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Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging
Jiaqi Song, Donglin Zhang, Xin Chen, Shizun Hu, Xiuchen Zhao, Chin C. Lee, Yongjun Huo*
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
5
Citations
(Scopus)