Comprehensive and quantitative characterization and analysis method of 3D mask effect for lithography simulation

Enze Li, Yanqiu Li*, Yang Liu, Yiyu Sun, Pengzhi Wei

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

With the increasing requirement of lithographic resolution, the degradation of 3D mask effect on imaging cannot be ignored. The researches of its polarization properties and effect on imaging are of great significance to the development of imaging-based aberration measurement techniques and computational lithography. In this paper, a novel method for comprehensive and quantitative characterization of 3D mask effect is proposed. By comparing the far-field spectrum of Kirchhoff model and 3D mask model, the 3D mask effect is comprehensively and quantitatively characterized as the form of polarization aberration. Pupil-spectrum comprehensive analysis method and background glitch noise culling method are proposed to improve the systematicness and accuracy of 3D mask characterization. The simulation comprehensively analyzes the effect of mask line width and absorber thickness on all polarization properties of the 3D mask effect, showing that this method can provide a more comprehensive analysis of the 3D mask effect compared with the previous methods.

Original languageEnglish
Title of host publication10th International Symposium on Advanced Optical Manufacturing and Testing Technologies
Subtitle of host publicationAdvanced and Extreme Micro- Nano Manufacturing Technologies
EditorsXiong Li, Xuan-Ming Duan, Mingbo Pu, Changtao Wang, Song Hu, Xiangang Luo
PublisherSPIE
ISBN (Electronic)9781510650213
DOIs
Publication statusPublished - 2021
Event10th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced and Extreme Micro- Nano Manufacturing Technologies 2021 - Chengdu, China
Duration: 14 Jun 202117 Jun 2021

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume12073
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

Conference10th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced and Extreme Micro- Nano Manufacturing Technologies 2021
Country/TerritoryChina
CityChengdu
Period14/06/2117/06/21

Keywords

  • 3D mask effect
  • Computational lithography
  • Polarization aberration
  • Rigorous electromagnetic field simulation

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