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Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling
Xuefeng Wu, Zhuangzhuang Hou, Xiaochen Xie, Pengrong Lin, Yongjun Huo, Yong Wang*, Xiuchen Zhao*
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
2
Citations
(Scopus)