A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging

Shizun Hu, Jiaqi Song, Yu Liu, Chenran Wu, Tianhao Lei, Anxu Ge, Donglin Zhang, Xiuchen Zhao, Yongjun Huo*, Chin C. Lee

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

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