Defect Modeling During the SLM Process for Manufacturing Microwave Devices

Shuai Li*, Xiue Bao*, Giovanni Gugliandolo, Haoyun Yuan*, Jinkai Li, Linxiang Shao*, Minghe Du, Nicola Donato, Zlatica Marinkovic, Giovanni Crupi, Lili Fang*, Liming Si*, Houjun Sun*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper intends to address the issue of crack formation and other flaws during the selective laser melting (SLM) additive manufacturing process. To achieve this objective, image processing, 3D modeling, and deep-learning techniques are employed to generate a 3D defect model, while data statistics are utilized for enhancing and optimizing the entire additive manufacturing process, including adjusting manufacturing process parameters, optimizing strategies, reducing defects, and improving the yield rate of SLM. After training and adjustment, the crack recognition accuracy of the final model can reach 92.3%.

Original languageEnglish
Title of host publication2023 IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering, MetroXRAINE 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages412-416
Number of pages5
ISBN (Electronic)9798350300802
DOIs
Publication statusPublished - 2023
Event2nd Edition IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering, MetroXRAINE 2023 - Milano, Italy
Duration: 25 Oct 202327 Oct 2023

Publication series

Name2023 IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering, MetroXRAINE 2023 - Proceedings

Conference

Conference2nd Edition IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering, MetroXRAINE 2023
Country/TerritoryItaly
CityMilano
Period25/10/2327/10/23

Keywords

  • 3D printing
  • Additive manufacturing
  • deep learning
  • defect identification
  • three-dimensional reconstruction

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