Effects of In/Ce to Sn-3.5Ag lead-free solder on microstructures and properties

Enjia Chen*, Xiuchen Zhao, Ying Liu, Dongmei Li, Jingwei Cheng, Hong Li

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

3 引用 (Scopus)

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Engineering

Material Science