Fingerprint
Dive into the research topics of 'Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure
Roozbeh Sheikhi, Yongjun Huo*, Chin Hao Tsai, C. R. Kao, Frank G. Shi, Chin C. Lee
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
11
Citations
(Scopus)