A Thin Film Metallization Process Development for Silicon Nitride Ceramic Substrates in Power Electronics Packaging

Xin Chen, Donglin Zhang, Jiaqi Song, Tao Xu, Xin Tian, Xiuchen Zhao, Yongjun Huo*

*此作品的通讯作者

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

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Material Science