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霍 永隽
材料学院
h-index
304
引用
11
H-指数
根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
2015
2024
每年的科研成果
概览
指纹图谱
合作网络
科研成果
(43)
相似学者
(1)
指纹图谱
深入其中 Yongjun Huo 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
分类
加权
按字母排序
Material Science
Silver
100%
Indium
64%
Solid Solution
62%
Solder Joint
46%
Alloying
28%
Film
26%
Density
24%
Shear Strength
23%
Mechanical Strength
22%
Intermetallics
21%
Silicon Nitride
20%
Diamond
16%
Oxide Compound
15%
Transmission Electron Microscopy
14%
Laminate
13%
Wettability
13%
Electronic Circuit
11%
Finite Element Method
11%
Scanning Electron Microscopy
11%
Ceramic Substrate
10%
Silicon
10%
Creep Resistance
10%
High-Resolution Transmission Electron Microscopy
8%
Thermal Expansion
8%
Thin Films
8%
Nucleation
8%
Electrical Resistivity
8%
Microelectronics
7%
Nanoparticle
7%
Electroplating
6%
Electrodeposition
6%
Aluminum
6%
Microstructural Evolution
6%
Wide Bandgap Semiconductor
6%
High Power Electronics
6%
Phase Field Model
6%
Microstructural Analysis
6%
Polymer Particle
6%
Solidification
6%
Liquid Metal
6%
Quantum Dot
6%
Semiconductor Doping
6%
Complementary Metal-Oxide-Semiconductor Device
6%
Oxide Surface
6%
Thermoelectrics
6%
Heterogeneous Material
6%
Thermal Property
6%
X-Ray Diffraction
6%
Chemical Vapor Deposition
5%
Ultimate Tensile Strength
5%
Engineering
Solid Solution
38%
Joints (Structural Components)
30%
Electronic Packaging
17%
High Power Electronics
16%
Interconnects
16%
Low-Temperature
15%
Diamond
15%
Liquid Phase
13%
Bonding Technology
13%
Alloying
13%
Transients
13%
Photonics
10%
Transmissions
10%
High Resolution
10%
Eutectics
10%
Melting Point
10%
Microstructure
9%
Finite Element Method
9%
Layer Structure
8%
Thermal Performance
8%
Room Temperature
8%
Copper Substrate
7%
Bonding Process
7%
Bonding Wire
7%
Energy Engineering
6%
Experimental Result
6%
Process Improvement
6%
Process Design
6%
Bragg Cell
6%
Conductive Adhesive
6%
Emitting Laser
6%
Size Effect
6%
Reliability Study
6%
Anisotropic
6%
Growth Mechanism
6%
Junction Temperature
6%
Superlattice
6%
External Cavity
6%
Situ Reduction
6%
Microstructure Evolution
6%
Surface Oxide
6%
Cavity Surface
6%
Thermoelectrics
6%
Nitride
6%
Annealing Effect
6%
Cooling Performance
6%
Enhancing Mechanism
6%
Nanoscale
6%
Based Solid Solution
6%
Thermal Gradient
6%
