Comparison between bulk and particle solder alloy on the performance of low-melting solder joints

Mingkun Yang, Xiuchen Zhao, Yongjun Huo, King Ning Tu, Yingxia Liu*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Comparison between bulk and particle solder alloy on the performance of low-melting solder joints'. Together they form a unique fingerprint.

Material Science