong, Y., Wu, X., Dong, Z. T. & Huo, Y., 3月 2024, 在: Materials Today Communications. 38, 108155.
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Mechanical properties and microstructure evolution of Sn–Bi-based solder joints by microalloying regulation mechanism
Wu, X., Hou, Z., Xie, X., Lin, P., Huo, Y., Wang, Y. & Zhao, X., 1 7月 2024, 在: Journal of Materials Research and Technology. 31, 页码 3226-3237 12 页码
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Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions
Fang, Y., Wang, T., Gu, Y., Yang, M., Li, H., Shi, S., Zhao, X. & Huo, Y., 4月 2024, 在: Materials. 17, 7, 1658.
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Sputtering of (111) highly-oriented nanotwinned Ag on polycrystalline Si₃N₄ substrates for high-power electronic packaging
Zhang, D., Zhang, Y., Song, J., Zhao, S., Xu, T., Tian, X., Zhao, X. & Huo, Y., 12月 2024, 在: Surfaces and Interfaces. 55, 105329.
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Study on Microstructure and Mechanical Properties of Silver and Silver-Indium Solid Solution Films Using Magnetron Sputtering
Zhao, S., Lin, P., Zhang, D., Wang, T., Liu, S., Xie, X., Xu, S., Qu, Z., Wang, Y., Zhao, X. & Huo, Y., 2024, Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. Shin, S., Toh, C. H., Lim, Y. K., Chidambaram, V. & Chui, K. J. (编辑). Institute of Electrical and Electronics Engineers Inc., 页码 817-822 6 页码 (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024).
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Study on the plasticity enhancing mechanism of silver-based solid solution for electronic packaging
Zhao, S., Zheng, B., Zhang, D., Xie, X., Qu, Z., Wang, Y., Zhao, X., Lee, C. C. & Huo, Y., 1 5月 2024, 在: Journal of Materials Research and Technology. 30, 页码 4600-4611 12 页码
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Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging
Song, J., Zhang, D., Chen, X., Hu, S., Zhao, X., Lee, C. C. & Huo, Y., 4月 2024, 在: Materials Characterization. 210, 113793.
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7 引用（Scopus）
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2023

Advanced Electronic Packaging Technology: From Hard to Soft
Gu, Y. & Huo, Y., 3月 2023, 在: Materials. 16, 6, 2346.
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10 引用（Scopus）
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A phase-field model of electrochemical migration for silver-based conductive adhesives
Cao, C., Yang, M., Liang, C., Zhang, D., Chen, X., Zhao, X., Lee, C. C. & Huo, Y., 10 12月 2023, 在: Electrochimica Acta. 471, 143388.
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9 引用（Scopus）
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A Thin Film Metallization Process Development for Silicon Nitride Ceramic Substrates in Power Electronics Packaging
Chen, X., Zhang, D., Song, J., Xu, T., Tian, X., Zhao, X. & Huo, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).
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Atomistic insights into silver-indium solid solution softening mechanism for microelectronics packaging
Zhao, S., Zheng, B., Zhang, D., Xie, X., Qu, Z., Wang, Y., Zhao, X., Wu, J., Lee, C. C. & Huo, Y., 1 5月 2023, 在: Journal of Materials Research and Technology. 24, 页码 6065-6075 11 页码
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13 引用（Scopus）
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Comparison between bulk and particle solder alloy on the performance of low-melting solder joints
Yang, M., Zhao, X., Huo, Y., Tu, K. N. & Liu, Y., 1 5月 2023, 在: Journal of Materials Research and Technology. 24, 页码 71-80 10 页码
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Liquid metal-based flexible and wearable thermoelectric cooling structure and cooling performance optimization
投稿的翻译标题: 液态金属基柔性可穿戴热电冷却结构及冷却性能优化Yang, M., Li, G., Gu, Y., Song, J., Li, H., Zhao, X. & Huo, Y., 10月 2023, 在: Science China Materials. 66, 10, 页码 4001-4011 11 页码
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8 引用（Scopus）
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Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling
Wu, X., Hou, Z., Xie, X., Lin, P., Huo, Y., Wang, Y. & Zhao, X., 1 9月 2023, 在: Journal of Materials Research and Technology. 26, 页码 1382-1396 15 页码
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Plasma-induced growth mechanism of surface-state silver oxide in nanoscale for low-temperature bonding technology
Wang, T., Gu, S., Fang, Y., Zhang, D., Xie, X., Qu, Z., Wang, Y., Zhao, X., Wu, J., Lee, C. C. & Huo, Y., 5月 2023, 在: Materials Characterization. 199, 112830.
