Investigation of Structural, Chemical, and Electrical Properties of CdTe/Back Contact Interface by TEM and XPS

Jun feng Han*, V. Krishnakumar, H. J. Schimper, Li mei Cha, Cheng Liao

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

5 引用 (Scopus)

指纹

探究 'Investigation of Structural, Chemical, and Electrical Properties of CdTe/Back Contact Interface by TEM and XPS' 的科研主题。它们共同构成独一无二的指纹。

Material Science