Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

Mingkun Yang, Ying Xia Liu, Donglin Zhang, Chenrui Cao, Xiuchen Zhao, Yongjun Huo*

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

9 Citations (Scopus)

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