TY - GEN
T1 - Defect Modeling During the SLM Process for Manufacturing Microwave Devices
AU - Li, Shuai
AU - Bao, Xiue
AU - Gugliandolo, Giovanni
AU - Yuan, Haoyun
AU - Li, Jinkai
AU - Shao, Linxiang
AU - Du, Minghe
AU - Donato, Nicola
AU - Marinkovic, Zlatica
AU - Crupi, Giovanni
AU - Fang, Lili
AU - Si, Liming
AU - Sun, Houjun
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper intends to address the issue of crack formation and other flaws during the selective laser melting (SLM) additive manufacturing process. To achieve this objective, image processing, 3D modeling, and deep-learning techniques are employed to generate a 3D defect model, while data statistics are utilized for enhancing and optimizing the entire additive manufacturing process, including adjusting manufacturing process parameters, optimizing strategies, reducing defects, and improving the yield rate of SLM. After training and adjustment, the crack recognition accuracy of the final model can reach 92.3%.
AB - This paper intends to address the issue of crack formation and other flaws during the selective laser melting (SLM) additive manufacturing process. To achieve this objective, image processing, 3D modeling, and deep-learning techniques are employed to generate a 3D defect model, while data statistics are utilized for enhancing and optimizing the entire additive manufacturing process, including adjusting manufacturing process parameters, optimizing strategies, reducing defects, and improving the yield rate of SLM. After training and adjustment, the crack recognition accuracy of the final model can reach 92.3%.
KW - 3D printing
KW - Additive manufacturing
KW - deep learning
KW - defect identification
KW - three-dimensional reconstruction
UR - http://www.scopus.com/inward/record.url?scp=85185821635&partnerID=8YFLogxK
U2 - 10.1109/MetroXRAINE58569.2023.10405715
DO - 10.1109/MetroXRAINE58569.2023.10405715
M3 - Conference contribution
AN - SCOPUS:85185821635
T3 - 2023 IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering, MetroXRAINE 2023 - Proceedings
SP - 412
EP - 416
BT - 2023 IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering, MetroXRAINE 2023 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2nd Edition IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering, MetroXRAINE 2023
Y2 - 25 October 2023 through 27 October 2023
ER -