Effects of Ge addition on the growth of interfacial Ni3Sn4 IMC in the Sn58Bi/Ni solder joint: First-principles and Experimental Investigations

Shasha Zhang*, Ziting Ye, Yuhang Wei, Bo Sheng, Zhaoteng Dong, Bing Zheng*, Xiuchen Zhao*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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