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Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2nanoparticles
Yanni Wen, Xiuchen Zhao*, Zhuo Chen, Yue Gu, Yong Wang, Zhiwei Chen, Xinyuan Wang
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
50
Citations
(Scopus)