Calculated based on number of publications stored in Pure and citations from Scopus
20092024

Research activity per year

Network

Payam Heydari

  • University of California at Irvine

External person

Ziyue Zhang

  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • National University of Singapore
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Chun Cheng Wang

  • University of California at Irvine
  • Peregrine Semiconductor (pSemi)

External person

Yangyang Yan

  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Miao Xiong

  • Beijing Institute of Technology

External person

Lei Xiao

  • Beijing Institute of Technology

External person

An'an Li

  • Beijing Institute of Technology
  • Tsinghua University

External person

Baoyong Chi

  • Tsinghua University

External person

Ziru Cai

  • Beijing Institute of Technology
  • School of Integrated Circuits and Electronics
  • University of Southern Denmark

External person

Zhiqiang Cheng

  • Beijing Institute of Technology

External person

Xiaoyan Gui

  • Beijing Institute of Technology

External person

Zhifang Liu

  • Beijing Institute of Technology
  • Tsinghua University

External person

Zicheng Liu

  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microeletronics and Microsystems
  • Department of Silicon-Based High-Speed System on Chip
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Shiwei Wang

  • Beijing Institute of Technology

External person

Baoyan Yang

  • Beijing Institute of Technology

External person

Jiayue Wan

  • Beijing Institute of Technology

External person

Mingjie Li

  • Beijing Institute of Technology

External person

Han Wang

  • University of Southern California
  • Beijing Institute of Technology
  • Guangdong University of Technology

External person

Fang Han

  • Beijing Institute of Technology

External person

Shiyan Sun

  • Beijing Institute of Technology
  • Tsinghua University

External person

Quanwen Qi

  • Beijing Institute of Technology
  • Department of Silicon-Based High-Speed System on Chip
  • BIT Chongqing Institute of Microelectronics and Microsystems

External person

Wang Xinghua

  • Beijing Institute of Technology

External person

Hua Dang

  • Beijing Institute of Technology

External person

Vipul Jain

  • SaberTek Inc.
  • University of California at Irvine

External person

Xiao Li

  • China Electronics Technology Group Corporation
  • Beijing Institute of Technology

External person

Bohao Li

  • Beijing Institute of Technology

External person

Yuwen Su

  • Beijing Institute of Technology

External person

Lei Zhou

  • University of California at Irvine
  • Quantenna Communications Inc.

External person

Peng Gao

  • Beijing Institute of Technology

External person

Zipeng Chen

  • Beijing Institute of Technology
  • Tsinghua University

External person

Zhongyang Liu

  • Beijing Institute of Technology

External person

Xuzhi Liu

  • Beijing Institute of Technology

External person

Hongshuo Li

  • Beijing Institute of Technology

External person

Huaipeng Wang

  • Tsinghua University

External person

Zheng Wang

  • University of California at Irvine

External person

Hsin Cheng Yao

  • University of California at Irvine
  • HTC Corporation

External person

Lei Zhang

  • Beijing Institute of Technology
  • Miami University

External person

Wei Deng

  • Tsinghua University

External person

Lingfeng Zhou

  • Beijing Institute of Technology

External person

Qiao Chen

  • WiO Technology Ltd., Co.
  • WiO Technologies Ltd. Co.
  • WiO Technology
  • Wuxi WiO Technologies Co., Ltd.
  • Wuxi WiO Technologies Co. Ltd
  • Wio Technologies Co. Ltd
  • Ltd.
  • Ltd.

External person

Hongwu Chen

  • SINOPEC
  • Tsinghua University
  • Imperial College London

External person

Jin Cheng

  • Wuxi WiO Technologies Co., Ltd.
  • Wio Technologies Co. Ltd

External person

Zhaohu Wu

  • Beijing Institute of Technology
  • Ltd.