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8 引用（Scopus）
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Room-temperature, rapid, solid-state solder bonding technology for future ultra-high-density interconnects manufacturing
Yang, M., Huo, Y., Zhao, X., Guo, Y. & Liu, Y., 1 7月 2023, 在: Journal of Materials Research and Technology. 25, 页码 999-1010 12 页码
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Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances
Yang, M., Liu, Y. X., Zhang, D., Cao, C., Zhao, X. & Huo, Y., 14 4月 2023, 在: ACS Applied Polymer Materials. 5, 4, 页码 2760-2773 14 页码
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Study on surge current characteristic of SiC SBD with different solder layer structure
Hu, Z., Wang, Y., Zhao, X., Huo, Y. & Tang, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).
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The reliability study on electrochemical migration evaluations for common substrates in power electronics
Yang, M., Zhang, D., Cao, C., Xu, T., Tian, X., Zhao, X. & Huo, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).
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Wafer-Scale Fabrication of CMOS-Compatible Trapping-Mode Infrared Imagers with Colloidal Quantum Dots
Zhang, S., Bi, C., Qin, T., Liu, Y., Cao, J., Song, J., Huo, Y., Chen, M., Hao, Q. & Tang, X., 15 3月 2023, 在: ACS Photonics. 10, 3, 页码 673-682 10 页码
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47 引用（Scopus）
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2022
A Laser Assisted Bonding Process Design with Silver-indium Transient Liquid Phase Method for the Infrared Detectors Hermetic Packaging
Song, J., Hu, S., Liu, Y., Ge, A., Zhang, D., Zhao, X. & Huo, Y., 2022, 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022).
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4 引用（Scopus）
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Alloying regulation mechanism toward microstructure evolution of Sn-bi-based solder joint under current stress
Hou, Z., Zhao, X., Wang, Y., Gu, Y., Tan, C., Xie, X., Huo, Y. & Liu, Y., 9月 2022, 在: Materials Characterization. 191, 112094.
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13 引用（Scopus）
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Enhancement mechanism of Te doping on microstructure, wettability and mechanical properties of Sn–Bi-based solder
Hou, Z., Zhao, X., Gu, Y., Tan, C., Huo, Y., li, H., Shi, S. & Liu, Y., 19 7月 2022, 在: Materials Science and Engineering: A. 848, 143445.
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24 引用（Scopus）
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Interconnect
Huo, Y., Liu, Y. & Ouyang, F. Y., 1 1月 2022, Advanced Driver Assistance Systems and Autonomous Vehicles: From Fundamentals to Applications. Springer Nature, 页码 181-212 32 页码
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2 引用（Scopus）
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2021
210°C reflow technology study in 3D Packaging
Sun, L., Dong, Y., Hou, Z., Zhao, X., Huo, Y., Liu, Y. & Liu, Y., 14 9月 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).
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A first-principles computation-driven mechanism study on the solders dilute doping effects to η’-Cu₆Sn₅ growth kinetics
Wang, Y., Dong, Y., Zhao, X., Huo, Y. & Liu, Y., 6月 2021, 在: Journal of Materials Science. 56, 16, 页码 9741-9753 13 页码
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12 引用（Scopus）
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A Process Improvement in Silver-indium Transient Liquid Phase Bonding Method for the High-Power Electronics and Photonics Packaging
Zhang, D., Zhao, X., Liu, Y., Liu, Y. & Huo, Y., 14 9月 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).
