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任 慧
机电学院
h-index
1759
引用
21
H-指数
根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
2001
2024
每年的科研成果
概览
指纹图谱
合作网络
科研成果
(133)
相似学者
(44)
指纹图谱
深入其中 Hui Ren 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
分类
加权
按字母排序
Material Science
Activation Energy
24%
Aluminum
100%
Aluminum Oxide
8%
Boron
12%
Carbon Dioxide
6%
Carbon Nanotube
21%
Catalysis
7%
Crystal Structure
11%
Crystalline Material
5%
Density
25%
Differential Scanning Calorimetry
43%
Energy-Dispersive X-Ray Spectroscopy
6%
Explosive
14%
Film Thickness
6%
Fourier Transform Infrared Spectroscopy
20%
Grain Size
6%
Graphene
10%
Graphene Oxide
12%
HMX
16%
Microsphere
13%
Nanocomposite
6%
Nanocomposites
11%
Nanoparticle
20%
Nitrogen Dioxide
10%
Oxidation Reaction
22%
Oxide Compound
11%
Oxide Film
6%
Perovskite
10%
Plasticizer
8%
Polybutadiene
6%
Polyethylene Glycol
6%
Potassium
8%
Powder
67%
Reduced Graphene Oxide
12%
Scanning Electron Microscopy
48%
Self Assembly
6%
Silicon
5%
Smoke
7%
Sol-Gel
7%
Solid Propellant
7%
Thermal Analysis
17%
Thermal Conductivity
10%
Thermal Property
9%
Thermal Stability
18%
Thermogravimetric Analysis
10%
Three Dimensional Printing
10%
Titanium
10%
Ultimate Tensile Strength
10%
X-Ray Diffraction
29%
X-Ray Photoelectron Spectroscopy
8%
Engineering
3D Printing
5%
Activation Energy
10%
Additive Manufacturing
6%
Aluminum Oxide
7%
Aluminum Powder
28%
Apparent Activation Energy
6%
Ball Milling
10%
Binders
11%
Bonding Agent
5%
Burning Rate
16%
Carbon Nanotube
12%
Combustion
7%
Combustion Property
7%
Core-Shell
5%
Decomposition Process
5%
Electrostatics
7%
Energetics
23%
Energy Engineering
12%
Energy Release
10%
Experimental Result
5%
Fourier Transform
5%
Graphene Oxide
6%
Heat Release
11%
Ignition
32%
Ignition Temperature
8%
Layer Structure
6%
Low-Temperature
9%
Main Body
6%
Mass Loss
6%
Mass Ratio
9%
Microstructure
5%
Nanocomposite
16%
Nanoparticle
6%
Oxide Film
6%
Peak Temperature
14%
Porosity
5%
Ray Diffraction
8%
Ray Photoelectron Spectroscopy
5%
Reduced Graphene Oxide
10%
Rocket Engine
5%
Scanning Electron Microscope
7%
Size of Particle
12%
Test Result
8%
Thermal Behavior
11%
Thermal Conductivity
10%
Ultimate Tensile Strength
5%
