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Effects of In/Ce to Sn-3.5Ag lead-free solder on microstructures and properties
Enjia Chen*, Xiuchen Zhao, Ying Liu, Dongmei Li, Jingwei Cheng, Hong Li
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
3
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(Scopus)