Interconnect

Yongjun Huo; Yingxia Liu; Fan Yi Ouyang

doi:10.1007/978-981-19-5053-7_6

Interconnect

Yongjun Huo, Yingxia Liu, Fan Yi Ouyang^*

^*此作品的通讯作者

材料学院

科研成果: 书/报告/会议事项章节 › 章节 › 同行评审

2 引用（Scopus）

摘要

Interconnect could provide physical and logical connection between two electronic devices with interconnect with affordable quality and reliability, and thus interconnect is critical for the development of Advanced Driver Assistance Systems (ADAS). In this chapter, interconnects and solder joint technology for applications under the hood are reviewed. In addition, the bonding techniques by using Cu-Cu direct bonding and hybrid bonding are presented.

源语言	英语
主期刊名	Advanced Driver Assistance Systems and Autonomous Vehicles
主期刊副标题	From Fundamentals to Applications
出版商	Springer Nature
页	181-212
页数	32
ISBN（电子版）	9789811950537
ISBN（印刷版）	9789811950520
DOI	https://doi.org/10.1007/978-981-19-5053-7_6
出版状态	已出版 - 1 1月 2022

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10.1007/978-981-19-5053-7_6

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Interconnect

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