刘 智多

根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
20142024

每年的科研成果

网络

Wang Gang

  • Ningbo University
  • CAS - Shanghai Institute of Microsystem and Information Technology
  • Lanzhou University
  • Nantong University
  • School of Chemical and Biomedical Engineering, Nanyang Technological University

外部人员

Chen Da

  • Ningbo University
  • Nanyang Technological University
  • CAS - Shanghai Institute of Microsystem and Information Technology
  • Lanzhou University

外部人员

Yang Siwei

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences
  • China West Normal University

外部人员

Guo Qinglei

  • Shandong University
  • Fudan University
  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Illinois at Urbana-Champaign

外部人员

Ding Guqiao

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences
  • Ningbo University

外部人员

Lin Cheng Te

  • CAS - Ningbo Institute of Material Technology and Engineering
  • University of Chinese Academy of Sciences
  • Dalian University of Technology

外部人员

Jiang Nan

  • CAS - Ningbo Institute of Material Technology and Engineering
  • University of Chinese Academy of Sciences
  • Dalian University of Technology

外部人员

Feng Xiaoqiang

  • Ningbo University

外部人员

Zhao Menghan

  • Ningbo University

外部人员

Zhu Wei

  • Ningbo University

外部人员

Yu Jinhong

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering
  • Dalian University of Technology

外部人员

Pei Weihua

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences
  • Chinese Academy of Sciences

外部人员

Xu Anli

  • Ningbo University
  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

外部人员

Dai Wen

  • Chinese Academy of Sciences
  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Chen Hongda

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences
  • Chinese Academy of Sciences

外部人员

Li Jiurong

  • Ningbo University

外部人员

He Zhengyi

  • Ningbo University

外部人员

Zhang Guanglin

  • Ningbo University

外部人员

Wang Yijun

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences
  • Chinese Institute for Brain Research
  • Chinese Academy of Sciences

外部人员

Zhang Shan

  • Ningbo University

外部人员

Zheng Li

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

外部人员

Zheng Xiaohu

  • Beijing Academy of Quantum Information Sciences
  • Peking University
  • CAS - Shanghai Institute of Microsystem and Information Technology
  • Beijing Academy of Quantum Information Sciences
  • Lanzhou University

外部人员

Tang Shiwei

  • Ningbo University

外部人员

Ye Caichao

  • Southern University of Science and Technology

外部人员

Gu Bingli

  • Ningbo University

外部人员

Wang Zihao

  • Ningbo University

外部人员

Wu Yuming

  • University of Queensland
  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering
  • Shanghai University

外部人员

Wang Bingkun

  • Ningbo University

外部人员

Wu Huijuan

  • Ningbo University

外部人员

Sun Hongyan

  • Shenzhen Institute of Advanced Technology
  • Hunan University
  • CAS - Ningbo Institute of Material Technology and Engineering
  • University of Chinese Academy of Sciences

外部人员

Gao Bo

  • Ningbo University

外部人员

He Peng

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

外部人员

Yang Yongsheng

  • Ningbo University

外部人员

Dai Dan

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Cao Yong

  • CAS - Ningbo Institute of Material Technology and Engineering
  • North University of China

外部人员

Wei Chunrong

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

外部人员

Wei Genwang

  • Southern University of Science and Technology

外部人员

Li Yamin

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Xue Zhongying

  • CAS - Shanghai Institute of Microsystem and Information Technology

外部人员

Xing Xiao

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences
  • Chinese Academy of Sciences

外部人员

Jin Zhiwen

  • Lanzhou University

外部人员

Wang Yongqiang

  • Los Alamos National Laboratory Materials Science and Technology Division

外部人员

Yu Lingyan

  • Ningbo University

外部人员

Li Chaoyang

  • Kochi University of Technology

外部人员

Hu Xurui

  • Ningbo University

外部人员

Wang Mengjie

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Zhao Yun

  • Ningbo University

外部人员

Wang Ting

  • Ningbo University

外部人员

Shen Dianyu

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Kunming University of Science and Technology

外部人员

Nishimura Kazuhito

  • Kogakuin University

外部人员

Yuan Miao

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Du Shiyu

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Zhang Nan

  • Ningbo University

外部人员

Zhang Jinqiu

  • Ningbo University

外部人员

Wang Bo

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Dalian University of Technology

外部人员

Alam Fakhr E.

