摘要
A shear stress sensor based on heat transfer principle has been developed in a micro channel A silicon wafer with micro channels and a pyrex glass with hot films have been bonded to form this sensor. The temperature coefficient of resistance is measured and over heat ratios with various input powers are determined. Square waves are superimposed on a constant bias current to determine the time constants under diversiform over heat ratios. Calibration has been conducted and shear stresses versus pressure difference have been tested.
源语言 | 英语 |
---|---|
页(从-至) | 713-716 |
页数 | 4 |
期刊 | Chinese Journal of Sensors and Actuators |
卷 | 18 |
期 | 4 |
出版状态 | 已出版 - 12月 2005 |
已对外发布 | 是 |
指纹
探究 'Shear stress sensor in micro-channel' 的科研主题。它们共同构成独一无二的指纹。引用此
Yao, Z. H., Ge, Q. M., Ding, Y. T., & Hao, P. F. (2005). Shear stress sensor in micro-channel. Chinese Journal of Sensors and Actuators, 18(4), 713-716.