Zhiduo Liu

Calculated based on number of publications stored in Pure and citations from Scopus
20142024

Research activity per year

Network

Gang Wang

  • Ningbo University
  • CAS - Shanghai Institute of Microsystem and Information Technology
  • Lanzhou University
  • Nantong University
  • School of Chemical and Biomedical Engineering, Nanyang Technological University

External person

Da Chen

  • Ningbo University
  • Nanyang Technological University
  • CAS - Shanghai Institute of Microsystem and Information Technology
  • Lanzhou University

External person

Siwei Yang

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences
  • China West Normal University

External person

Qinglei Guo

  • Shandong University
  • Fudan University
  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Illinois at Urbana-Champaign

External person

Guqiao Ding

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences
  • Ningbo University

External person

Cheng Te Lin

  • CAS - Ningbo Institute of Material Technology and Engineering
  • University of Chinese Academy of Sciences
  • Dalian University of Technology

External person

Nan Jiang

  • CAS - Ningbo Institute of Material Technology and Engineering
  • University of Chinese Academy of Sciences
  • Dalian University of Technology

External person

Xiaoqiang Feng

  • Ningbo University

External person

Menghan Zhao

  • Ningbo University

External person

Wei Zhu

  • Ningbo University

External person

Jinhong Yu

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering
  • Dalian University of Technology

External person

Weihua Pei

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences
  • Chinese Academy of Sciences

External person

Anli Xu

  • Ningbo University
  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

External person

Wen Dai

  • Chinese Academy of Sciences
  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Hongda Chen

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences
  • Chinese Academy of Sciences

External person

Jiurong Li

  • Ningbo University

External person

Zhengyi He

  • Ningbo University

External person

Guanglin Zhang

  • Ningbo University

External person

Yijun Wang

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences
  • Chinese Institute for Brain Research
  • Chinese Academy of Sciences

External person

Shan Zhang

  • Ningbo University

External person

Li Zheng

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

External person

Xiaohu Zheng

  • Beijing Academy of Quantum Information Sciences
  • Peking University
  • CAS - Shanghai Institute of Microsystem and Information Technology
  • Beijing Academy of Quantum Information Sciences
  • Lanzhou University

External person

Shiwei Tang

  • Ningbo University

External person

Caichao Ye

  • Southern University of Science and Technology

External person

Bingli Gu

  • Ningbo University

External person

Zihao Wang

  • Ningbo University

External person

Yuming Wu

  • University of Queensland
  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering
  • Shanghai University

External person

Bingkun Wang

  • Ningbo University

External person

Huijuan Wu

  • Ningbo University

External person

Hongyan Sun

  • Shenzhen Institute of Advanced Technology
  • Hunan University
  • CAS - Ningbo Institute of Material Technology and Engineering
  • University of Chinese Academy of Sciences

External person

Bo Gao

  • Ningbo University

External person

Peng He

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

External person

Yongsheng Yang

  • Ningbo University

External person

Dan Dai

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Yong Cao

  • CAS - Ningbo Institute of Material Technology and Engineering
  • North University of China

External person

Chunrong Wei

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

External person

Genwang Wei

  • Southern University of Science and Technology

External person

Yamin Li

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Zhongying Xue

  • CAS - Shanghai Institute of Microsystem and Information Technology

External person

Xiao Xing

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences
  • Chinese Academy of Sciences

External person

Zhiwen Jin

  • Lanzhou University

External person

Yongqiang Wang

  • Los Alamos National Laboratory Materials Science and Technology Division

External person

Lingyan Yu

  • Ningbo University

External person

Chaoyang Li

  • Kochi University of Technology

External person

Xurui Hu

  • Ningbo University

External person

Mengjie Wang

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Yun Zhao

  • Ningbo University

External person

Ting Wang

  • Ningbo University

External person

Dianyu Shen

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Kunming University of Science and Technology

External person

Kazuhito Nishimura

  • Kogakuin University

External person

Miao Yuan

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Shiyu Du

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Nan Zhang

  • Ningbo University

External person

Jinqiu Zhang

  • Ningbo University

External person

Bo Wang

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Dalian University of Technology

External person

Fakhr E. Alam

  • CAS - Ningbo Institute of Material Technology and Engineering
  • University of Wah

External person

Guoxin Chen

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Dalian University of Technology

External person

Xiaoting Wu

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Shanxi Normal University

External person

Ting Wang

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Xiaowei Yang

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

External person

Shanshui Lian

  • Ningbo University

External person

Chen Ye

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Zhiqiang Dou

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Zhiheng Wei

  • Ningbo University

External person

Jilei Lyu

  • Dalian University of Technology
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Qiang Gui

  • CAS - Institute of Semiconductors
  • Chinese Academy of Sciences
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

External person

Qingwei Yan

  • Hunan University
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Yapeng Chen

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Jun Tang

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Paul K. Chu

  • City University of Hong Kong
  • Peking University

External person

Fei Wang

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

External person

Zengfeng Di

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • Lanzhou University

External person

Li Fu

  • Swinburne University of Technology
  • CAS - Ningbo Institute of Material Technology and Engineering
  • Hangzhou Dianzi University