  • CAS - Ningbo Institute of Material Technology and Engineering
  • University of Wah

外部人员

Chen Guoxin

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Dalian University of Technology

外部人员

Wu Xiaoting

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Shanxi Normal University

外部人员

Wang Ting

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Yang Xiaowei

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

外部人员

Lian Shanshui

  • Ningbo University

外部人员

Ye Chen

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Dou Zhiqiang

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Wei Zhiheng

  • Ningbo University

外部人员

Lyu Jilei

  • Dalian University of Technology
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Gui Qiang

  • CAS - Institute of Semiconductors
  • Chinese Academy of Sciences
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

外部人员

Yan Qingwei

  • Hunan University
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Chen Yapeng

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Tang Jun

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Chu Paul K.

  • City University of Hong Kong
  • Peking University

外部人员

Wang Fei

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

外部人员

Di Zengfeng

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • Lanzhou University

外部人员

Fu Li

  • Swinburne University of Technology
  • CAS - Ningbo Institute of Material Technology and Engineering
  • Hangzhou Dianzi University

外部人员

Chen Ding

  • Hunan University

外部人员

Ming Gege

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Wu Xinfeng

  • Shanghai Maritime University

外部人员

Wang Yang

  • CAS - Institute of Semiconductors
  • University of Science and Technology of China

外部人员

Gong Jinrui

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Kunming University of Science and Technology

外部人员

Wang Ziwen

  • Tianjin University

外部人员

Deng Qihuang

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Yangtze Normal University

外部人员

Liu Zhongyu

  • CAS - Shanghai Institute of Microsystem and Information Technology

外部人员

Zhao Hongze

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Bai Hua

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Li Jipeng

  • Shanghai Jiao Tong University

外部人员

Chee Kuan W.A.

  • The University of Nottingham Ningbo China

外部人员

Wang Zhongwei

  • Shandong University of Science and Technology

外部人员

Xiang Pengcheng

  • Ningbo University

外部人员

Huang Tao

  • Beijing Institute of Technology
  • CAS - Shanghai Institute of Microsystem and Information Technology

外部人员

Zheng Li

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Lee Jong Min

  • School of Chemical and Biomedical Engineering, Nanyang Technological University

外部人员

Liu Yuanyuan

  • University of Chinese Academy of Sciences
  • CAS - Institute of Semiconductors
  • Engineering Research Center for Semiconductor Integrated Technology

外部人员

Tao Weidong

  • Ningbo University

外部人员

Ye Kai

  • CAS - Ningbo Institute of Material Technology and Engineering
  • The University of Nottingham Ningbo China

外部人员

Cheng Xinhong

  • CAS - Shanghai Institute of Microsystem and Information Technology

外部人员

Zhao Pei

  • Zhejiang University

外部人员

Zhan Zhaolin

  • Kunming University of Science and Technology

外部人员

Li Xinming

  • Chinese University of Hong Kong
  • National Center for Nanoscience and Technology

外部人员

Shi Qingtang

  • The University of Nottingham Ningbo China

外部人员

Chen Chin Yin

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Gou Haoyang

  • University of Chinese Academy of Sciences

外部人员

Mao Jiarong

  • Nantong University

外部人员

Chang Yu

  • Shenzhen Institute of Advanced Technology

外部人员

Zhou Wen

  • CAS - Shanghai Institute of Microsystem and Information Technology

外部人员

Liang Minjie

  • North University of China

外部人员

Zhu Jinli

  • Nantong University

外部人员

Huang Xiaoshan

  • Neuracle Technology company

外部人员

Ren Tongyan

  • North Sichuan Medical College

外部人员

Sheng Xing

  • Tsinghua University

外部人员

Zhang Jie

  • Chengdu Medical College

外部人员

Yang Haitao

  • Tianjin University
  • ShanghaiTech University

外部人员

Cheng Dali

  • Tsinghua University

外部人员

Huang Qing

  • National Institute for Materials Science Tsukuba
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Han Xinyong

