Effects of α-Fe2O3 Additions on Assembly Reliability of Electroplated Sn-Based Solder Cap on Cu Pillar Bump During Thermal Cycling
Lijun Liu, Xiuchen Zhao*, Ping Chen, Ying Liu, Yong Wang, Weiwei Chen, Jiaqi Wu
*此作品的通讯作者
科研成果: 期刊稿件 › 文章 › 同行评审
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