Optimizing Ni-rich intermetallic and mechanical properties at room and elevated temperatures for Al-Cu-Ni alloys by coupling travelling magnetic fields with sequential solidification

Lei Luo*, Zhongde Shan, Haoqin Yang, Yanqing Su, Liangshun Luo, Liang Wang, Jingjie Guo, Hengzhi Fu

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

10 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Optimizing Ni-rich intermetallic and mechanical properties at room and elevated temperatures for Al-Cu-Ni alloys by coupling travelling magnetic fields with sequential solidification'. Together they form a unique fingerprint.

Material Science