A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging

Shizun Hu, Jiaqi Song, Yu Liu, Chenran Wu, Tianhao Lei, Anxu Ge, Donglin Zhang, Xiuchen Zhao, Yongjun Huo*, Chin C. Lee

*此作品的通讯作者

科研成果: 期刊稿件 › 文章 › 同行评审

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