Effect of nano α-Fe2O3 additions on physical and mechanical properties of Sn–1.0Ag–0.7Cu–xFe2O3 low Ag lead-free solders

Ping Chen, Xiuchen Zhao*, Yong Wang, Bing Zheng, Chengliang Liu, Siqi Chen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)

Abstract

In this study, the α-Fe2O3 nanoparticles were successfully fabricated by chemical method. Smelting technique has been used to prepare the Sn–1.0Ag–0.7Cu–xFe2O3 composite solders, while the weight percent of α-Fe2O3 in the solders ranged from 0 to 1 wt%. The influences of α-Fe2O3 nanoparticles on microstructure, melting temperature, microhardness, and coefficient of thermal expansion (CTE) of the composite solders and on mechanical properties of the composite solders joints were investigated. The results indicate that added α-Fe2O3 nanoparticles can remarkably improve the Vickers microhardness of the composite solders and decrease the CTE of composite solders, while the melting temperature of the composite solders have no obvious change, compared to the original Sn–1.0Ag–0.7Cu solder. The shear strength and tensile strength of the solder joints will be increased firstly and then decreased with the increasing of α-Fe2O3 in the composite solders. And the Sn–1.0Ag–0.7Cu–0.4Fe2O3 solder joint possesses the best shear strength and tensile strength.

Original languageEnglish
Pages (from-to)1507-1519
Number of pages13
JournalJournal of Materials Science: Materials in Electronics
Volume27
Issue number2
DOIs
Publication statusPublished - 1 Feb 2016

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