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赵 修臣
材料学院
h-index
2268
引用
28
H-指数
根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
2004
2024
每年的科研成果
概览
指纹图谱
合作网络
科研成果
(152)
相似学者
(15)
指纹图谱
深入其中 Xiuchen Zhao 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
分类
加权
按字母排序
Material Science
Intermetallics
100%
Nanoparticle
91%
Solder Joint
81%
Cobalt
61%
Density
39%
Wettability
38%
Shear Strength
37%
Silver
37%
Powder
34%
Alloying
25%
Film
23%
Scanning Electron Microscopy
22%
Mechanical Strength
19%
Solid Solution
18%
Lithium Ion Battery
17%
Martensite
17%
Annealing
16%
Ultimate Tensile Strength
16%
Transmission Electron Microscopy
16%
X-Ray Diffraction
16%
Nanosphere
16%
High Entropy Alloys
16%
Heat Treatment
16%
Indium
16%
Dielectric Material
16%
Nanocomposite
15%
Creep Resistance
15%
Nucleation
14%
Grain Size
14%
Lead-Free Solder
13%
Oxide Compound
13%
Amorphous Material
13%
Finite Element Method
12%
Reduced Graphene Oxide
12%
Lithium
12%
Titanium Alloys
12%
Thin Films
12%
Silicon Nitride
12%
Nanocrystalline Material
12%
Magnetic Property
11%
Electromigration
10%
Supercapacitors
10%
Homogenization
10%
Thermal Cycling
9%
Sintering
9%
Capacitance
9%
Thermal Expansion
9%
Activation Energy
9%
Nanosheet
9%
Electronic Circuit
9%
Engineering
Joints (Structural Components)
41%
Intermetallics
39%
Microstructure
24%
Solder Bump
20%
Reflection Loss
19%
Absorption Property
17%
Electronic Packaging
17%
Nanoparticle
15%
Melting Point
13%
Eutectics
11%
Transmissions
9%
Low-Temperature
8%
Shear Strength
8%
Liquid Phase
8%
Damping Capacity
8%
Reactive Material
8%
Compound Formation
8%
Bonding Technology
8%
High-Entropy Alloys
8%
Sol-Gel Process
8%
Crystallization Temperature
8%
Absorption Performance
8%
Microstructure Evolution
7%
Compound Layer
7%
Ignition
6%
Induced Stress
6%
Strain
6%
Electromigration
6%
Deformation Mechanism
6%
Interconnects
6%
Activation Energy
5%
Aging Time
5%
Nanoscale
5%
High Strain Rate
5%
Mean Time to Failure
5%
Annealing Temperature
5%
Fiber Texture
5%
Conductive Adhesive
5%
Ultimate Tensile Strength
5%
Creep Resistance
5%