  • CAS - Institute of Automation

外部人员

Xu Jian

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Li Hairong

  • Lanzhou University

外部人员

Ni Xinyan

  • ShanghaiTech University

外部人员

Zhang Zhenyu

  • Dalian University of Technology

外部人员

Wang Bei

  • Ningbo University

外部人员

Sun Tongming

  • Nantong University

外部人员

Sun Qingyu

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Wu Tao

  • Kunming University of Science and Technology
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Li Xuesong

  • University of Electronic Science and Technology of China

外部人员

Wang Yi

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Zhou Wenjia

  • ShanghaiTech University

外部人员

Guo Wei

  • Ningbo University

外部人员

Tu Hongqing

  • ShanghaiTech University

外部人员

Jin Xin

  • Shenzhen Institute of Advanced Technology

外部人员

Ye Fei

  • University of Science and Technology of China
  • Dalian University of Technology

外部人员

Ning Xin

  • CAS - Institute of Semiconductors

外部人员

Yan Shuai

  • China West Normal University

外部人员

Wei Xianzhe

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Song Shulin

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Cui Junfeng

  • Dalian University of Technology

外部人员

Fang Ying

  • National Center for Nanoscience and Technology
  • Chinese Academy of Sciences

外部人员

Wang Junjie

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Yang Lijun

  • China West Normal University

外部人员

Chu Wubo

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Li Xiubing

  • CAS - Shanghai Institute of Microsystem and Information Technology

外部人员

Zhang Jin

  • Nanchang University

外部人员

Hu Ji

  • ShanghaiTech University

外部人员

Xue Chen

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Yao Zhao lin

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Zhao Shanshan

  • TianJin University of Technology and Education

外部人员

Ying Junfeng

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Yang Wen Z.

  • ShanghaiTech University

外部人员

Zhou Qian

  • University of Chinese Academy of Sciences
  • ShanghaiTech University
  • Chinese Academy of Sciences

外部人员

Dong Hui

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

外部人员

Gao Cuicui

  • University of Chinese Academy of Sciences
  • ShanghaiTech University
  • Chinese Academy of Sciences

外部人员

Chen Baoting

  • University of Chinese Academy of Sciences
  • ShanghaiTech University
  • Chinese Academy of Sciences

外部人员

Lin Longnian

  • East China Normal University

外部人员

Wang Yuguang

  • Peking University

外部人员

Lv Le

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Hou Xiao

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Wang Sikai

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

外部人员

Wang Yijun

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Institute for Brain Research

外部人员

Pan Tingrui

  • University of California at Davis

外部人员

Yuan Qilong

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Ning Zhijun

  • ShanghaiTech University

外部人员

Tan Xue

  • University of Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Pan Zhongbin

  • Ningbo University

外部人员

Tang Yanfeng

  • Nantong University

外部人员

Li Xiamen

  • Ningbo University

外部人员

Huang Shuiping

  • Ningbo University

外部人员

Sun Jie

  • Shenzhen University School of Basic Medical Sciences

外部人员

Hu Chenshu

  • Jiangsu University of Science and Technology

外部人员

Yao Zhao Hui

  • Tsinghua University
  • University of Chinese Academy of Sciences

外部人员

Zhao Gang

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Deng Yuan

  • Shanghai Jiao Tong University

外部人员

Yu Aimin

  • Swinburne University of Technology

外部人员

Shen Qiwei

  • Fudan University

外部人员

Pan Ning

  • University of California at Davis

外部人员

Wang Hang

  • Ningbo University

外部人员

Li Gongjin

  • Fudan University

外部人员

Xing Lihua

  • Beijing bioblue sensor company

外部人员

Zou Yajie

  • Ningbo University

外部人员

Bai Wenjun

  • Southern University of Science and Technology

外部人员

Yan Chao

  • Jiangsu University of Science and Technology

外部人员

Li He

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Jiang Lu

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Zhang Huan

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Guo Dongming

  • Dalian University of Technology

外部人员

Sun Rong

  • Shenzhen Institute of Advanced Technology

外部人员

Li Li

  • National Center for Nanoscience and Technology
  • University of Chinese Academy of Sciences

