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霍 永隽
材料学院
h-index
314
引用
11
H-指数
根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
2015
2025
每年的科研成果
概览
指纹图谱
合作网络
科研成果
(44)
相似学者
(2)
指纹图谱
深入其中 Yongjun Huo 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
分类
加权
按字母排序
Material Science
Alloying
27%
Aluminum
6%
Ceramic Substrate
10%
Chemical Vapor Deposition
5%
Complementary Metal-Oxide-Semiconductor Device
6%
Creep Resistance
9%
Density
24%
Diamond
15%
Electrical Resistivity
8%
Electrodeposition
6%
Electronic Circuit
11%
Electroplating
6%
Film
30%
Finite Element Method
11%
Heterogeneous Material
6%
High Power Electronics
6%
High-Resolution Transmission Electron Microscopy
8%
Indium
64%
Intermetallics
21%
Laminate
13%
Liquid Metal
6%
Magnetron Sputtering
6%
Mechanical Strength
22%
Microelectronics
7%
Microstructural Analysis
6%
Microstructural Evolution
6%
Nanoparticle
14%
Nucleation
8%
Oxide Compound
21%
Oxide Surface
6%
Phase Field Model
6%
Polymer Particle
6%
Quantum Dot
6%
Scanning Electron Microscopy
10%
Semiconductor Doping
6%
Shear Strength
22%
Silicon
10%
Silicon Nitride
19%
Silver
100%
Solder Joint
45%
Solid Solution
61%
Solidification
6%
Thermal Expansion
8%
Thermal Property
6%
Thermoelectrics
6%
Thin Films
8%
Transmission Electron Microscopy
13%
Wettability
13%
Wide Bandgap Semiconductor
6%
X-Ray Diffraction
5%
Engineering
Alloying
13%
Anisotropic
6%
Annealing Effect
6%
Based Solid Solution
6%
Bonding Process
7%
Bonding Technology
14%
Bonding Wire
7%
Bragg Cell
6%
Cavity Surface
6%
Conductive Adhesive
6%
Cooling Performance
6%
Copper Substrate
7%
Diamond
15%
Electronic Packaging
17%
Emitting Laser
6%
Energy Engineering
6%
Enhancing Mechanism
6%
Eutectics
9%
Experimental Result
6%
External Cavity
6%
Finite Element Method
8%
Growth Mechanism
7%
High Power Electronics
16%
High Resolution
10%
Interconnects
17%
Joints (Structural Components)
29%
Junction Temperature
6%
Layer Structure
8%
Liquid Phase
13%
Low-Temperature
22%
Melting Point
9%
Microstructure
9%
Microstructure Evolution
6%
Nanoparticle
7%
Nanoscale
6%
Nitride
6%
Photonics
10%
Process Design
6%
Process Improvement
6%
Reliability Study
6%
Room Temperature
7%
Situ Reduction
9%
Size Effect
6%
Solid Solution
37%
Superlattice
6%
Surface Oxide
6%
Thermal Performance
8%
Thermoelectrics
6%
Transients
13%
Transmissions
10%
