Shear stress sensor in micro-channel

Zhao Hui Yao*, Qi Ming Ge, Ying Tao Ding, Peng Fei Hao

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

摘要

A shear stress sensor based on heat transfer principle has been developed in a micro channel A silicon wafer with micro channels and a pyrex glass with hot films have been bonded to form this sensor. The temperature coefficient of resistance is measured and over heat ratios with various input powers are determined. Square waves are superimposed on a constant bias current to determine the time constants under diversiform over heat ratios. Calibration has been conducted and shear stresses versus pressure difference have been tested.

源语言英语
页(从-至)713-716
页数4
期刊Chinese Journal of Sensors and Actuators
18
4
出版状态已出版 - 12月 2005
已对外发布

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引用此

Yao, Z. H., Ge, Q. M., Ding, Y. T., & Hao, P. F. (2005). Shear stress sensor in micro-channel. Chinese Journal of Sensors and Actuators, 18(4), 713-716.