每年的科研成果
每年的科研成果
个人简介
个人简介
现任材料加工系党支部书记、电子封装技术专业责任教授、国防科技工业元器件封装技术创新中心专家委员会委员，先后获得北京市本科毕业论文优秀指导教师、北京理工大学优秀共产党员、三育人先进个人、优秀班主任等荣誉称号。主讲《电子制造工程导论》、《微连接原理》、《电子封装工艺》、《焊接工程基础》等本科生课程。先后主持并参与完成了科工局基础科研、国家科技支撑、总装预研、总装预研基金及航天创新基金等数十项科研工作，在国内外学术期刊发表SCI和EI论文百余篇，获批国家发明专利十余项，并获得中国产学研合作创新成果二等奖。
研究领域和方向
1.电子封装互连材料研究；
2.先进电子封装工艺与可靠性研究；
3.微纳材料制备及应用研究；
4.新型合金制备及性能研究。
2.先进电子封装工艺与可靠性研究；
3.微纳材料制备及应用研究；
4.新型合金制备及性能研究。
研究成果
[1]Electromagnetic wave absorption performance and electrochemical properties of multifunctional materials:Air@Co@Co3Sn2@SnO2 hollow sphere/reduced graphene oxide composites[J].CHEMICAL ENGINEERING JOURNAL,2021,420：130479
[2]A first-principles computation-driven mechanism study on the solders dilute doping effects to η’-Cu6Sn5 growth kinetics[J]. JOURNAL OF MATERIALS SCIENCE,2021,56:9741–9753
[3] Effects of endogenous Al and Zn phases on mechanical properties of Sn58Bi eutectic alloy[J]. MATERIALS CHARACTERIZATION,2021,175：111089
[4]Effects of minor alloying with Ge and In on the interfacial microstructure between Zn-Sn solder alloy and Cu substrate[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2020,831：154812
[5]Improvement of microstructure and tensile properties of Sn-Bi-Ag alloy by heterogeneous nucleation of beta-Sn on Ag3Sn[J]. MATERIALS SCIENCE AND ENGINEERING A,2020,785：139372
[6]Facile synthesis of RGO/Co@Fe@Cu hollow nanospheres with efficient broadband electromagnetic wave absorption[J].CHEMICAL ENGINEERING JOURNAL,2019,372:1-11
[7]Facile, Large-Scale, and Expeditious Synthesis of Hollow Co and Co@Fe Nanostructures: Application for Electromagnetic Wave Absorption[J]. JOURNAL OF PHYSICAL CHEMISTRY C,2017,121：8557-8568
[8]Vertically porous nickel thin film supported Mn3O4 for enhanced energy storage performance[J]. JOURNAL OF COLLOID AND INTERFACE SCIENCE,2016,483:17-25
[9]Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2015, 627：39-47
[10]电子软钎焊连接技术，译著，北京理工大学出版社，2021
[2]A first-principles computation-driven mechanism study on the solders dilute doping effects to η’-Cu6Sn5 growth kinetics[J]. JOURNAL OF MATERIALS SCIENCE,2021,56:9741–9753
[3] Effects of endogenous Al and Zn phases on mechanical properties of Sn58Bi eutectic alloy[J]. MATERIALS CHARACTERIZATION,2021,175：111089
[4]Effects of minor alloying with Ge and In on the interfacial microstructure between Zn-Sn solder alloy and Cu substrate[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2020,831：154812
[5]Improvement of microstructure and tensile properties of Sn-Bi-Ag alloy by heterogeneous nucleation of beta-Sn on Ag3Sn[J]. MATERIALS SCIENCE AND ENGINEERING A,2020,785：139372
[6]Facile synthesis of RGO/Co@Fe@Cu hollow nanospheres with efficient broadband electromagnetic wave absorption[J].CHEMICAL ENGINEERING JOURNAL,2019,372:1-11
[7]Facile, Large-Scale, and Expeditious Synthesis of Hollow Co and Co@Fe Nanostructures: Application for Electromagnetic Wave Absorption[J]. JOURNAL OF PHYSICAL CHEMISTRY C,2017,121：8557-8568
[8]Vertically porous nickel thin film supported Mn3O4 for enhanced energy storage performance[J]. JOURNAL OF COLLOID AND INTERFACE SCIENCE,2016,483:17-25
[9]Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2015, 627：39-47
[10]电子软钎焊连接技术，译著，北京理工大学出版社，2021
与联合国可持续发展目标相关的专业知识
2015 年，联合国成员国同意 17 项可持续发展目标 (SDG)，以消除贫困、保护地球并确保全人类的繁荣。此人的工作有助于实现下列可持续发展目标：
指纹图谱
深入其中 Xiuchen Zhao 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
- 1 相似简介
最近五年的合作关系和顶尖研究领域
最近的国家/地区级外部合作关系。点击圆点，以了解详细信息或
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A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging
Hu, S., Song, J., Liu, Y., Wu, C., Lei, T., Ge, A., Zhang, D., Zhao, X., Huo, Y. & Lee, C. C., 1 2月 2024, 在: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 2, 页码 328-341 14 页码科研成果: 期刊稿件 › 文章 › 同行评审
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A Low-Temperature Ag-Ag Direct Bonding Technology Towards Ten-Thousand-Level Microbumps Arrays Utilizing Plasma-Induced Grown Nanoparticles of Silver Oxide
Wang, T., Xie, X., Gu, S., Liu, S., Zhao, S., Gao, W., Lin, P., Xu, S., Qu, Z., Wang, Y., Zhao, X. & Huo, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024. Institute of Electrical and Electronics Engineers Inc., (2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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A Novel Layer Structural Design for Silver-indium Transient Liquid Phase Bonding Technology by Introducing a Diffusion Barrier
Zhang, D., Zhang, Y., Zhao, S., Song, J., Chen, X., Xu, T., Tian, X., Zhao, X. & Huo, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024. Institute of Electrical and Electronics Engineers Inc., (2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder
Zhao, X., Chang, J., Wu, X., Ye, Z. T., Chen, W. & Xie, X., 5月 2024, 在: Materials. 17, 10, 2233.科研成果: 期刊稿件 › 文章 › 同行评审
开放访问2 引用 （Scopus） -
Fabrication and characterization of Sn-57 wt.% Bi film by pulse DC current co-electrodeposition and reflow
Ye, Z. T., Zhao, X., Dong, Y., Wu, X., Dong, Z. T. & Huo, Y., 3月 2024, 在: Materials Today Communications. 38, 108155.科研成果: 期刊稿件 › 文章 › 同行评审
2 引用 （Scopus）