Optimizing Ni-rich intermetallic and mechanical properties at room and elevated temperatures for Al-Cu-Ni alloys by coupling travelling magnetic fields with sequential solidification

Lei Luo*, Zhongde Shan, Haoqin Yang, Yanqing Su, Liangshun Luo, Liang Wang, Jingjie Guo, Hengzhi Fu

*此作品的通讯作者

科研成果: 期刊稿件 › 文章 › 同行评审

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Material Science