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4 引用（Scopus）
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Low Temperature VECSEL-to-Diamond Heterogeneous Integration with Ag-In Spinodal Nanostructured Layer
Sheikhi, R., Huo, Y., Shi, F. G. & Lee, C. C., 15 3月 2021, 在: Scripta Materialia. 194, 113628.
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16 引用（Scopus）
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Undercooling and microstructure analysis for the design of low melting point solder
Pu, L., Huo, Y., Zhao, X., Tu, K. N. & Liu, Y., 8 4月 2021, 2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021. Institute of Electrical and Electronics Engineers Inc., 9420953. (2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021).
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2020
Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure
Sheikhi, R., Huo, Y., Tsai, C. H., Kao, C. R., Shi, F. G. & Lee, C. C., 1 5月 2020, 在: Journal of Materials Science: Materials in Electronics. 31, 10, 页码 8059-8071 13 页码
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11 引用（Scopus）
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2019
Exploring the DBR superlattice effect on the thermal performance of a VECSEL with the finite element method
Huo, Y., Cho, C. Y., Huang, K. F., Chen, Y. F. & Lee, C. C., 15 1月 2019, 在: Optics Letters. 44, 2, 页码 327-330 4 页码
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Fluxless bonding technique of diamond to copper using silver-indium multilayer structure
Sheikhi, R., Huo, Y. & Lee, C. C., 5月 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., 页码 150-156 7 页码 8811224. (Proceedings - Electronic Components and Technology Conference; 卷 2019-May).
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2018
Complete elimination of Ag₃Al in Ag wire bonds on Al by alloying In into Ag
Wu, J., Huo, Y. & Lee, C. C., 10月 2018, 在: Materialia. 2, 页码 82-97 16 页码
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Direct Ag-Ag bonding by in-situ reduction of surface oxides for advanced chip-package interconnection
Wu, J., Huo, Y. & Lee, C. C., 12月 2018, 在: Materialia. 4, 页码 417-422 6 页码
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Solid solution softening and enhanced ductility in concentrated FCC silver solid solution alloys
Huo, Y., Wu, J. & Lee, C. C., 27 6月 2018, 在: Materials Science and Engineering: A. 729, 页码 208-218 11 页码
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2017
Bondable Copper Substrates with Silver Solid Solution Coatings for High-Power Electronic Applications
Huo, Y. & Lee, C. C., 1 8月 2017, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc., 页码 166-172 7 页码 7999687. (Proceedings - Electronic Components and Technology Conference).
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Study of Anti-Tarnishing Mechanism in Ag-In Binary System by Using Semi-Quantum-Mechanical Approach
Huo, Y., Wu, J. & Lee, C. C., 2017, 在: Journal of the Electrochemical Society. 164, 7, 页码 C418-C427
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2016
A reaction study of sulfur vapor with silver and silver–indium solid solution as a tarnishing test method
Huo, Y., Fu, S. W., Chen, Y. L. & Lee, C. C., 1 10月 2016, 在: Journal of Materials Science: Materials in Electronics. 27, 10, 页码 10382-10392 11 页码
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Design and Fabrication of Silver Solid Solution Layer on Silicon and Its Solid-State Bonding Applications
Chen, Y. L., Huo, Y. & Lee, C. C., 16 8月 2016, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 页码 420-425 6 页码 7545466. (Proceedings - Electronic Components and Technology Conference; 卷 2016-August).
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The growth and stress vs. strain characterization of the silver solid solution phase with indium
Huo, Y. & Lee, C. C., 15 3月 2016, 在: Journal of Alloys and Compounds. 661, 页码 372-379 8 页码
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2015
Anti-tarnishing evaluations of silver solid solution phase with indium
Huo, Y. & Lee, C. C., 15 7月 2015, 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Institute of Electrical and Electronics Engineers Inc., 页码 2180-2187 8 页码 7159905. (Proceedings - Electronic Components and Technology Conference; 卷 2015-July).
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