External person

Ding Chen

  • Hunan University

External person

Gege Ming

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Xinfeng Wu

  • Shanghai Maritime University

External person

Yang Wang

  • CAS - Institute of Semiconductors
  • University of Science and Technology of China

External person

Jinrui Gong

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Kunming University of Science and Technology

External person

Ziwen Wang

  • Tianjin University

External person

Qihuang Deng

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Yangtze Normal University

External person

Zhongyu Liu

  • CAS - Shanghai Institute of Microsystem and Information Technology

External person

Hongze Zhao

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Hua Bai

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Jipeng Li

  • Shanghai Jiao Tong University

External person

Kuan W.A. Chee

  • The University of Nottingham Ningbo China

External person

Zhongwei Wang

  • Shandong University of Science and Technology

External person

Pengcheng Xiang

  • Ningbo University

External person

Tao Huang

  • Beijing Institute of Technology
  • CAS - Shanghai Institute of Microsystem and Information Technology

External person

Li Zheng

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Jong Min Lee

  • School of Chemical and Biomedical Engineering, Nanyang Technological University

External person

Yuanyuan Liu

  • University of Chinese Academy of Sciences
  • CAS - Institute of Semiconductors
  • Engineering Research Center for Semiconductor Integrated Technology

External person

Weidong Tao

  • Ningbo University

External person

Kai Ye

  • CAS - Ningbo Institute of Material Technology and Engineering
  • The University of Nottingham Ningbo China

External person

Xinhong Cheng

  • CAS - Shanghai Institute of Microsystem and Information Technology

External person

Pei Zhao

  • Zhejiang University

External person

Zhaolin Zhan

  • Kunming University of Science and Technology

External person

Xinming Li

  • Chinese University of Hong Kong
  • National Center for Nanoscience and Technology

External person

Qingtang Shi

  • The University of Nottingham Ningbo China

External person

Chin Yin Chen

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Haoyang Gou

  • University of Chinese Academy of Sciences

External person

Jiarong Mao

  • Nantong University

External person

Yu Chang

  • Shenzhen Institute of Advanced Technology

External person

Wen Zhou

  • CAS - Shanghai Institute of Microsystem and Information Technology

External person

Minjie Liang

  • North University of China

External person

Jinli Zhu

  • Nantong University

External person

Xiaoshan Huang

  • Neuracle Technology company

External person

Tongyan Ren

  • North Sichuan Medical College

External person

Xing Sheng

  • Tsinghua University

External person

Jie Zhang

  • Chengdu Medical College

External person

Haitao Yang

  • Tianjin University
  • ShanghaiTech University

External person

Dali Cheng

  • Tsinghua University

External person

Qing Huang

  • National Institute for Materials Science Tsukuba
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Xinyong Han

  • CAS - Institute of Automation

External person

Jian Xu

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Hairong Li

  • Lanzhou University

External person

Xinyan Ni

  • ShanghaiTech University

External person

Zhenyu Zhang

  • Dalian University of Technology

External person

Bei Wang

  • Ningbo University

External person

Tongming Sun

  • Nantong University

External person

Qingyu Sun

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Tao Wu

  • Kunming University of Science and Technology
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Xuesong Li

  • University of Electronic Science and Technology of China

External person

Yi Wang

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Wenjia Zhou

  • ShanghaiTech University

External person

Wei Guo

  • Ningbo University

External person

Hongqing Tu

  • ShanghaiTech University

External person

Xin Jin

  • Shenzhen Institute of Advanced Technology

External person

Fei Ye

  • University of Science and Technology of China
  • Dalian University of Technology

External person

Xin Ning

  • CAS - Institute of Semiconductors

External person

Shuai Yan

  • China West Normal University

External person

Xianzhe Wei

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Shulin Song

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Junfeng Cui

  • Dalian University of Technology

External person

Ying Fang

  • National Center for Nanoscience and Technology
  • Chinese Academy of Sciences

External person

Junjie Wang

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Lijun Yang

  • China West Normal University

External person

Wubo Chu

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Xiubing Li

  • CAS - Shanghai Institute of Microsystem and Information Technology

External person

Jin Zhang

  • Nanchang University

External person

Ji Hu

  • ShanghaiTech University

External person

Chen Xue

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Zhao lin Yao

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Shanshan Zhao

  • TianJin University of Technology and Education

External person

Junfeng Ying

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Wen Z. Yang

  • ShanghaiTech University

External person

Qian Zhou

  • University of Chinese Academy of Sciences
  • ShanghaiTech University
  • Chinese Academy of Sciences

External person

Hui Dong

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

External person

Cuicui Gao

  • University of Chinese Academy of Sciences
  • ShanghaiTech University
  • Chinese Academy of Sciences

External person

Baoting Chen

  • University of Chinese Academy of Sciences
  • ShanghaiTech University
  • Chinese Academy of Sciences