External person

Sijia Jiang

  • Tsinghua University

External person

Xiao Liu

  • Beijing Institute of Technology

External person

Jian Gao

  • Beijing Institute of Technology

External person

Mingrui Zhou

  • Beijing Institute of Technology

External person

Fred Tzeng

  • University of California at Irvine

External person

Bin Liu

  • Beijing Institute of Technology

External person

Xiao Gong

  • National University of Singapore

External person

Zhihua Wang

  • Tsinghua University

External person

Pei Yuan Chiang

  • University of California at Irvine

External person

Zhenhong Chen

  • Beijing Institute of Technology
  • Beijing Institute of Radio Metrology & Measurement

External person

Peyman Nazari

  • University of California at Irvine

External person

Anrun Ren

  • Beijing Institute of Technology

External person

Wei Wang

  • Tsinghua University

External person

Haikun Jia

  • Tsinghua University

External person

Jingqi Zhang

  • Beijing Institute of Technology

External person

Zhong Shunan

  • Beijing Institute of Technology

External person

Qianwen Chen

  • Beijing Institute of Technology

External person

Chuanming Zhu

  • Tsinghua University

External person

Zhenwu Wang

  • Beijing Institute of Technology

External person

Hisashi Kino

  • Tohoku University

External person

Min Lin

  • Shanghai University

External person

Mingzhi Ma

  • Ltd.
  • Unisoc (Shanghai) Technology Company Ltd.

External person

Ziwei Zheng

  • Zhejiang Wanli University

External person

Teng Yu

  • Beijing Institute of Technology

External person

Yuping Gong

  • Logistical Engineering University China
  • Peoples Liberation Army Engineering University

External person

Zheng Song

  • Beijing Institute of Technology
  • Tsinghua University

External person

Xiangrong Huang

  • Tsinghua University

External person

Yulan Tian

  • Tsinghua University

External person

Si Qi Yu

  • Beijing Institute of Technology

External person

Huanyu He

  • Rensselaer Polytechnic Institute

External person

Dan Xie

  • Tsinghua University
  • University of Electronic Science and Technology of China

External person

Xiaofan Liu

  • Beijing Institute of Technology

External person

Chengbo Xue

  • Beijing Institute of Technology
  • BIT Chongqing Innovation Center
  • BIT Chongqing Institute of Microelectronics and Microsystems
  • Bit Chongqing Innovation Center

External person

Linfeng Li

  • Beijing Institute of Technology
  • CAS - Institute of Electronics

External person

Li Xiao

  • Beijing Institute of Technology

External person

Michael M. Green

  • University of California at Irvine

External person

Yi Xie

  • Beijing Institute of Technology

External person

Yinghang Wu

  • Beijing Institute of Technology

External person

Jiatong Wang

  • Beijing Institute of Technology

External person

Yigang Hao

  • Beijing Institute of Technology

External person

Li Shiwen

  • Beijing Institute of Technology

External person

Xuyan Chen

  • Beijing Institute of Technology

External person

Takafumi Fukushima

  • Tohoku University

External person

Gao Peng

  • Beijing Institute of Technology

External person

Yunrui Zhao

  • Beijing Institute of Technology

External person

Jian Wang

  • Beijing Institute of Control and Electronics Technology

External person

Qu Ruoyuan

  • Beijing Institute of Technology

External person

Chenggang Li

  • Tsinghua University

External person

Weibo Zhang

  • North China Electric Power University

External person

Siteng Li

  • Beijing Institute of Technology

External person

Yutian Li

  • Beijing Institute of Technology

External person

Hanyu Zhao

  • Beijing Institute of Technology

External person

Jinling Ding

  • Wio Technologies Co. Ltd
  • Wuxi WiO Technologies Co., Ltd.
  • Ltd.
  • Ltd.
  • WiO Technology Ltd., Co.

External person

Wei Gao

  • Beijing Institute of Technology

External person

Jianxun Yang

  • Beijing Institute of Technology

External person

Weijing Wang

  • Beijing Institute of Technology

External person

Qiang An

  • Beijing Institute of Technology

External person

Hanxiao Yu

  • Beijing Institute of Technology
  • CAS - Institute of Computing Technology

External person

Ying Wu

  • National University of Singapore

External person

Yige Gao

  • Beijing Institute of Technology

External person

Chenxuan Fan

  • Beijing Institute of Technology

External person

Rui Wu

  • CAS - Aerospace Information Research Institute

External person

Tetsu Tanaka

  • Tohoku University

External person

Fei Ding

  • University of Southern Denmark

External person

Jiawen Luo

  • Beijing Institute of Technology

External person

Jian Qiang Lu

  • Rensselaer Polytechnic Institute

External person