A low-cost spin-on-glass (SOG) liner deposited by vacuum-assisted spin coating technique for via-last ultra-high aspect ratio through-silicon vias
Xuyan Chen, Yingtao Ding, Ziyue Zhang, Lei Xiao, Han Wang, Zhiming Chen*
*此作品的通讯作者
科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审