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Effect of Ag addition on growth of the interfacial intermetallic compounds between Sn-0.7Cu solder and Cu substrate
Xiao Chen Xie*, Xiu Chen Zhao, Ying Liu, Jing Wei Cheng, Bing Zheng, Yue Gu
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
3
Citations
(Scopus)