跳到主要导航
跳到搜索
跳到主要内容
北京理工大学 首页
English
中文
首页
师资队伍
研究单位
科研成果
奖项
按专业知识、名称或附属进行搜索
查看 Scopus 资料
任 慧
机电学院
h-index
1762
引用
21
H-指数
根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
2001
2024
每年的科研成果
概览
指纹图谱
合作网络
科研成果
(133)
相似学者
(45)
指纹图谱
深入其中 Hui Ren 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
分类
加权
按字母排序
Material Science
Aluminum
100%
Powder
67%
Scanning Electron Microscopy
48%
Differential Scanning Calorimetry
43%
X-Ray Diffraction
29%
Density
25%
Activation Energy
24%
Oxidation Reaction
22%
Carbon Nanotube
21%
Fourier Transform Infrared Spectroscopy
20%
Nanoparticle
20%
Thermal Stability
18%
Thermal Analysis
17%
HMX
16%
Explosive
14%
Microsphere
13%
Graphene Oxide
12%
Boron
12%
Reduced Graphene Oxide
12%
Nanocomposites
11%
Crystal Structure
11%
Oxide Compound
11%
Ultimate Tensile Strength
10%
Three Dimensional Printing
10%
Nitrogen Dioxide
10%
Titanium
10%
Thermal Conductivity
10%
Perovskite
10%
Graphene
10%
Thermogravimetric Analysis
10%
Thermal Property
9%
Potassium
8%
Aluminum Oxide
8%
Plasticizer
8%
X-Ray Photoelectron Spectroscopy
8%
Solid Propellant
7%
Smoke
7%
Catalysis
7%
Sol-Gel
7%
Oxide Film
6%
Nanocomposite
6%
Polyethylene Glycol
6%
Film Thickness
6%
Grain Size
6%
Self Assembly
6%
Polybutadiene
6%
Carbon Dioxide
6%
Energy-Dispersive X-Ray Spectroscopy
6%
Crystalline Material
5%
Silicon
5%
Engineering
Ignition
32%
Aluminum Powder
28%
Energetics
23%
Nanocomposite
16%
Burning Rate
16%
Peak Temperature
14%
Energy Engineering
12%
Size of Particle
12%
Carbon Nanotube
12%
Thermal Behavior
11%
Heat Release
11%
Binders
11%
Thermal Conductivity
10%
Activation Energy
10%
Energy Release
10%
Ball Milling
10%
Reduced Graphene Oxide
10%
Mass Ratio
9%
Low-Temperature
9%
Test Result
8%
Ignition Temperature
8%
Ray Diffraction
8%
Scanning Electron Microscope
7%
Combustion Property
7%
Electrostatics
7%
Aluminum Oxide
7%
Combustion
7%
Oxide Film
6%
Layer Structure
6%
Additive Manufacturing
6%
Main Body
6%
Graphene Oxide
6%
Mass Loss
6%
Nanoparticle
6%
Apparent Activation Energy
6%
Core-Shell
5%
Experimental Result
5%
Rocket Engine
5%
Microstructure
5%
3D Printing
5%
Ultimate Tensile Strength
5%
Decomposition Process
5%
Bonding Agent
5%
Porosity
5%
Ray Photoelectron Spectroscopy
5%
Fourier Transform
5%