Fingerprint
Dive into the research topics of 'Effect of pad geometry on current density and temperature distributions in solder bump joints'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Effect of pad geometry on current density and temperature distributions in solder bump joints
Yi Li, Xiu Chen Zhao*, Ying Liu, Hong Yang Li
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review