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Nickel nanoparticles mediated growth of the intermetallic compound between Sn-1.0Ag-Xni solders alloy and Cu substrate
Xue Chao Zhang, Jing Wei Cheng, Bing Zheng, Xiu Chen Zhao*, Ying Liu, Ping Chen
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
2
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(Scopus)