Effects of α-Fe2O3 Additions on Assembly Reliability of Electroplated Sn-Based Solder Cap on Cu Pillar Bump During Thermal Cycling

Lijun Liu, Xiuchen Zhao*, Ping Chen, Ying Liu, Yong Wang, Weiwei Chen, Jiaqi Wu

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

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