外部人员

Dong Shiming

  • CAS - Center for Excellence in Molecular Cell Science
  • University of Chinese Academy of Sciences

外部人员

Deng Ka

  • Shenzhen Institute of Advanced Technology

外部人员

Liu Changhao

  • ShanghaiTech University

外部人员

Xu Kaimin

  • ShanghaiTech University

外部人员

Hua Rong

  • Fudan University

外部人员

Yang Yucheng

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

外部人员

Wu Pingping

  • University of Chinese Academy of Sciences
  • CAS - Technical Institute of Physics and Chemistry

外部人员

Xiong Xiaoli

  • Sichuan Normal University

外部人员

Liu Yuanli

  • Guilin University of Technology

外部人员

Zhao Hongze

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

外部人员

Hu Weida

  • CAS - Shanghai Institute of Technical Physics

外部人员

Xiao Xueshan

  • Shanghai University

外部人员

Li Ya

  • Ningbo University

外部人员

Mao Xurui

  • CAS - Institute of Semiconductors

外部人员

Huang Minhua

  • Zhejiang University

外部人员

Song Yingze

  • CAS - Ningbo Institute of Material Technology and Engineering
  • Southwest University of Science and Technology

外部人员

Fu Xin

  • University of Chinese Academy of Sciences
  • ShanghaiTech University
  • Chinese Academy of Sciences

外部人员

Wang Changxing

  • Ningbo University

外部人员

Zhu Yangguang

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Li Weijun

  • CAS - Institute of Semiconductors

外部人员

Yao Qiyuan

  • Fudan University

外部人员

Zhang Liye

  • ShanghaiTech University

外部人员

Liao Fang

  • China West Normal University

外部人员

Wu Huijuan

  • Peking University

外部人员

Shen Wei L.

  • ShanghaiTech University

外部人员

Yu Yuehui

  • CAS - Shanghai Institute of Microsystem and Information Technology

外部人员

Xu Jian Bin

  • Chinese University of Hong Kong
  • Nanjing University

外部人员

Li Xinming

  • National Center for Nanoscience and Technology
  • Chinese University of Hong Kong
  • South China Normal University

外部人员

Song Guichen

  • Ningbo University
  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Kong Jing

  • Massachusetts Institute of Technology
  • Massachusetts Institute of Technology

外部人员

Guo Xuhong

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Xie Feng

  • Ningbo University

外部人员

Li Yifan

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Li Wei

  • Ningbo University

外部人员

Wang Miao

  • Nantong University

外部人员

Duan Zhongyi

  • Beijing Institute of Technology
  • Southwest Jiaotong University

外部人员

Sun Hongbin

  • ShanghaiTech University

外部人员

Sun Qigong

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

外部人员

Zhu Yuejin

  • Ningbo University

外部人员

Wu Sudong

  • Southern University of Science and Technology

外部人员

Wang Xingming

  • Southwest University of Science and Technology

外部人员

Ye Jichun

  • CAS - Ningbo Institute of Material Technology and Engineering

外部人员

Wang Jia

  • Ningbo University

外部人员

Jiang Ye Hua

  • Kunming University of Science and Technology

外部人员

Xu Jianhui

  • Chengdu Medical College

外部人员

Yang Wei

  • Zhejiang University

外部人员

Luo Man

  • CAS - Shanghai Institute of Technical Physics

外部人员

Li Yongqiang

  • CAS - Shanghai Institute of Microsystem and Information Technology
  • University of Chinese Academy of Sciences

外部人员

Jiang Kai

  • General Hospital of People's Liberation Army

外部人员

Zhou Li

  • Guilin University of Technology

外部人员

Xie Zhihui

  • China West Normal University

外部人员

Zhang Yugui

  • CAS - Institute of Semiconductors

外部人员

Chen Ruru

  • Brain Machine Fusion Intelligence Institute

外部人员