External person

Longnian Lin

  • East China Normal University

External person

Yuguang Wang

  • Peking University

External person

Le Lv

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Xiao Hou

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Sikai Wang

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

External person

Yijun Wang

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Institute for Brain Research

External person

Tingrui Pan

  • University of California at Davis

External person

Qilong Yuan

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Zhijun Ning

  • ShanghaiTech University

External person

Xue Tan

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Zhongbin Pan

  • Ningbo University

External person

Yanfeng Tang

  • Nantong University

External person

Xiamen Li

  • Ningbo University

External person

Shuiping Huang

  • Ningbo University

External person

Jie Sun

  • Shenzhen University School of Basic Medical Sciences

External person

Chenshu Hu

  • Jiangsu University of Science and Technology

External person

Zhao Hui Yao

  • Tsinghua University
  • University of Chinese Academy of Sciences

External person

Gang Zhao

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Yuan Deng

  • Shanghai Jiao Tong University

External person

Aimin Yu

  • Swinburne University of Technology

External person

Qiwei Shen

  • Fudan University

External person

Ning Pan

  • University of California at Davis

External person

Hang Wang

  • Ningbo University

External person

Gongjin Li

  • Fudan University

External person

Lihua Xing

  • Beijing bioblue sensor company

External person

Yajie Zou

  • Ningbo University

External person

Wenjun Bai

  • Southern University of Science and Technology

External person

Chao Yan

  • Jiangsu University of Science and Technology

External person

He Li

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Lu Jiang

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Huan Zhang

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Dongming Guo

  • Dalian University of Technology

External person

Rong Sun

  • Shenzhen Institute of Advanced Technology

External person

Li Li

  • National Center for Nanoscience and Technology
  • University of Chinese Academy of Sciences

External person

Shiming Dong

  • CAS - Center for Excellence in Molecular Cell Science
  • University of Chinese Academy of Sciences

External person

Ka Deng

  • Shenzhen Institute of Advanced Technology

External person

Changhao Liu

  • ShanghaiTech University

External person

Kaimin Xu

  • ShanghaiTech University

External person

Rong Hua

  • Fudan University

External person

Yucheng Yang

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

External person

Pingping Wu

  • University of Chinese Academy of Sciences
  • CAS - Technical Institute of Physics and Chemistry

External person

Xiaoli Xiong

  • Sichuan Normal University

External person

Yuanli Liu

  • Guilin University of Technology

External person

Hongze Zhao

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

External person

Weida Hu

  • CAS - Shanghai Institute of Technical Physics

External person

Xueshan Xiao

  • Shanghai University

External person

Ya Li

  • Ningbo University

External person

Xurui Mao

  • CAS - Institute of Semiconductors

External person

Minhua Huang

  • Zhejiang University

External person

Yingze Song

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Southwest University of Science and Technology

External person

Xin Fu

  • University of Chinese Academy of Sciences
  • ShanghaiTech University
  • Chinese Academy of Sciences

External person

Changxing Wang

  • Ningbo University

External person

Yangguang Zhu

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Weijun Li

  • CAS - Institute of Semiconductors

External person

Qiyuan Yao

  • Fudan University

External person

Liye Zhang

  • ShanghaiTech University

External person

Fang Liao

  • China West Normal University

External person

Huijuan Wu

  • Peking University

External person

Wei L. Shen

  • ShanghaiTech University

External person

Yuehui Yu

  • CAS - Shanghai Institute of Microsystem and Information Technology

External person

Jian Bin Xu

  • Chinese University of Hong Kong
  • Nanjing University

External person

Xinming Li

  • National Center for Nanoscience and Technology
  • Chinese University of Hong Kong
  • South China Normal University

External person

Guichen Song

  • Ningbo University
  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Jing Kong

  • Massachusetts Institute of Technology
  • Massachusetts Institute of Technology

External person

Xuhong Guo

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Feng Xie

  • Ningbo University

External person

Yifan Li

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Wei Li

  • Ningbo University

External person

Miao Wang

  • Nantong University

External person

Zhongyi Duan

  • Beijing Institute of Technology
  • Southwest Jiaotong University

External person

Hongbin Sun

  • ShanghaiTech University

External person

Qigong Sun

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Yuejin Zhu

  • Ningbo University

External person

Sudong Wu

  • Southern University of Science and Technology

External person

Xingming Wang

  • Southwest University of Science and Technology

External person

Jichun Ye

  • CAS - Ningbo Institute of Material Technology and Engineering

External person

Jia Wang

  • Ningbo University

External person

Ye Hua Jiang

  • Kunming University of Science and Technology

External person

Jianhui Xu

  • Chengdu Medical College

External person

Wei Yang

  • Zhejiang University

External person

Man Luo

  • CAS - Shanghai Institute of Technical Physics

External person

Yongqiang Li

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

External person

Kai Jiang

  • General Hospital of People's Liberation Army

External person

Li Zhou

  • Guilin University of Technology

External person

Zhihui Xie

  • China West Normal University

External person

Yugui Zhang

  • CAS - Institute of Semiconductors

External person

Ruru Chen

  • Brain Machine Fusion Intelligence Institute

External person