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Atomistic insights into silver-indium solid solution softening mechanism for microelectronics packaging
Shuang Zhao, Bing Zheng, Donglin Zhang, Xiaochen Xie, Zhibo Qu, Yong Wang, Xiuchen Zhao, Jiaqi Wu, Chin C. Lee, Yongjun Huo*
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
9
Citations
(Scopus)